JPH022206B2 - - Google Patents

Info

Publication number
JPH022206B2
JPH022206B2 JP1432482A JP1432482A JPH022206B2 JP H022206 B2 JPH022206 B2 JP H022206B2 JP 1432482 A JP1432482 A JP 1432482A JP 1432482 A JP1432482 A JP 1432482A JP H022206 B2 JPH022206 B2 JP H022206B2
Authority
JP
Japan
Prior art keywords
shield case
head
resin
magnetic
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1432482A
Other languages
Japanese (ja)
Other versions
JPS58133616A (en
Inventor
Makoto Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Electronics Inc
Original Assignee
Canon Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Electronics Inc filed Critical Canon Electronics Inc
Priority to JP1432482A priority Critical patent/JPS58133616A/en
Publication of JPS58133616A publication Critical patent/JPS58133616A/en
Publication of JPH022206B2 publication Critical patent/JPH022206B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/10Structure or manufacture of housings or shields for heads
    • G11B5/105Mounting of head within housing or assembling of head and housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)

Description

【発明の詳細な説明】 本発明は磁気ヘツドの製造方法、特にシールド
ケースにヘツド素体を嵌入し、樹脂によつて充填
し固定する工程を含む磁気ヘツドの製造方法に関
する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a magnetic head, and more particularly to a method of manufacturing a magnetic head, which includes a step of fitting a head element into a shield case, filling it with resin, and fixing the head element.

通常、録音用、再生用または録音及び再生用な
どに用いられる磁気ヘツドは外部磁界の影響を防
ぐため、パーマロイ等の磁性金属のケースでシー
ルドされている。このシールドケースには磁気コ
アを露出させるために開口部が設けられており、
磁気コアを露出する開口部以外はシールドケース
でシールドされるのが普通である。
Generally, magnetic heads used for recording, playback, or both recording and playback are shielded with a case made of magnetic metal such as permalloy to prevent the influence of external magnetic fields. This shield case has an opening to expose the magnetic core.
Normally, everything except the opening that exposes the magnetic core is shielded with a shield case.

従来このような磁気ヘツドの製造方法において
樹脂による充填固定工程は、シールドケースに開
口部を設け、磁気コアがこの開口部に臨むように
ヘツド素体又はコアサポート組立体を嵌入し、し
かる後に樹脂で充填固定していた。
Conventionally, in the manufacturing method of such a magnetic head, the step of filling and fixing with resin involves providing an opening in the shield case, inserting the head body or core support assembly so that the magnetic core faces the opening, and then filling the shield with resin. It was filled and fixed.

第1図から第5図はこの従来の製造方法の充填
固定工程を説明するものである。第2図に示すよ
うにシールドケース3の頭部側面には開口部3
a、背面上部には内側に向かつて突出した抜け止
め用凸部3bが設けられている。コアサポート組
立体4は頭部にシールド板2をはさんだ1チヤン
ネルコア1′、2チヤンネルコア1″から成る磁気
コア1を左右一対のサポート4′,4″で挾持して
構成される。また前記磁気コア1の他端にはボビ
ンコイル6が巻かれており、このボビンコイル6
の巻線端部は脚部をなす導電端子7に接続されて
いる。またサポート4′,4″の図の上面には組み
込みバネ5を嵌合する溝4aが形成されている。
このような構成のコアサポート組立体4は第3図
に示すように組み込みバネ5を溝4aに嵌合して
シールドケース3に圧入され、更に矢印A方向よ
り充填樹脂8が注入される。充填樹脂8は抜け止
め用凸部3bを埋め込みつつコアサポート組立体
4を充填封入した後に硬化してコアサポート組立
体4を固定する。しかしこの際に充填樹脂8はそ
の粘性が低い場合には第4図に示すように硬化す
る前に開口部3aから流れ出てしまいコアサポー
ト組立体4の上部は充填されず、コアサポート組
立体4の固定は不確実になり充填樹脂8の無駄と
もなる。しかし、その逆に充填樹脂8の粘性が高
い場合には第5図に示したように途中でコアサポ
ート組立体4の側面に粘着したり気泡を生じたり
して下部が充填されない。下部つまり開口部3a
の周辺が充填されないと、その側縁が露出して磁
気テープを損傷する原因となる。また下部の抜け
止め用凸部3bの周辺が充填されないと、コアサ
ポート組立体4の固定が不確実になり、コアサポ
ート組立体4は開口部3aに臨んだ磁気コア1の
頭部に力が加わつた場合導電端子7の方向に移動
してしまう。そうなつた場合は開口部3a周辺の
側縁が露出して磁気テープを損傷する原因となる
ばかりでなく、磁気コア1の頭部が開口部3aよ
り後退して磁気テープとの接触が悪くなる。また
充填樹脂8の注入の矢印A方向に対して導電端子
7が突出しており、充填樹脂8がそれに付着して
絶縁状態にならぬように導電端子7を避けて注入
を行なわなければならない。しかしシールドケー
スの大きさが小さいので導電端子7を避けながら
注入することは困難であり、どうしても導電端子
7に充填樹脂8が付着してしまう場合がある。
FIGS. 1 to 5 illustrate the filling and fixing process of this conventional manufacturing method. As shown in Fig. 2, there is an opening 3 on the side of the head of the shield case 3.
a. A retaining convex portion 3b that protrudes inward is provided on the upper part of the back surface. The core support assembly 4 is constructed by sandwiching a magnetic core 1 consisting of a one-channel core 1' and a two-channel core 1'' with a shield plate 2 sandwiched between the head and a pair of left and right supports 4' and 4''. Further, a bobbin coil 6 is wound around the other end of the magnetic core 1.
The ends of the windings are connected to conductive terminals 7 forming legs. Furthermore, grooves 4a into which built-in springs 5 are fitted are formed on the upper surfaces of the supports 4', 4'' in the drawing.
As shown in FIG. 3, the core support assembly 4 having such a structure is press-fitted into the shield case 3 by fitting the built-in spring 5 into the groove 4a, and then filling resin 8 is injected from the direction of arrow A. The filling resin 8 fills and encapsulates the core support assembly 4 while embedding the retaining protrusion 3b, and then hardens to fix the core support assembly 4. However, at this time, if the filling resin 8 has low viscosity, it will flow out from the opening 3a before it hardens as shown in FIG. 4, and the upper part of the core support assembly 4 will not be filled. The fixing becomes uncertain and the filling resin 8 is wasted. However, on the other hand, if the filling resin 8 has a high viscosity, it may stick to the side surface of the core support assembly 4 or create bubbles in the middle, as shown in FIG. 5, and the lower part will not be filled. Lower part or opening 3a
If the periphery of the magnetic tape is not filled, its side edges will be exposed and cause damage to the magnetic tape. Furthermore, if the area around the lower retaining convex portion 3b is not filled, the fixation of the core support assembly 4 will become uncertain, and the core support assembly 4 will be subject to force on the head of the magnetic core 1 facing the opening 3a. If it is applied, it will move in the direction of the conductive terminal 7. If this happens, not only will the side edges around the opening 3a be exposed, causing damage to the magnetic tape, but also the head of the magnetic core 1 will retreat from the opening 3a, resulting in poor contact with the magnetic tape. . Further, the conductive terminal 7 protrudes in the direction of arrow A when filling resin 8 is injected, and the injection must be performed while avoiding the conductive terminal 7 so that the filling resin 8 does not adhere to it and become insulated. However, since the size of the shield case is small, it is difficult to inject while avoiding the conductive terminals 7, and the filling resin 8 may inevitably adhere to the conductive terminals 7.

本発明は以上のような欠点を解消するためにな
されたものでヘツド素体を樹脂でシールドケース
に充填固定する場合、不充填部分が生じずにヘツ
ド素体が確実に固定され、磁気コアが開口部から
後退することなく、また開口部周辺の側縁が露出
せず、充填樹脂の流出による無駄を生じず、しか
も充填樹脂の注入作業が簡単で注入時に充填樹脂
が導電端子等に付着することのない磁気ヘツドの
製造方法を提供することを目的としている。
The present invention has been made to solve the above-mentioned drawbacks. When the head element is filled and fixed in the shield case with resin, the head element is securely fixed without any unfilled parts, and the magnetic core is fixed. It does not retreat from the opening, the side edges around the opening are not exposed, and there is no waste due to outflow of the filled resin, and the filling process is easy, and the filled resin does not adhere to conductive terminals etc. during injection. The object of the present invention is to provide a method for manufacturing a magnetic head that does not cause problems.

本発明においてはこの目的を達成するために、
シールドケースの開口部を閉塞した状態で、まず
先に一定量の充填樹脂を注入し、しかる後にヘツ
ド素体をシールドケースに圧入嵌合させ、充填樹
脂が硬化した後に、シールドケースの開口部を開
け磁気コアを開口部に臨ませる構成を採用した。
In order to achieve this purpose in the present invention,
With the opening of the shield case closed, first inject a certain amount of filling resin, then press fit the head element into the shield case, and after the filling resin hardens, close the opening of the shield case. We adopted a configuration in which the magnetic core faces the opening.

以下図面に示す実施例に基づいて本発明の詳細
を説明する。第6図から第11図までに本発明の
実施例を示し、第1図から第5図と同一部分には
同一符号を付し、その説明は省略する。第6図か
ら第9図に示す実施例においては、シールドケー
ス3の頭部側面で最終的に開口部となる部分に磁
気コア1の頭部が入るスペースだけ突出した凸部
Bが形成されている。この構成でまず最初にシー
ルドケース3に充填樹脂8を所定量注入する。そ
の量はシールドケース内部容積からコアサポート
組立体4の容積を差し引いたものにほぼ等しくす
る。注入された充填樹脂8は第8図に示すように
シールドケース3内の下部に溜り、この際樹脂中
の気泡は上部に排出されてしまう。次にコアサポ
ート組立体4を組み込みバネ5を圧しつつシール
ドケース3に圧入嵌合させる。シールドケース3
内に溜つていた充填樹脂8はシールドケース3内
の下部から上部へと、突出部3bを埋め込みなが
ら上昇してシールドケース3の中に充満しその後
硬化してコアサポート組立体4をシールドケース
3内に固定する。最後に最終仕上面である研削加
工面Dまでシリンドリカル又はハイポ形状に研削
することにより開口部が開かれるので磁気コア1
が開口部に臨み磁気ヘツドが完成する。
The details of the present invention will be explained below based on embodiments shown in the drawings. Embodiments of the present invention are shown in FIGS. 6 to 11, and the same parts as in FIGS. 1 to 5 are denoted by the same reference numerals, and the explanation thereof will be omitted. In the embodiments shown in FIGS. 6 to 9, a convex portion B is formed in the side surface of the head of the shield case 3 which will eventually become the opening, and protrudes by the space into which the head of the magnetic core 1 will fit. There is. In this configuration, first, a predetermined amount of filling resin 8 is injected into the shield case 3. The amount is approximately equal to the internal volume of the shield case minus the volume of the core support assembly 4. The injected filling resin 8 accumulates in the lower part of the shield case 3 as shown in FIG. 8, and at this time, air bubbles in the resin are discharged to the upper part. Next, the core support assembly 4 is assembled and press-fitted into the shield case 3 while pressing the spring 5. shield case 3
The filling resin 8 accumulated inside the shield case 3 rises from the bottom to the top of the shield case 3 while embedding the protrusion 3b, fills the shield case 3, and then hardens to remove the core support assembly 4 from the shield case. Fixed within 3. Finally, the magnetic core 1
faces the opening, and the magnetic head is completed.

この方法ではシールドケース3内部の容積から
コアサポート組立体4の容積を差し引いたものに
ほぼ等しい量の充填樹脂8をあらかじめシールド
ケース3内に注入し溜めておくので、樹脂の充填
が最も必要な磁気コア1の摺動面周辺および抜き
止め用凸部3bの付近も含めて、不充填部分が生
じることは非常に少なく、充填樹脂8の量は過不
足なく、流出による充填樹脂8の無駄は生じな
い。また充填樹脂8の注入作業はコアサポート組
立体4の無い状態で行なわれるので、非常に簡単
であり、導電端子7に充填樹脂8が付着すること
もない。
In this method, the filling resin 8 is injected into the shield case 3 in advance in an amount approximately equal to the volume of the core support assembly 4 subtracted from the volume inside the shield case 3, so that the filling resin 8 is stored in the shield case 3 in advance. There are very few unfilled areas, including around the sliding surface of the magnetic core 1 and around the protrusion 3b for preventing removal, and the amount of filled resin 8 is just right. Does not occur. Furthermore, since the filling resin 8 is injected without the core support assembly 4, it is very simple, and the filling resin 8 does not adhere to the conductive terminals 7.

本発明の他の実施例が第10図A、第10図
B、第11図に図示されているが、第10図A、
第10図Bの実施例においてはシールドケース3
の頭部側面の開口部3aにあたる部分に凸部
B′がプレスでその蓋部を半抜きにした状態で設
けられている。この凸部B′には、摺動面の最終
仕上げ加工で磁気コア1の頭部が露出するよう
に、磁気コア1の頭部が入るスペースが取られて
いる。第11図の実施例においてはシールドケー
ス3の頭部側面に従来の実施例と同じく開口部3
aが設けられており、そこに蓋Cをはめ込む構造
になつているが、蓋Cも磁気コア1の頭部のスペ
ースを取つて突出している。これらの実施例の製
造方法の充填固定工程は先の本発明による実施例
と全く同じであり、同じ効果が得られる。ただそ
の後の研削加工面Dまでの研削工程において、こ
れらの実施例では凸部B′あるいは蓋Cが容易に
取りはずせるため、研削工程がより簡単になる。
尚、コアサポート組立体4の代りにコア及びコイ
ルから成るヘツド素体を用いても同様である。
Other embodiments of the invention are illustrated in FIGS. 10A, 10B, and 11;
In the embodiment of FIG. 10B, the shield case 3
There is a convex part on the side of the head corresponding to the opening 3a.
B' is provided with its lid partially cut out using a press. A space is provided in this convex portion B' to accommodate the head of the magnetic core 1 so that the head of the magnetic core 1 is exposed during final finishing of the sliding surface. In the embodiment shown in FIG. 11, there is an opening 3 on the side surface of the head of the shield case 3, as in the conventional embodiment.
A is provided, and a lid C is fitted therein, but the lid C also protrudes to take up space for the head of the magnetic core 1. The filling and fixing steps of the manufacturing method of these embodiments are exactly the same as those of the previous embodiments according to the present invention, and the same effects can be obtained. However, in the subsequent grinding process up to the grinding surface D, in these embodiments, the protrusion B' or the lid C can be easily removed, making the grinding process easier.
Incidentally, the same effect can be obtained even if a head body consisting of a core and a coil is used instead of the core support assembly 4.

以上説明したように本発明による磁気ヘツドの
製造方法は、ヘツド素体のシールドケースへの樹
脂による充填固定工程において、シールドケース
の開口部を閉じた状態で、まず最初に一定量の充
填樹脂を注入し、しかる後にヘツド素体を圧入嵌
合させ、充填樹脂が硬化した後にシールドケース
に磁気コアが臨む開口部を開けるという構成を採
用しているため、不充填部分が生ずることが非常
に少なく、ヘツド素体は確実に固定されて固定不
良による磁気テープの損傷や磁気テープと磁気コ
アとの接触不良が防がれ、充填樹脂は適正量用い
られて無駄がなく、しかも充填樹脂の注入作業が
非常に簡単であり、充填した樹脂の付着により導
電端子が絶縁される事を完全に防ぐという優れた
効果が得られる。
As explained above, in the method for manufacturing a magnetic head according to the present invention, in the step of filling and fixing the head element into the shield case with resin, first, a certain amount of filling resin is poured with the opening of the shield case closed. The head element is then press-fitted, and after the filling resin has hardened, the opening facing the magnetic core is opened in the shield case, so there are very few unfilled areas. , the head element is securely fixed, preventing damage to the magnetic tape due to poor fixation and poor contact between the magnetic tape and the magnetic core, and the filling resin is used in an appropriate amount, eliminating waste, and making the filling resin injection process easier. This is very simple and has the excellent effect of completely preventing the conductive terminal from being insulated due to adhesion of the filled resin.

【図面の簡単な説明】[Brief explanation of drawings]

第1図から第5図までは従来の製造方法による
実施例を示すもので第1図は磁気ヘツドの全体を
示す斜視図、第2図は磁気ヘツドの構造を示す斜
視図、第3図はシールドケースへのコアサポート
組立体の充填樹脂による充填工程を示す断面図、
第4図は充填樹脂の粘性が低い場合の充填状態を
示す断面図、第5図は充填樹脂の粘性が高い場合
の充填状態を示す断面図、第6図から第11図ま
では本発明による製造方法の実施例を示すもので
第6図はシールドケースの斜視図、第7図はシー
ルドケースの断面図、第8図はシールドケースへ
の充填樹脂の注入とコアサポート組立体圧入工程
を示す断面図、第9図は充填樹脂によるコアサポ
ート組立体の充填状態を示す断面図、第10図A
は本発明による他の実施例のシールドケースの断
面図及び第10図Bはその斜視図、第11図は本
発明による他の実施例のシールドケースの斜視図
である。 1……磁気コア、1′……1チヤンネルコア、
1″……2チヤンネルコア、2……シールド板、
3……シールドケース、3a……開口部、3b…
…抜け止め用凸部、4……コアサポート組立体、
4′,4″……サポート、4a……溝、5……組み
込みバネ、6……ボビンコイル、7……導電端
子、8……充填樹脂、A……充填樹脂の注入方
向、B,B′……凸部、C……蓋、D……研削加
工面。
1 to 5 show examples using conventional manufacturing methods. FIG. 1 is a perspective view showing the entire magnetic head, FIG. 2 is a perspective view showing the structure of the magnetic head, and FIG. 3 is a perspective view showing the structure of the magnetic head. A sectional view showing the filling process of the core support assembly into the shield case with filling resin,
Fig. 4 is a sectional view showing the filling state when the viscosity of the filled resin is low, Fig. 5 is a sectional view showing the filling state when the viscosity of the filling resin is high, and Figs. 6 to 11 are according to the present invention. 6 shows a perspective view of the shield case, FIG. 7 shows a sectional view of the shield case, and FIG. 8 shows the process of injecting the filling resin into the shield case and press-fitting the core support assembly. A cross-sectional view, FIG. 9 is a cross-sectional view showing the filling state of the core support assembly with filled resin, and FIG. 10A.
10B is a sectional view of a shield case according to another embodiment of the present invention, FIG. 10B is a perspective view thereof, and FIG. 11 is a perspective view of a shield case according to another embodiment of the present invention. 1...magnetic core, 1'...1 channel core,
1″...2 channel core, 2...shield plate,
3... Shield case, 3a... Opening, 3b...
...Protrusion for preventing falling off, 4...Core support assembly,
4', 4''...Support, 4a...Groove, 5...Built-in spring, 6...Bobbin coil, 7...Conductive terminal, 8...Filled resin, A...Filled resin injection direction, B, B' ... Convex portion, C... Lid, D... Grinding surface.

Claims (1)

【特許請求の範囲】 1 シールドケースにヘツド素体を嵌入し樹脂に
よつて充填固定して磁気ヘツドを製造する磁気ヘ
ツドの製造方法において、シールドケースの磁気
テープ摺動面に凸部を形成し樹脂をシールドケー
スに注入し、その後ヘツド素体を前記シールドケ
ースに嵌入し、前記充填樹脂が硬化した後に前記
凸部を取り去り該ヘツド素体の磁気コアが臨む開
口部を形成することを特徴とする磁気ヘツドの製
造方法。 2 シールドケースにヘツド素体を嵌入し樹脂に
よつて充填固定して磁気ヘツドを製造する磁気ヘ
ツドの製造方法において、シールドケースの磁気
テープ摺動面に形成された開口部に蓋を設けて充
填樹脂をシールドケースに注入し、その後ヘツド
素体を前記シールドケースに嵌入し、前記充填樹
脂が硬化した後に前記蓋を取り去り、該ヘツド素
体の磁気コアが開口部に臨むようにしたことを特
徴とする磁気ヘツドの製造方法。
[Scope of Claims] 1. A magnetic head manufacturing method in which a magnetic head is manufactured by fitting a head element into a shield case and filling and fixing it with resin, in which a convex portion is formed on the magnetic tape sliding surface of the shield case. A resin is injected into the shield case, and then the head element is fitted into the shield case, and after the filled resin has hardened, the protrusion is removed to form an opening through which the magnetic core of the head element faces. A method of manufacturing a magnetic head. 2. In a magnetic head manufacturing method in which a magnetic head is manufactured by fitting a head element into a shield case and filling and fixing it with resin, a cover is provided over the opening formed on the magnetic tape sliding surface of the shield case and the head is filled. A resin is injected into the shield case, then the head element is fitted into the shield case, and after the filled resin has hardened, the lid is removed so that the magnetic core of the head element faces the opening. A method for manufacturing a magnetic head.
JP1432482A 1982-02-02 1982-02-02 Manufacture for magnetic head Granted JPS58133616A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1432482A JPS58133616A (en) 1982-02-02 1982-02-02 Manufacture for magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1432482A JPS58133616A (en) 1982-02-02 1982-02-02 Manufacture for magnetic head

Publications (2)

Publication Number Publication Date
JPS58133616A JPS58133616A (en) 1983-08-09
JPH022206B2 true JPH022206B2 (en) 1990-01-17

Family

ID=11857888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1432482A Granted JPS58133616A (en) 1982-02-02 1982-02-02 Manufacture for magnetic head

Country Status (1)

Country Link
JP (1) JPS58133616A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4737874A (en) * 1985-01-24 1988-04-12 Northern Telecom Limited Magnetic head assembly with decreased setting time of adhesives
JP2637451B2 (en) * 1988-01-19 1997-08-06 キヤノン電子 株式会社 Manufacturing method of magnetic head
US7296336B2 (en) * 2004-05-25 2007-11-20 Sae Magnetics (H.K.) Ltd. Method to protect a GMR head from electrostatic damage during the manufacturing process

Also Published As

Publication number Publication date
JPS58133616A (en) 1983-08-09

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