JPH0221728U - - Google Patents
Info
- Publication number
- JPH0221728U JPH0221728U JP10074088U JP10074088U JPH0221728U JP H0221728 U JPH0221728 U JP H0221728U JP 10074088 U JP10074088 U JP 10074088U JP 10074088 U JP10074088 U JP 10074088U JP H0221728 U JPH0221728 U JP H0221728U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- taper
- tantalum
- mold
- chip capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図乃至第３図は本考案のタンタルチツプコ
ンデンサ用モールド金型の一実施例を示す断面図
であり、モールド成形後の型抜き作業を段階的に
示している。第４図乃至第６図は本考案の異なる
実施例を示す断面図である。第７図は従来のタン
タルチツプコンデンサ用モールド金型を示す断面
図である。
１……タンタル素子、２……リードフレーム、
３……上型、４……下型、５，６……キヤビテイ
、７，７ａ，７ｂ，８，８ａ，８ｂ……抜きテー
パ、９……成形樹脂、１０……イジエクタピン。
FIGS. 1 to 3 are cross-sectional views showing an embodiment of a tantalum chip capacitor mold according to the present invention, and step-by-step illustrations of the die-cutting operation after molding. 4 to 6 are cross-sectional views showing different embodiments of the present invention. FIG. 7 is a sectional view showing a conventional molding die for a tantalum chip capacitor. 1...Tantalum element, 2...Lead frame,
3... Upper die, 4... Lower die, 5, 6... Cavity, 7, 7a, 7b, 8, 8a, 8b... Punching taper, 9... Molding resin, 10... Ejector pin.
Claims (1)
下から挾み込む上型と下型を備え、各型には、そ
の中央部にタンタル素子を固定し、熱可塑性樹脂
または熱硬化性樹脂にて封入、成形するキヤビテ
イが形成され、このキヤビテイには、成形された
樹脂をキヤビテイから分離させる抜きテーパが形
成されたタンタルチツプコンデンサ用モールド金
型において、 前記上型のキヤビテイに形成された抜きテーパ
の角度が、下型のキヤビテイに形成された抜きテ
ーパの角度より大きくされたことを特徴とするタ
ンタルチツプコンデンサ用モールド金型。[Claims for Utility Model Registration] An upper mold and a lower mold are provided that sandwich the tantalum element connected to the lead frame from above and below. In a molding die for a tantalum chip capacitor, a cavity is formed to be sealed and molded with a curable resin, and this cavity is formed with a draft taper to separate the molded resin from the cavity. A mold for a tantalum chip capacitor, characterized in that the angle of the punched taper is larger than the angle of the punched taper formed in the cavity of the lower mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10074088U JPH0221728U (en) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10074088U JPH0221728U (en) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221728U true JPH0221728U (en) | 1990-02-14 |
Family
ID=31329090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10074088U Pending JPH0221728U (en) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221728U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004247594A (en) * | 2003-02-14 | 2004-09-02 | Nec Tokin Corp | Chip type capacitor, manufacturing method thereof, and molding die |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61269338A (en) * | 1985-05-24 | 1986-11-28 | Hitachi Ltd | Resin-sealed semiconductor device and molding die used for manufacture thereof |
-
1988
- 1988-07-28 JP JP10074088U patent/JPH0221728U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61269338A (en) * | 1985-05-24 | 1986-11-28 | Hitachi Ltd | Resin-sealed semiconductor device and molding die used for manufacture thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004247594A (en) * | 2003-02-14 | 2004-09-02 | Nec Tokin Corp | Chip type capacitor, manufacturing method thereof, and molding die |
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