JPH0221740U - - Google Patents

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Publication number
JPH0221740U
JPH0221740U JP10025688U JP10025688U JPH0221740U JP H0221740 U JPH0221740 U JP H0221740U JP 10025688 U JP10025688 U JP 10025688U JP 10025688 U JP10025688 U JP 10025688U JP H0221740 U JPH0221740 U JP H0221740U
Authority
JP
Japan
Prior art keywords
loop
shaped conveyor
thin film
substrates
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10025688U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10025688U priority Critical patent/JPH0221740U/ja
Publication of JPH0221740U publication Critical patent/JPH0221740U/ja
Pending legal-status Critical Current

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  • Liquid Crystal (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第3図は本考案の一実施例を示したも
ので、第1図は薄膜デバイス製造設備の平面図、
第2図は第1図の部の拡大図、第3図は第2図
の―線に沿う断面図である。第4図は薄膜デ
バイスの一種である薄膜トランジスタの断面図、
第5図は薄膜トランジスタの製造工程図、第6図
および第7図は従来の薄膜デバイス製造設備の平
面図およびその一部の斜視図である。 1……基板、10……基板キヤリア、11……
洗浄装置、12……レジストマスク形成装置、1
2a……レジスト塗布部、12……露光処理部、
12c……現像処理部、13……ドライエツチン
グ装置、14……ウエツトエツチング装置、15
……スパツタ装置、16……プラズマCVD装置
、17……レジスト剥離装置、30……ループ状
コンベア、32……基板授受機構、33……中継
コンベア、35a……搬入側移載機構、35b…
…搬出側移載機構と、37a……搬入機構、37
b……搬出機構、40……未処理基板搬入コンベ
ア、41……移載機構、42……完成品搬出コン
ベア、43……搬出機構。
1 to 3 show an embodiment of the present invention, and FIG. 1 is a plan view of thin film device manufacturing equipment;
FIG. 2 is an enlarged view of the portion shown in FIG. 1, and FIG. 3 is a sectional view taken along the line -- in FIG. Figure 4 is a cross-sectional view of a thin film transistor, which is a type of thin film device.
FIG. 5 is a manufacturing process diagram of a thin film transistor, and FIGS. 6 and 7 are a plan view and a perspective view of a part of conventional thin film device manufacturing equipment. 1... Board, 10... Board carrier, 11...
Cleaning device, 12...Resist mask forming device, 1
2a...Resist coating section, 12...Exposure processing section,
12c...Development processing section, 13...Dry etching device, 14...Wet etching device, 15
. . . Sputtering device, 16 .
...Export side transfer mechanism, 37a...Carry-in mechanism, 37
b... Carrying-out mechanism, 40... Unprocessed substrate carrying-in conveyor, 41... Transfer mechanism, 42... Finished product carrying-out conveyor, 43... Carrying-out mechanism.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 薄膜デバイスを形成する基板を周回搬送するル
ープ状コンベアに沿わせて、洗浄装置と、導電膜
、絶縁膜、半導体膜の膜付け装置と、レジストマ
スク形成装置と、エツチング装置と、レジスト剥
離装置とを配置し、かつこの各装置と前記ループ
状コンベアとの間にそれぞれ、前記ループ状コン
ベア上を搬送されてくる基板を前記装置に取込み
、この装置で処理された基板を前記ループ状コン
ベア上に戻す基板授受機構を設けたことを特徴と
する薄膜デバイスの製造設備。
A cleaning device, a film deposition device for conductive films, insulating films, and semiconductor films, a resist mask forming device, an etching device, and a resist stripping device are installed along a loop-shaped conveyor that circulates substrates forming thin film devices. are placed between each device and the loop-shaped conveyor, and the substrates conveyed on the loop-shaped conveyor are taken into the device, and the substrates processed by this device are transferred onto the loop-shaped conveyor. 1. A thin film device manufacturing facility characterized by being provided with a substrate transfer mechanism for returning the substrate.
JP10025688U 1988-07-28 1988-07-28 Pending JPH0221740U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10025688U JPH0221740U (en) 1988-07-28 1988-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10025688U JPH0221740U (en) 1988-07-28 1988-07-28

Publications (1)

Publication Number Publication Date
JPH0221740U true JPH0221740U (en) 1990-02-14

Family

ID=31328175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10025688U Pending JPH0221740U (en) 1988-07-28 1988-07-28

Country Status (1)

Country Link
JP (1) JPH0221740U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005228771A (en) * 2004-02-10 2005-08-25 Shinko Electric Co Ltd Substrate transport method and apparatus
JP2009515368A (en) * 2005-11-07 2009-04-09 ブルックス オートメーション インコーポレイテッド Small volume carrier, loading port, buffer system
JP2009537075A (en) * 2006-05-11 2009-10-22 ブルックス オートメーション インコーポレイテッド Reduced capacity carrier, transport machine, loading port, shock absorber system
JP2014123660A (en) * 2012-12-21 2014-07-03 Senju Metal Ind Co Ltd Conveyance processing system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005228771A (en) * 2004-02-10 2005-08-25 Shinko Electric Co Ltd Substrate transport method and apparatus
JP2009515368A (en) * 2005-11-07 2009-04-09 ブルックス オートメーション インコーポレイテッド Small volume carrier, loading port, buffer system
JP2009537075A (en) * 2006-05-11 2009-10-22 ブルックス オートメーション インコーポレイテッド Reduced capacity carrier, transport machine, loading port, shock absorber system
JP2014123660A (en) * 2012-12-21 2014-07-03 Senju Metal Ind Co Ltd Conveyance processing system

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