JPH0222027B2 - - Google Patents

Description

[Detailed Description of the Invention] This invention uses inorganic aggregate such as calcium carbonate and gypsum powder as the main raw material, and when this aggregate is integrally coagulated with a composite material of vinyl chloride resin and cement, Forming foamed voids between the aggregate composition particles, the composition particles are tightly attached to each other with a composite cover film of vinyl chloride resin and cement, and the aim is to strengthen the adhesive force between the particles. At the same time, the number of resin-based materials used is kept to a minimum, so that the properties of the molded plate are as close as possible to those of a pure inorganic plate.

However, conventional inorganic boards have poor molding properties due to the use of cement, gypsum, etc. as the filler material, and it has been difficult to provide lightweight boards.

In addition, such pure inorganic boards do not have sufficient impact resistance, bending strength, etc., and furthermore, their construction properties such as cutting, drilling, and nailing are extremely poor. .

In contrast, with inorganic boards that are provided by mixing resin adhesive into inorganic powder and molding, it is of course necessary to completely fill the spaces between aggregates with adhesive resin. , the amount of resin used was inevitably large, and this caused many problems when used as an inorganic plate, especially molding distortion in the molded plate, thermal deformation, or the generation of harmful gases during heating. It is.

The method for forming an inorganic board according to the present invention was specially devised in view of the inconveniences of the conventional inorganic board. A composite cover film made of resin such as vinyl chloride and cement powder is applied to the aggregate to reliably connect the aggregates, and the gap other than the part of the film used for this connection is made into a foam gap. It ensures that there is no room for unnecessary resin material to be interposed between the materials, and promises the same functionality as an almost pure inorganic board.It also reduces the weight of the board itself, and improves its bending and impact resistance properties. This is intended to encourage the following.

Hereinafter, an example of a typical manufacturing method for an inorganic board according to the present invention will be described in detail with reference to the attached drawings. It is shown that mechanical properties such as tensile strength are relatively less likely to be damaged due to foaming of vinyl chloride, etc. After adding about 30% of solvents such as luene and aluma oil to the resin material and stirring them, the resin material 30 and the required amount of cement powder are mixed into the composite cover material, and then calcium carbonate, gypsum, etc. Mix 100% of inorganic powder aggregate, and further mix about 5 to 10% of foaming material such as azobisisobutyronitrile to the mixture of both aggregates, and after thorough kneading, put it into the mold. fill it up
An inorganic board was obtained by heating and foaming at 150 to 170°C for about 30 minutes.

In addition, during the molding process described above, H ₂ O and cement molecules are generated due to mixing and stirring of cement powder into the resin material to which a solvent has been added, or due to steam generated or chemical changes during hot molding. Although it was planned that the binding and hydration of the mixture would be promoted, it was planned that bound water would be added and kneaded separately during kneading of the mixture.

In addition to the above-mentioned solvents, methyl alcohol, acetone, benzene, trichlene, formic acid, or tetrahydrofuran, etc., are appropriately selected and used as the solvent in accordance with the characteristics of the resin material used. Similarly, in addition to the above azobisisobutyronitrile, soda carbonate, Freon,
Propane, butane, pentane, etc. are selectively used.

Furthermore, when calcium carbonate is used as the inorganic material together with such a foaming agent, it exhibits a foaming function by itself, and complete voids are formed between the particles.

The inorganic board according to the present invention has the characteristic structure described above, and the composite cover film 2 of resin and cement is reliably laminated on the surface of the particles 1 to 1 constituting the board, and this film 2 is A series of adhesives that continuously achieve a specified adhesive strength.
Further, the gaps between the particles 1 to 1 are completely foamed voids 3.

Such a particle structure was even more noticeable when the aggregate used was calcium carbonate, and the carbon dioxide gas generated during heating caused the particle size to increase.
A gap 3 is reliably formed between 1 and 1, and the composite jumpsuit material of resin and cement is reliably pressed onto the circumferential surface of the particle 1 as a film 2 by the generated carbon dioxide gas.

In such a foamed structure of an inorganic plate, particles 1
~ 1 are completely integrated with the coating 2, and the coating 2 forms a honeycomb-like structure, giving the plate itself unique impact resistance and bending strength characteristics, unlike conventional inorganic plates. Good mechanical properties were observed.

In addition, in the film structure of the particles 1, even if the particles 1 are calcium powder, gypsum powder, etc., it is reliably shielded from the outside and strength deterioration due to water content is reliably prevented. It is a completely water-resistant structural board.

Furthermore, by using a foamed structure having the membrane 2 described above, the heat insulation and sound insulation properties of the board are particularly good. This reduces the use of resin materials, further ensures the non-thermal function of the molded plate, and also suppresses the generation of harmful gases and the like during heating as much as possible.

In addition, the bonding of particles 1 to 1 by the coating 2 in the description is expected to be due to the integration caused by the hardening of the resin material in the coverall material, as well as the hardening and bonding caused by the coagulation of the cement particles. The mechanical strength properties of the steel are said to be even better.

In addition, with the mixing of such cement powder, the binding part of particles 1 to 1 is made of a resin material with excellent impact resistance and flexible elastic properties, and a cement material with excellent load strength properties. Due to this structure and the use of a cement material that is easily compatible with the inorganic powder that is the main material, it is possible to provide a composite board with unique characteristics that are difficult to obtain with conventional composite boards.

Furthermore, in the coverall material, the mixed cement itself acts to coagulate and bind the particles 1 to 1, so that even if the resin composition part of the coating 2 deteriorates or becomes brittle due to thermal changes, it will not be as expected. The bonding strength of the molded plate is guaranteed, and the problem of sudden strength deterioration is avoided.

[Brief explanation of drawings]

The accompanying drawing is an enlarged sectional view of a main part showing a typical example of an inorganic plate provided by the molding method according to the present invention. In the figure, 1...particles, 2...film, 3...foamed voids.

Claims (1)

[Claims] 1 Basic aggregate made of inorganic powder such as calcium carbonate and gypsum is 100%, composite material made of resin material such as vinyl chloride resin 20-40%, cement powder, solvent 10-40%, and blowing agent 5-10% 1. A method for forming an inorganic foam board, which comprises mixing and kneading and then heating and foaming the board.