JPH0221747U - - Google Patents
Info
- Publication number
- JPH0221747U JPH0221747U JP1988099431U JP9943188U JPH0221747U JP H0221747 U JPH0221747 U JP H0221747U JP 1988099431 U JP1988099431 U JP 1988099431U JP 9943188 U JP9943188 U JP 9943188U JP H0221747 U JPH0221747 U JP H0221747U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- cylindrical member
- surrounded
- insulating material
- member made
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
図面はいずれも本考案の一実施例を示し、第１
図は正面図で第２図は平面図である。また、第３
図は筒状部材の斜視図である。
１……基板、２……筒状部材、３……導電パタ
ーン、４……樹脂。
Each of the drawings shows an embodiment of the present invention.
The figure is a front view and the second figure is a plan view. Also, the third
The figure is a perspective view of the cylindrical member. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Cylindrical member, 3... Conductive pattern, 4... Resin.
Claims (1)
ールドにおいて、 前記半導体チツプは、絶縁性物質にて形成され
ている筒状部材にて囲繞され、当該筒状部材内に
樹脂が充填されていることを特徴とする半導体チ
ツプの樹脂モールド。[Claims for Utility Model Registration] In a resin mold of a semiconductor chip mounted on a substrate, the semiconductor chip is surrounded by a cylindrical member made of an insulating material, and the semiconductor chip is surrounded by a cylindrical member made of an insulating material. A resin mold for semiconductor chips characterized by being filled with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988099431U JPH0221747U (en) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988099431U JPH0221747U (en) | 1988-07-27 | 1988-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221747U true JPH0221747U (en) | 1990-02-14 |
Family
ID=31326585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988099431U Pending JPH0221747U (en) | 1988-07-27 | 1988-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221747U (en) |
-
1988
- 1988-07-27 JP JP1988099431U patent/JPH0221747U/ja active Pending