JPH0221619A - Etching equipment - Google Patents

Abstract

PURPOSE:To increase the strength of an electrode plate to sputtering, and improve the working life of the electrode plate, by providing the surface of a grounded power supply with a quartz plate. CONSTITUTION:A finished metal plate 13 as a unitary body is covered with a quartz plate 14 and a quartz frame 15, and fusion-bonded at several points of the outer periphery of the metal plate 13 temporarily. After that, a quartz pin 17 and the quartz plate 14 are fusion-bonded by heating at a heat fusion- bonding part 19, and a quartz seat 18 and the quartz pin 17 are fusion-bonded by heating at a heat fusion-bonding part 20, thereby integrating the metal plate 13 and the quartz plate 14 in a unitary body. Then the quartz plate 14 and the quartz frame 15 are normally fusion-bonded. The quartz plate 14 is finished in a necessary thickness, and the outer periphery and the upper surface of the quartz frame 15 are finished so as to form the same surface as the metal plate 13, thereby completing an electrode plate 12. By this setup, the strength of the electrode plate of a grounding electrode to sputtering is increased, and the working life of electrode plate can be lengthened.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an etching device in which a high frequency electrode and a ground electrode are provided facing each other in a vacuum container, and a high frequency is applied to the high frequency electrode. [Prior Art] Fig. 2 is a sectional view showing an example of a conventional etching device, and Fig. 3 is a sectional view of an electrode plate of the ground electrode shown in Fig. 2. In the figure, (1) is a vacuum vessel, (2) is a high frequency electrode that applies high frequency, (3) is a ground electrode that forms a parallel plate electrode with high frequency electrode (2), (4) is a high frequency power source, (5)
is a gas supply system that supplies etching reaction gas, (6
) is the vacuum evacuation system that produces a vacuum, (7) is the wafer to be etched, (8) is the electrode plate of the ground electrode (3), (9
) is a metal plate constituting the electrode plate (8), and (10) is an insulating film that protects the metal plate (9) with an alumina coating.

Next, reactions in the etching apparatus having the above configuration will be explained. In the parallel plate electrodes (2), f3) in vacuum, high frequency power is applied to one high frequency electrode (2), and a reaction gas is supplied between the picture electrodes (2) and (3) by the gas supply system (5). supply At this time, plasma is generated when the picture electrode (2L (3) is open), an ion sheath is formed on the surface of the high-frequency electrode (2), positive ions are accelerated by the ion acceleration voltage (self-bias), and the high-frequency electrode (2L (3)) is opened. ) on the wafer (7) to perform etching.In this case, an ion sheath is formed on the ground electrode (3) side in the same way as above, and positive ions are directed to the surface of the ground electrode (3). Due to the collision,
The surface of the ground electrode (3) is sputtered, ? be worn out.

For this reason, a removable electrode plate (8) is attached to the plasma side of the ground electrode (2) so that it can be replaced when worn out.
ffl I'm straining. The electrode plate (8) is covered with an insulating film (10) made of alumina coating, which has little effect even if it is scattered, in order to prevent the adverse effect on etching performance caused by metal particles scattered during sputtering.
When this insulating film (10) disappears, the electrode plate (8) needs to be replaced.

[Problem to be solved by the invention]

Since the electrode plate (8) of the conventional grounded ffl electrode (3) is constructed as described above, the alumina coating is a porous layer and has low mechanical strength, making it vulnerable to ion sputtering, and particularly susceptible to plasma density. High gas ejection hole (11)
Around the periphery the alumina coating is circular (diameter 0.
1, and this electrode plate (8) needs to be replaced more frequently.
There is a problem in that it causes a decrease in the operating rate of the etching equipment.

This invention was made in order to solve the problems described in fz, and aims to provide an etching apparatus that extends the life of the N-electrode plate and improves the operating rate.

[Means to solve the problem]

The etching apparatus according to the present invention has a quartz plate provided on the surface of a ground electrode.

[For production]

In this invention, by providing a quartz plate on the surface of the ground electrode, the strength of the electrode plate against sputtering is increased, and the life of the electrode plate is extended.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (13) is the electrode plate (
12), (14) is the 5-E plate which becomes the insulating film covering the surface of the metal plate (13), and (15) is the metal plate (1).
3) and the quartz plate (
12) and the stone wall frame to be made into an image, (17) is a metal plate (13
) and the quartz plate (14), a plurality of quartz bottles are installed through the metal plate (13), and (18) is the quartz bottle (17). The metal plate (13) and the quartz plate (14) are integrated by the action of the quartz bottle (17) and the quartz plate (18).

Next, the processing procedure for the electrode plate (12) will be explained.

First, m-body I1 - the shaved metal plate (13) is placed on the quartz plate (
14) and the 7i moxibustion frame (15), and temporarily fuse the outer periphery of the metal plate (13) at several points. After that, attach the 7i moxibustion frame (17).
and the 71 English plate (14) are heat-fused in the heat-fusion part (19), and the quartz plate (18) and the quartz bottle (17) are heat-fused in the heat-fusion part (20). (Thus, the metal plate (13) and the quartz plate (14) are imaged. Next, the quartz plate (14) and the stone moxibustion frame (15) are heated and fused together at the heat-fused portion (16).
Final fusion is performed at. After that, you need quartz plate (14) II7
The outer periphery 41 and top surface of the stone moxibustion frame (15) are finished to be the same as the T4 plate (13).
Then, the machining of the electrode plate (12) is completed.

As described in section 1-1, when forming an image between the good plate (14) and the metal plate (13), the quartz pieces are fused together and integrated, so mechanical strength can be ensured and, moreover, the image is formed. After the quartz plate (14) is made into a metal plate, it can be machine finished with the metal plate (13) exposed as a backbone, making it possible to finish the quartz plate (14) as thin as necessary. In addition, quartz has a dense structure,
Due to its high hardness, its strength and durability against ion sputtering are greatly improved compared to conventional alumina coatings.
Replacement due to wear and tear becomes unnecessary.

In the above embodiment, the entire surface of the metal plate (13) is covered with the quartz plate (14), but after fixing the quartz plate to the metal plate using a bottle method in the central part where wear is severe, the quartz plate is removed. A conventional alumina coating may be applied around the quartz plate, and -C may be used in combination with a quartz plate and an alumina coating.

〔Effect of the invention〕

As explained above, in the etching apparatus of the present invention, since the quartz plate is provided on the surface of the ground electrode, the strength against sputtering of the electrode plate of the ground electrode is reduced.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a plate showing an embodiment of the present invention, FIG. 2 is a cross-sectional view of an example of a conventional etching apparatus, and FIG.
The figure is a sectional view showing an example of the electrode plate of FIG. 2. (1)...Vacuum container, (2)...High frequency electrode, (3)...
・Ground electrode, (12)・・Electrode plate, (13)・・Metal plate, (14)・・Quartz plate. In each figure, the same reference numerals indicate the same or equivalent parts. 2 diagrams 3: Color quantity 1 unit 12 electric Yuzu plate 3: Metal plate 4: Quartz plate type 3 figures

Claims (1)

[Claims] An etching apparatus in which a high frequency electrode and a ground electrode are provided facing each other in a vacuum container, and a high frequency is applied to the high frequency electrode, characterized in that a quartz plate is provided on the surface of the ground electrode.