JPH0221737U - - Google Patents

Info

Publication number
JPH0221737U
JPH0221737U JP1988100503U JP10050388U JPH0221737U JP H0221737 U JPH0221737 U JP H0221737U JP 1988100503 U JP1988100503 U JP 1988100503U JP 10050388 U JP10050388 U JP 10050388U JP H0221737 U JPH0221737 U JP H0221737U
Authority
JP
Japan
Prior art keywords
gold wire
clamp
gold
detection circuit
electrode connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988100503U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988100503U priority Critical patent/JPH0221737U/ja
Publication of JPH0221737U publication Critical patent/JPH0221737U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す構成図、第２
図は金ボール成形不良の信号を示すブロツク図で
ある。 １……金線供給部、２……金線、３……固定部
、４……高圧空気吹き出し口、５……高圧空気吹
き出し機構、６……ボンデイングアーム、７……
外部リード、８……半導体ペレツト、９……電気
トーチ、１０……金ボール、１１……電極結線用
治具、１２……第１クランプ、１３……第２クラ
ンプ、１４……金線ガイド、１５……金ボール成
形不良検出回路、１６……マイクロコンピユータ
、１７……第２クランプ制御回路。

Claims (1)

    【実用新案登録請求の範囲】
  1. 空気力を作用させて金線を上方向へ吹き上げる
    高圧空気吹き出し機構を有するワイヤボンデイン
    グ装置において、電極結線用治具に挿通した金線
    の先端に形成される金ボールの成形不良を検出す
    る検出回路と、前記電極結線用治具の上方に配設
    されて前記金線をボンデイングの所定の工程で開
    閉する第１のクランプと、前記クランプの上方に
    距離を隔てて配設されて空気圧の作用による前記
    金線の張力を停止させる第２のクランプと、前記
    検出回路の出力に基づいて前記第２のクランプの
    動作制御を行う制御部とを有することを特徴とす
    る金線抜け防止機構。
JP1988100503U 1988-07-28 1988-07-28 Pending JPH0221737U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988100503U JPH0221737U (ja) 1988-07-28 1988-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988100503U JPH0221737U (ja) 1988-07-28 1988-07-28

Publications (1)

Publication Number Publication Date
JPH0221737U true JPH0221737U (ja) 1990-02-14

Family

ID=31328635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988100503U Pending JPH0221737U (ja) 1988-07-28 1988-07-28

Country Status (1)

Country Link
JP (1) JPH0221737U (ja)

Similar Documents

Publication Publication Date Title
JP2004221257A (ja) ワイヤボンディング方法及びワイヤボンディング装置
US5285949A (en) Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
JP2617351B2 (ja) ワイヤ接続不良検出方法
US5152450A (en) Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method
JPH0221737U (ja)
US4485957A (en) Wire bonder
JPH0225044A (ja) ワイヤーボンダーの酸化防止システム
JPS6320434U (ja)
JP2722886B2 (ja) ワイヤボンディング装置
JPS59193035A (ja) 半導体組立装置
JP2765168B2 (ja) ワイヤボンダにおけるキャピラリへのワイヤの挿通方法
JPH0447973B2 (ja)
JPS6348125Y2 (ja)
JPS55120144A (en) Automatic wire bonding system for semiconductor
JP2590570B2 (ja) リードフレームセット装置とリードフレームの着離脱検出方法
JPH0148656B2 (ja)
JPS61189652A (ja) 半導体装置
JP2846095B2 (ja) 半導体装置の製造方法
JP3026303B2 (ja) 半導体パッケージのワイヤボンディング方法及びそのワイヤボンディング装置
JPH1022307A (ja) ダイボンダーのコレットタッチ検出機構
JPH0259863U (ja)
KR100210327B1 (ko) 웨이퍼용 테이핑 장치
JPS57132335A (en) Wire bonding method
JPS62104126A (ja) ワイヤボンデイング方法
JPS6230340U (ja)