JPH02215146A - Tab tape - Google Patents

Abstract

PURPOSE:To prevent a fact that an inspection is not correctly executed due to a positional deviation and to prevent an element to be inspected from being decided a defective through the element is a non-defective by a method wherein pads for position detection use are provided on a tape and a continuity between the pads is checked to perform the detection of the position of the element. CONSTITUTION:An inspecting device 13 checks a continuity between signal pins 14-1 and 14-2 prior to an actual inspection. When the signal pins 14-1 and 14-2 are placed on pads 2-1 and 2-2, a continuity between the signal pins 14-1 and 14-2 exists because the pads 2-1 and 2-2 are connected to each other on a tape 1. At this time, the device 13 judges that signal pins 15-1 to 15-16 are correctly positioned on pads 4-1 to 4-16 on the tape 1 and executes the actual inspection to a semiconductor element. Contrast to this, if there is no continuity between the pins 14-1 to 14-2, the device 13 judges that the pins 15-1 to 15-16 are not correctly positioned on the pads 4-1 to 4-16 and stops the inspection to generate an alarm.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a TAB tape for mounting semiconductor electroluminescent circuit elements, and particularly relates to the positional relationship with a testing device when testing the elements.

Conventional technology Conventionally, in TAB tape for mounting semiconductor elements,
As shown in Fig. 2, the pads on the TAB tape 5 include signal line pads that provide an electrical interface with the inspection equipment, and pads that indicate the attributes of the element after inspection (for example, for identifying defective products). It is common for the pad to have a hole (for example, a hole is made in the pad).

Problems to be Solved by the Invention In the conventional TAB tape described above, there is no information indicating the relative positional relationship between the inspection device and the TAB tape. There is no way to detect this. Therefore, if misalignment occurs, a normal interface cannot be maintained between the TAB tape and the electrodes of the inspection device, and even if the element on the TAB tape is good, it may be considered a defective product. Elements mounted on TAB tape are wound around a drum and inspected continuously and in large quantities as shown in Figure 3, so if a defect occurs due to misalignment, a large number of defective products will be generated. In addition, in inspection equipment, it is common to press the TAB tape from above to maintain contact between the pad and the electrode, as shown in Figure 3.
It is also difficult to visually confirm subtle positional deviations.

The present invention has been made in view of the above-mentioned conventional situation,
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a new TAB tape which makes it possible to overcome the above-mentioned drawbacks inherent in the prior art.

Differences between the invention and the prior art The conventional TAB tape described above does not have a function to detect positional deviation between the tape and the inspection device.
The TAB tape of the present invention is different in that it has a dedicated pad for detecting positional deviation.

Means for Solving the Problems In order to achieve the above object, the TAB tape according to the present invention has a pad for detecting relative positional deviation between inspection devices.

Embodiment Next, a preferred embodiment of the present invention will be specifically explained with reference to the drawings.

FIG. 1 is a diagram showing an embodiment of the present invention.

In FIG. 1, a semiconductor element 3 is mounted on a tape 1 and connected to pads 4-1 to 4-16.

The position detection pads 2-1 and 2-2 are connected on the tape 1 by a pattern 2-3. The pads 2-1 and 2-2 are made smaller than the pads 4-1 to 4-16.

FIG. 3 is a diagram showing how the semiconductor element 3 mounted on the tape 1 is inspected.

In FIG. 3, tape 1 is wound on reels 8-1 and 8-2 and guided by drums 9-1 and 9-2. Pads 2-1, 2-2 and 4-1 on tape 1.
4-16 interfaces with the testing device 13 by a signal bin (not shown) placed on the interface board 11, and a line 12 connects the interface board 11 and the testing device 13. Further, the tape 1 is held down by a holding jig 10 to maintain good contact between the signal bin and the pads 2-1, 2-2 and 4-1 to 4-16.

FIG. 4 is a top view of the signal bins set up on the interface board 11. Pads 2-12-2 and 4
- Signal bin 14-1.1 at the position corresponding to 4-16
4-2 and 15-1 to 15-16 are standing. Signal bin 14-1.14-2 corresponds to pad 2-1.2-2, signal bin 15-1 to 15-16 corresponds to pad 4-1-4-
Corresponds to 16.

An embodiment of the present invention having the above configuration will be described in more detail.

FIG. 5 is a flowchart showing the operation flow of the inspection device E13.

As shown in FIG. 5, the testing device 13 checks the continuity of the signal bins 14-1, 114-2f prior to actual testing.

If signal bin 14-1.14-2 is on pad 2-1.2-2, pads 2-1 and 2-2 are connected on tape 1, so signal bin 14-1 There is continuity between .14 and 2. At this time, the inspection device 13 judges that the signal bins 15-1 to 15-16 are exactly on the pads 4-1 to 4-16 on the tape 1, and performs the inspection on the actual semiconductor device 3. Signal bin 14-1
．． If there is no continuity between 14-2, signal bins 15-1 to 15
-16 is judged not to be accurately positioned on the pads 4-1 to 4-16, and the test is stopped and an alarm is generated. Note that the position detection pads 2-1 and 2-2 are the pads 4-1 to 4.
-16, so the signal bin 14-
1. Signal bin 1 despite continuity between 14-2
There is no possibility that pads 5-1 to 15-16 are not located on pads 4-1 to 4-16.

In this embodiment described above, the position was detected by checking the continuity between the pads 2-1 and 2-2, but as an alternative, a light emitting diode and a It is also possible to perform position detection by arranging an optical sensor.

As described in detail, according to the present invention, by providing a position detection pad on the TAB tape, it is possible to detect a positional shift between the TAB tape and the inspection device, so that the inspection can be performed correctly based on the positional shift. This has the effect that it is possible to prevent a situation where the test element is not carried out and the device to be tested is determined to be a defective product even though it is a good product.

Furthermore, when a defect occurs, it is possible to easily determine whether the cause of the defect is due to positional deviation or other factors.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an embodiment of the present invention, FIG. 2 is a schematic diagram showing the prior art, FIG. 3 is a diagram showing the state during inspection, and FIG. 4 is a diagram showing the arrangement of signal bins. FIG. 5 is a diagram showing the operation flow of the inspection device. 1.5...Tape, 2-1.2-2...Position detection pad, 2-3...Connection button, 3.7...Semiconductor element, 4-1 to 4-16.6 -1 to 6-16...Signal pad, 8-1.8-2...Reel, 9-1.9-2
. . . Drum, 10 . . . Pressure drum, 11 . . . Interface board, 12 . . . Line, 13 .
Signal bottle patent applicant NEC Corporation Representative Patent attorney Yutabe Kumagai Figure +5-15. +5-14. +5-13°, J5=6, ~15-7, -15-8 Fig.

Claims (1)

[Claims] A TAB tape for mounting a semiconductor element, and a pad for detecting relative positional deviation between the TAB tape and a testing device for testing the semiconductor element when testing the semiconductor element. TAB characterized by having
tape.