JPH02220308A - Paint composition and insulated wire - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (a) Industrial Application Field The present invention relates to a heat-resistant paint composition for coating metal surfaces, etc., and is also applicable to electrical components of automobiles, heat transfer motors, and atomic This relates to heat-resistant insulated wires used in furnace applications, etc.

(b) Conventional technology A compound obtained by hydrolysis and dehydration condensation of alkoxide is used to coat and bake onto metal surfaces, resulting in a film with excellent chemical durability, improved mechanical strength, adhesion, and heat resistance. There are known methods of forming . In addition, among the characteristics of compounds obtained by hydrolyzing and dehydrating condensation of alkoxides, we focused on heat resistance, and developed compounds that can be used in automobile electrical components or motors used in the special high-temperature atmosphere of chemical plants. It can also be used as a heat-resistant paint for insulated wires.

The inventors obtained a compound by hydrolyzing and dehydrating an alkoxide in a solvent, and obtained a coating composition by dissolving it with a resin soluble in the solvent, which was then applied onto a conductor and baked. It is proposed to obtain an insulated wire with excellent thermal properties.

(C) Problem to be Solved by the Invention After hydrolyzing and dehydrating an alkoxide in a solvent, a coating composition obtained by dissolving a resin soluble in the solvent is applied onto a metal surface and baked. It was found that the insulated wire deteriorated over time and its properties such as the adhesion between the metal and the coating and the coating hardness decreased.

Such insulated wires cannot withstand processing deterioration such as elongation and twisting during the winding process, which may result in quality problems such as peeling of the coating and cracking.

1. Structure of the invention (a) Means for solving the problem The present invention was made to solve such problems, and consists of the general formula M(OR)n (wherein M
is a compound obtained by hydrolysis and dehydration condensation of one or more alkoxides represented by B+Mg, Al, Ti, St, or Zr, R is an alkyl group, and n is an integer in a solvent. A coating composition prepared by dissolving a resin soluble in a solvent, characterized in that the resin is a resin whose main component is one or more of polyimide, polyamideimide, polyethersulfone, or polyorganosiloxane resin. Polyimide, polyamideimide, polyethersulfone, and polyorganosiloxane resins related to coating compositions and insulated wires characterized by applying and baking the coating compositions directly onto conductors or through other insulators, Since it has excellent chemical properties including chemical properties, the chemical properties of the film obtained by adding a resin containing one or more of these resins as the main component are also greatly improved, and the chemical properties of the film are greatly improved. It is not affected by residual acid catalysts, alkaline catalysts, and various additives.

Therefore, an insulated wire having such a coating does not change over time, and there is no deterioration in wire characteristics such as the adhesion between the coating and the conductor.

Next, regarding the sol liquid used in the present invention, the general formula M (OR
) The alkoxide represented by n must be a compound in which the hydrogen of the hydroxyl group of the alcohol is replaced with a metal having a valence of two or more, and in particular trialkoxyboron, nialkoxymagnesium, trialkoxyaluminum,
Preferred are tetraalkoxy silicon, tetraalkoxy titanium and tetraalkoxy zirconium.

These alkoxides can be used alone or in combination of two or more. The solvent used for the alkoxide reaction must be able to dissolve polyimide, polyamideimide, polyethersulfone, or polyorganosiloxane resin.

As such a solvent, if a nitrogen compound solvent such as N-methyl-2-pyrrolidone, dimethylformamide, or dimethylacetamide is selected, polyimide,
It can dissolve polyamideimide and polyether sulfone, and silicone resin can also be dissolved by using a hydrocarbon solvent.

Insulated wires obtained by coating and baking these coating compositions on conductors can be used as they are, but in order to improve the resistance to processing deterioration of the insulated wires, organic resins may be added as a main component for additional use. It is also preferred to apply a coating that

The term "processing deterioration resistance" here refers to the ability of an insulated wire to withstand damage caused when the insulated wire is used for coil forming or winding.

Any organic resin that can form a film can be used as the organic resin.

Among them, organic resins such as polyimide, polyamideimide, and polyesterimide are preferably used from the viewpoint of mechanical properties and thermal properties. It is also possible to add lubricants and fillers to these resins to further improve the resistance to processing deterioration.

The contents described above will be explained using Examples, but the Examples are for explaining the present invention in detail, and the present invention is not limited to the contents of the Examples.

The insulated wires obtained in the comparative examples and examples are JIS C
3003r Enamelled Copper Wire and Enameled Aluminum Wire Test Method.

Note that the dielectric breakdown voltage after heating at 500°C was measured after heating the two-stranded sample at 500°C for 1 hour.

Comparative Example 1 167 g of tetraethyl silicate, 360 g of isopropyl alcohol, 57.6 g of water, and 083 g of 61% nitric acid were placed in a flask, and the mixture was stirred at 80'C for 5 hours to carry out a reaction to obtain a sol solution.

The obtained paint was heated at a furnace length of 3.6 m, furnace temperature of 280°C, linear speed of 2
Nickel plating with a diameter of 0.6 an-m in 1 minute [Repeated coating and baking on 1 10 times, and then continued with a furnace length of 8.6 mm.
The coating and baking of the polyimide varnish was repeated 5 times at a furnace temperature of 380° C. and a linear speed of 20 m/min.

The obtained insulated wire had a lower film thickness formed from a sol solution of 7 μm and an upper film thickness of 8 μm.

Comparative Example 2 167 g of tetraethyl silicate, 721 g of diethylene glycol monomethyl ether, 57.6 g of water.

0.83 g of 35% hydrochloric acid was charged into a flask and stirred at 80° C. for 5 hours to carry out the reaction and obtain a sol solution. After the reaction, 24 g of polyvinyl butyral was added and stirred well.

An insulated wire was obtained using the obtained paint in the same manner as in Comparative Example 1.

The lower film thickness formed by the paint consisting of the sol solution and polyvinyl butyral was 8 μm, and the upper film thickness of the polyimide film was 8 μm.

Comparative Example 3 Tetrabutyl silica-1-256g, N-methyl=2-
and Lolidon 594g, water 57.6g, 61% nitric acid 0.8
3 g was placed in a flask and stirred at 80° C. for 5 hours to carry out the reaction and obtain a sol solution. After the reaction, 24g of phenoxy was added and stirred well.

An insulated wire was obtained using the obtained paint in the same manner as in Comparative Example 1.

The thickness of the lower film formed from a paint consisting of a sol solution and phenoxy was 8 μm, and the thickness of the upper polyimide film was 8 μm.

Example 1 Tetraethyl silica) 167 g, N-methyl 2-pyrrolidone 594 g 1 water 57.6 g, 61% nitric acid 0.
88 g was charged into a flask and stirred at 80'C for 5 hours to carry out the reaction and obtain a sol solution. After reaction N-methyl-2-
96g of 25% polyamideimide varnish using pyrrolidone as a solvent was added and stirred well.

An insulated wire was obtained using the obtained paint in the same manner as in Comparative Example 1.

The thickness of the lower film formed from a paint consisting of a sol solution and polyamide-imide is 8 μm. The thickness of the upper polyimide film is 8 μm.
It was m.

Example 2 150 g of a 16% polyimide varnish using N-methyl-2-pyrrolidone as a solvent was added to the sol obtained in Example 1 and stirred well.

An insulated wire was obtained using the obtained paint in the same manner as in Comparative Example 1.

The thickness of the lower coating formed from the sol and polyimide coating was 8 μm, and the thickness of the upper polyimide coating was 8 μm.

Example 3 Polyether sulfone varnish 12 with a concentration of 20% using dimethylacetamide as a solvent was added to the sol obtained in Comparative Example 3.
0g was added and stirred well.

An insulated wire was obtained using the obtained paint in the same manner as in Comparative Example 1.

The thickness of the lower film formed from a paint consisting of a sol solution and polyether sulfone was 8 μm, and the thickness of the upper polyimide film was 8 μm.

Example 4 256 g of tetrabutyl silicate, 721 g of diethylene glycol monomethyl ether, and 57.6 g of water.

Pour 0.83g of 3596 hydrochloric acid into a flask and heat to 80°C.
The mixture was stirred for 5 hours to perform a reaction and obtain a sol solution. After the reaction,
48 g of a 50% methylphenyl silicone solution consisting of a mixed solvent of xylene and N-methyl-2-pyrrolidone was added and stirred well.

An insulated wire was obtained using the obtained paint in the same manner as in Comparative Example 1.

The thickness of the bottom film formed from the paint consisting of the sol solution and methylphenyl silicone was 8 μm, and the thickness of the top polyimide film was 8 μm.

Example 5 To the sol obtained in Comparative Example 3, 75 g of 16% polyamideimide using N-methyl-2-pyrrolidone as a solvent was added, and then 75 g of polyamideimide with a 20% concentration using N-methyl-2-pyrrolidone as a solvent was added. 60 g of polyether sulfone varnish was added and stirred well.

The obtained paint was treated in the same manner as in Comparative Example 1 to obtain an insulated wire. The thickness of the lower coating formed from the sol solution, polyimide, and polyether sulfone was 8 .mu.m, and the thickness of the upper coating was 8 .mu.m.

The evaluation results of the obtained insulated wire are shown in the table.

In addition, the insulated wires obtained in the comparative examples and examples are JI
Evaluation was made according to the SC8008r Enamelled Copper Wire and Enameled Aluminum Wire Test Method.

The dielectric breakdown voltage after heating to 500℃ is 500℃ for a two-stranded sample.
Measurements were taken after heating at °C for 1 hour.

Effects of the Invention As is clear from the comparative examples and examples, the coating composition of the present invention and the insulated wire using the same can be formed into a stable film that does not deteriorate over time by selecting the resin added to the sol solution. It has the characteristic of being able to form , making it industrially useful.

Claims (2)

[Claims] (1) General formula M(OR)n (where M is B, Mg,
A compound obtained by hydrolyzing and dehydrating condensation of one or more alkoxides represented by AlTi, Si or Zr (where R is an alkyl group and n is an integer) in a solvent, and a compound which is soluble in the solvent. A coating composition obtained by dissolving a resin, wherein the resin is a resin whose main component is one or more of polyimide, polyamideimide, polyethersulfone, or polyorganosiloxane resin. (2) An insulated wire, characterized in that the coating composition according to claim 1 is coated and baked on a conductor directly or via another insulator.