JPH0221744U - - Google Patents

Info

Publication number
JPH0221744U
JPH0221744U JP9986688U JP9986688U JPH0221744U JP H0221744 U JPH0221744 U JP H0221744U JP 9986688 U JP9986688 U JP 9986688U JP 9986688 U JP9986688 U JP 9986688U JP H0221744 U JPH0221744 U JP H0221744U
Authority
JP
Japan
Prior art keywords
integrated circuit
microwave integrated
waveguide section
partition plate
circuit package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9986688U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9986688U priority Critical patent/JPH0221744U/ja
Publication of JPH0221744U publication Critical patent/JPH0221744U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案実施例におけるマイクロ波集積
回路パツケージの縦断面図、第2図は同じくサブ
キヤリアの変形例を示す拡大断面図、第3図は従
来のマイクロ波集積回路パツケージの縦断面図で
ある。 1:パツケージ、2:マイクロ波集積回路、3
:導波管部、4:サブキヤリア、5:ダンパー部
、6:仕切板。
Fig. 1 is a longitudinal sectional view of a microwave integrated circuit package according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view showing a modified example of the subcarrier, and Fig. 3 is a longitudinal sectional view of a conventional microwave integrated circuit package. be. 1: Package, 2: Microwave integrated circuit, 3
: waveguide section, 4: subcarrier section, 5: damper section, 6: partition plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] マイクロ波集積回路を搭載し、電気信号の入出
力を行なう導波管部を形成したマイクロ波集積回
路パツケージであつて、上記導波管部を密閉する
仕切板と、外部からの変形荷重を吸収するダンパ
ー部を形成し、かつ、上記仕切板を上記導波管部
に固定するサブキヤリアを具備したことを特徴と
するマイクロ波集積回路パツケージ。
A microwave integrated circuit package that is equipped with a microwave integrated circuit and has a waveguide section that inputs and outputs electrical signals, and includes a partition plate that seals the waveguide section and absorbs deformation loads from the outside. What is claimed is: 1. A microwave integrated circuit package comprising: a subcarrier forming a damper section for fixing the partition plate to the waveguide section;
JP9986688U 1988-07-29 1988-07-29 Pending JPH0221744U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9986688U JPH0221744U (en) 1988-07-29 1988-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9986688U JPH0221744U (en) 1988-07-29 1988-07-29

Publications (1)

Publication Number Publication Date
JPH0221744U true JPH0221744U (en) 1990-02-14

Family

ID=31327424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9986688U Pending JPH0221744U (en) 1988-07-29 1988-07-29

Country Status (1)

Country Link
JP (1) JPH0221744U (en)

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