JPH0480101U - - Google Patents
Info
- Publication number
- JPH0480101U JPH0480101U JP12441790U JP12441790U JPH0480101U JP H0480101 U JPH0480101 U JP H0480101U JP 12441790 U JP12441790 U JP 12441790U JP 12441790 U JP12441790 U JP 12441790U JP H0480101 U JPH0480101 U JP H0480101U
- Authority
- JP
- Japan
- Prior art keywords
- microwave band
- view
- package
- layer dielectric
- signal line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Waveguide Connection Structure (AREA)
Description
第１図はこの考案の一実施例であるマイクロ波
帯パツケージの平面図、第２図は第１図のパツケ
ージの展開斜視図、第３図は第１図のパツケージ
にＩＣを実装した状態を示す平面図、第４図ａは
この考案の一実施例であるマイクロ波帯パツケー
ジのフイードスルー部の断面図、第４図ｂはこの
考案の他の実施例を示すフイードスルー部の断面
図、第５図は従来のマイクロ波帯パツケージの平
面図、第６図は第５図のパツケージの展開斜視図
、第７図は第５図のパツケージにＩＣを実装した
状態を示す平面図である。
図において、１はベース金属、２はフイードス
ルー下層誘電体、３は信号線路、４は金属リング
、５はフイードスルー上層誘電体、６はマイクロ
波帯ＩＣを示す。なお、図中、同一符号は同一、
又は相当部分を示す。
Fig. 1 is a plan view of a microwave band package that is an embodiment of this invention, Fig. 2 is an exploded perspective view of the package shown in Fig. 1, and Fig. 3 shows a state in which an IC is mounted on the package shown in Fig. 1. FIG. 4a is a cross-sectional view of a feed-through portion of a microwave band package according to an embodiment of this invention, and FIG. 4b is a cross-sectional view of a feed-through portion showing another embodiment of this invention. 6 is a plan view of a conventional microwave band package, FIG. 6 is an exploded perspective view of the package of FIG. 5, and FIG. 7 is a plan view of the package of FIG. 5 with an IC mounted thereon. In the figure, 1 is a base metal, 2 is a feedthrough lower layer dielectric, 3 is a signal line, 4 is a metal ring, 5 is a feedthrough upper layer dielectric, and 6 is a microwave band IC. In addition, in the figure, the same reference numerals are the same,
or a corresponding portion.
Claims (1)
が信号線路に近づくにしたがつて薄くなる事を特
徴とするマイクロ波帯パツケージ。 A microwave band package characterized in that the thickness of the feedthrough upper layer dielectric in the input/output direction becomes thinner as it approaches the signal line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12441790U JPH0480101U (en) | 1990-11-26 | 1990-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12441790U JPH0480101U (en) | 1990-11-26 | 1990-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0480101U true JPH0480101U (en) | 1992-07-13 |
Family
ID=31872069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12441790U Pending JPH0480101U (en) | 1990-11-26 | 1990-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0480101U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04256204A (en) * | 1991-02-08 | 1992-09-10 | Nec Yamagata Ltd | semiconductor equipment |
| JP2006054321A (en) * | 2004-08-11 | 2006-02-23 | Daishinku Corp | Electronic component package and piezoelectric oscillator using the electronic component package |
| JP2012124477A (en) * | 2010-11-18 | 2012-06-28 | Toshiba Corp | Package |
-
1990
- 1990-11-26 JP JP12441790U patent/JPH0480101U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04256204A (en) * | 1991-02-08 | 1992-09-10 | Nec Yamagata Ltd | semiconductor equipment |
| JP2006054321A (en) * | 2004-08-11 | 2006-02-23 | Daishinku Corp | Electronic component package and piezoelectric oscillator using the electronic component package |
| JP2012124477A (en) * | 2010-11-18 | 2012-06-28 | Toshiba Corp | Package |