JPH0221751U - - Google Patents
Info
- Publication number
- JPH0221751U JPH0221751U JP1988100502U JP10050288U JPH0221751U JP H0221751 U JPH0221751 U JP H0221751U JP 1988100502 U JP1988100502 U JP 1988100502U JP 10050288 U JP10050288 U JP 10050288U JP H0221751 U JPH0221751 U JP H0221751U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting
- terminal
- lead
- support frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図、第３図は本考案の応用例を示す平面図である
。 １，２……半導体素子搭載用支持架、３……半
導体素子、４……金属細線、１１，２２……外部
端子、３３……引出し用端子。
図、第３図は本考案の応用例を示す平面図である
。 １，２……半導体素子搭載用支持架、３……半
導体素子、４……金属細線、１１，２２……外部
端子、３３……引出し用端子。
Claims (1)
- 半導体素子搭載用支持架を有する端子及び前記
半導体素子表面に形成された電極を金属細線で結
合して外部に引き出す端子を有するリードフレー
ムにおいて、前記引出し用端子の両側に半導体素
子搭載用支持架を有する端子を対称形に配置した
ことを特徴とする半導体素子搭載用リードフレー
ム。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100502U JPH0221751U (ja) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100502U JPH0221751U (ja) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221751U true JPH0221751U (ja) | 1990-02-14 |
Family
ID=31328633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988100502U Pending JPH0221751U (ja) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221751U (ja) |
-
1988
- 1988-07-28 JP JP1988100502U patent/JPH0221751U/ja active Pending