JPH0221655A - flip flop - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor RAM (random access memory) using CMO3 (complementary MO3) transistors.

FIG. 1 shows a memory cell conventionally used in a CMO3RAM. Data input/output is performed via an N-channel transistor (transfer gate) whose ON/OFF state is controlled by an address line ADR to a flip-flop formed by a loop connection of an inverter consisting of a P-channel transistor 3.4 and N-channel transistors 5 and 6. It is connected to the lines BIT and TT. When the memory cell is in the read state, a signal is transmitted from the flip-flop to the data line, and when the memory cell is in the write state, a signal is transmitted from the data line to the flip-flop when the transfer gate is turned on. This CMO
A feature of the S memory cell is that in a stable state, the inverter that makes up the flip-flop requires very little power because it is a CMO3, so almost no power is consumed to hold the data stored in the memory. In addition, even in the operating state, it consumes less power than N-MOS, and because of its low power operation, it is used in many fields.

On the other hand, a drawback of this CMOS memory is that its cell size is large, and therefore the capacity of memory stored on the same chip size is smaller than that of an N-MOS RAM, making it difficult to increase the capacity. The reason for this is that since it is a CMO3, a space is required to create a P-channel transistor in a plane, and a space to create and isolate a P-well that insulates the N-channel and serves as a substrate.

The present invention eliminates the above-mentioned drawbacks by replacing the P-channel transistor with a thin-film transistor using a polycrystalline silicon film that performs the same function as the P-channel transistor, and at the same time placing this thin-film transistor on top of the N-channel transistor that forms the pair of the inverter. The purpose of this is to significantly reduce the size of memory cells.

FIG. 2(a) shows an example of a planar pattern of a memory cell according to the present invention, and FIG. 2(b) shows a cross-sectional view of AB. There are portions that will become source/drain regions within the boundary 18 of the selective oxidation mask. After forming a field film by selective oxidation, growing a gate oxide film, and forming contact holes 10 and 11 for connecting the first layer of polycrystalline silicon and the substrate 30, the first layer of polycrystalline silicon is grown. Silicon 19, 20,
After depositing 21.27 (hatched pattern), P ions are implanted over the entire surface to form the source/drain 31°3.
2.33 is formed. After that, the second field film 36 is deposited, and the second field film on the polycrystalline silicon 19 and 20 that will become the gate is removed, and the polycrystalline silicon 19 is removed.
．． 20 is thermally oxidized to form a gate insulating film of a thin film transistor. Thereafter, contact holes 12, 13.14 are opened to connect the cylinder 1N and the second layer of polycrystalline silicon, and the 2Nth polycrystalline silicon 22.23 (pointed portions) is formed to form the channel, source, and drain of the thin film transistor. pattern) and selectively diffuse P.

Further, after depositing the third field film 35 and opening the contact holes 15 and 16, the AE-3t layer 24.2 is formed.
5.26 is formed.

As a result, an N-channel transistor with the source connected to the (-) power supply VS5 of the diffusion layer 31, the drain 32, and the gate of the polycrystalline silicon 20 and the polycrystalline silicon 2
Source 55 connected to the (+) power supply VDtl at 2
, a channel 54, a drain 56, and a P-channel transistor having the polycrystalline silicon 20 as a gate are formed, and a CMO3 inverter can be constructed in which each drain is connected via a diode.

FIG. 5 shows a circuit diagram of the cell pattern shown in FIG. 2.

N-channel transistors 40-43 are formed in bulk silicon single crystal, P-channel transistors 44.45 are formed as polycrystalline thin film transistors, and diodes 46.45 are formed as polycrystalline thin film transistors.
A diode 47 is generated at the connection point of the polycrystalline silicon of the P-channel and N-channel transistors, and this diode does not interfere with the operation of the memory.

The feature of the present invention is as shown in FIG. 2(b). When constructing a CMOS inverter, one gate electrode is used in common, an N-channel transistor is placed below the gate electrode, and a P-channel transistor is placed above the gate electrode. By using a method of arranging transistors and connecting their drains, the P-channel and N-channel regions, which were conventionally arranged in a plane, are arranged in a three-dimensional manner, so the cell size is dramatically reduced, and the same chip size can be achieved. memory capacity will increase rapidly.

In general, polycrystalline silicon layers have extremely low mobility and poor transistor characteristics compared to single-crystalline silicon, especially in OF
It is known that there are many F leaks. However, as a result of our efforts to improve this characteristic, the inventors found the following. As shown in Figure 3, when the deposition temperature of polycrystalline silicon is lower than 700°C, the mobility is improved, especially at 500°C.
A characteristic close to 10 was obtained near °C. Furthermore, improvement of OFF leakage depends on the manufacturing method of the gate film, which is made by thermally oxidizing polycrystalline silicon, and dry oxidation at high temperature is the best method. Furthermore, even if the deposition temperature of the polycrystalline silicon layer is high, the mobility and OFF leakage can be improved by performing laser annealing.

Figure 4 shows a memory cell obtained by depositing polycrystalline silicon at 500°C, then lightly doping the channel with P ions by ion implantation, and forming a gate oxide film at 1100°C. shows the characteristics of a transistor of the same size as . The properties are sufficient for memory applications.

In the present invention, the P-channel and N-channel transistors of the inverter constituting the memory cell used in CMO3RAM are arranged above and below a common gate electrode, and the size is about half that of a conventional cell configured with the same design rule. Conventionally, the limit was 4 Kbit under the 5 μm rule, but by implementing the present invention, it has become possible to reach 16 Kbit.

[Brief explanation of the drawing]

FIG. 1 is a cell diagram of CMO3RAM. Figure 2(a)
2 is a plan view of a CMO3RAM according to the present invention, and FIG. 2 is a sectional view. FIG. 3 is a diagram showing the relationship between the mobility of polycrystalline silicon and the deposition temperature, and FIG. 4 is a diagram showing the characteristics of a polycrystalline silicon transistor obtained according to the present invention. FIG. 5 is a circuit diagram of FIG. 2. Figure 1 Figure 5 (6C) Figures 3-4 Procedural amendment (voluntary) Procedural amendment May 10, 1989 2, Name of invention memorandum Resell 2-4 Nishi-Shinjuku, Shinjuku-ku, Tokyo No. 1 (236) Tsuneya Nakamura, Representative Director, Seiko Epson Corporation 1. The name of the invention is amended to "Memory Cell." 2. Amend the claims as shown in the attached sheet. 3. Specification Box 3, Lines 7-13 r The phrase ``The present invention aims to...'' has been replaced with ``In recent years, one transistor constituting an inverter is composed of a thin film transistor, and a transistor formed on a substrate has been developed. It has been proposed to significantly reduce the size of the memory cell by stacking it on top of the inverter, but the two transistors that make up the inverter are connected using a wiring material such as A1. The reason for using a metal material such as A1 as the wiring material is that, for example, if a p-type polycrystalline silicon layer and an n-type drain diffusion layer formed on the substrate are directly connected, impurities in the polycrystalline silicon layer will be transferred to the substrate. This is because it diffuses into the formed drain, forming a pn junction diode in the substrate, and only allowing current to flow in the -force direction.However, when forming a pn junction between polycrystalline silicon, the A large leakage current flows due to the reverse bias caused by crystal grain agglomerations and disordered crystallinity, and it exhibits ohmic characteristics, so there is almost no problem in operation even if it is connected directly without using a metal layer such as A1. Therefore, the present invention utilizes this characteristic to connect the drain of the first transistor formed on the substrate and the drain of the second transistor formed of TPT to the same conductivity type as the drain of the first transistor. a transfer gate that connects a polycrystalline silicon layer doped with impurities to form an inverter, and connects a bit line and a flip-flop when a word line is selected; and the bit line connected to the transfer gate. and the bit line is formed to pass over the inverter, the polycrystalline silicon layer, and the transfer gate.'' 4. Insert the following sentence on page 7, line 11 of the specification tube. ``With the above configuration, the following effects can be obtained.a) Conventionally, the constituent elements of a memory cell were formed in a planarly distributed manner, but in the present invention, the inverter is configured. Since the two transistors are stacked and connected directly via a polycrystalline silicon layer, the inverter, the connection polycrystalline silicon layer, and the transfer gate can be formed in a straight line; Furthermore, it becomes possible to pass a bit line above these, and the size of the memory cell can be significantly reduced. b) Since the drain of a thin film transistor is formed of a polycrystalline silicon layer, It can be used as a wiring for connecting with the other transistor forming a flip-flop, increasing the degree of freedom in wiring design and simplifying the process.C) Conventionally used as a wiring material for connecting inverters. A1, which has been used for a long time, has a low melting point and cannot withstand high-temperature treatments such as the PSG film glue flow process used for interlayer insulating films, but if the wiring is made of polycrystalline silicon, it can withstand high temperatures of over 1100 degrees Celsius. The reliability of the semiconductor device is improved.''

Claims (1)

[Claims] (1) In a CMOS memory cell in which CMOS inverters are interconnected to form a flip-flop, a thin film transistor of one conductivity type is placed above a common gate electrode, and a thin film transistor of the other conductivity type is placed above the bulk silicon below the gate electrode. 1. A CMOS memory cell comprising a CMOS inverter in which the drains of each of the above-mentioned transistors are connected together.