JPH0221696A - Multilayer circuit board - Google Patents

Abstract

PURPOSE:To realize high density packaging by changing a size of repairing pads to be used, according to a number of wires to be connected to the repairing pads, CONSTITUTION:Repairing pads for one wiring are different from those for two wirings in configurations and dimensions. Namely, the repairing pads for one wiring are smaller than the repairing pads for two wirings and are arranged at a higher density than those for two wirings. Accordingly, usage of the repairing pads for one wiring reduces the unoccupied area on the surface of a substrate and allows packaging at a higher density. Thus, high density packaging can be made possible by changing a size of repairing pads to be used, according to a number of wires connected to the reparing pads.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a multilayer wiring board used in electronic equipment,
In particular, the present invention relates to a multilayer wiring board suitable for changing circuits.

[Conventional technology]

Conventional repair pads for design changes are manufactured by Nikkei Science,
Vol 3. No. 9 (1983), Item 20, they have the same shape and size and are arranged regularly on a grid.

[Problem a that the invention attempts to solve]

In the conventional method described above, although it may be known in advance that there are differences in the number of repair wires to be laid on each repair pad, the shape and size of the pads are determined depending on the number of repair wires. Since this does not change, there is a problem in that no consideration is given to the efficient use of the effective area of the board, which hinders high-density packaging.

An object of the present invention is to provide a multilayer wiring board that effectively solves the problem of high-density mounting by changing the shape and size of a repair pad depending on the number of repair wires to be wired to the repair pad. be.

[Means to solve the problem]

The first aspect of the above can be achieved by changing the size of the repair pad depending on the number of repair wires to be laid on the repair pad.

[For production]

Among the surface patterns, in the repair wiring pad for separating from the inner layer pattern by changing the wiring, the size of the repair pad is changed in advance according to the number of wiring to be laid on the repair pad. As a result, high-density patterning of repair pads and single-component mounting pads can be realized, and high-performance mounting can be achieved.

〔Example〕

An embodiment of the present invention will be described below. Second. This will be explained in FIG.

FIG. 3 is a perspective view of a multilayer wiring board having repair pads for design changes. Terminals 3 of circuit components are formed on the component mounting surface 1 of the multilayer wiring board or soldered to flow pads 4. The reflow pad 4 is connected to the repair pad 5 on the back side through the first through hole. The repair pad 5 is connected to the inner layer pattern 11 through the second through hole.
It is connected to the land 10c on the one component mounting surface via the third through hole 8b.

That is, the one-component terminal 2 includes a through hole 7, a repair pad 5. Land 10c on component mounting surface 1 via inner layer pattern 11
is connected to.

Here, FIG. 2 is a plan view of a conventional repair pad section, and FIG. 1 is a plan view of a repair pad section according to the present invention. The through holes in the repair pad part in Figures 1 and 2 are as follows:
As shown in the perspective view of FIG. 3, there are glue flow pads 4 and 4 on the component mounting surface side, respectively.

4a.

In the conventional method shown in FIG. 2, both the repair pad for single wiring in the upper row and the repair pad for double wiring in the lower row have exactly the same shape regardless of the number of wires to be repaired, and It's the size.

In contrast, in the present invention shown in FIG. 1, - the repair pad for main wiring and the repair pad for double wiring are different in shape and size; Compared to repair pads for
They are small in shape and arranged in high density. This reduces the unused area on the board surface, making it possible to perform higher-density packaging than before.

〔Effect of the invention〕

According to the present invention, the size of the repair pad is changed according to the number of wires to be wired on the repair pad, thereby making it possible to achieve high density and high packaging.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a plan view of a conventional wiring change pattern. FIG. 3 is a perspective view of a conventional wiring change pattern. 1...Multilayer wiring board, 2.2a...Circuit component, 3゜3a...Terminal of circuit component, 4...Fri-low pad,
5゜5a... Pad for repair wiring, 6, 6a, 7, 7a
...Repair wiring, 8.8a, 9.9a...Through hole, 10.10a, 10b...Land, 11...Inner layer pattern. t, 7a-9th layer a semi-certain @ a, 4a-'17o-
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Claims (1)

[Claims] 1. 1. A multilayer wiring board, characterized in that the multilayer wiring board is provided with repair pads for circuit modification, the sizes of which vary depending on the number of wires to be repaired on the repair pad.