JPH02220770A - Batch operated vapor phase soldering device - Google Patents
Batch operated vapor phase soldering deviceInfo
- Publication number
- JPH02220770A JPH02220770A JP4459689A JP4459689A JPH02220770A JP H02220770 A JPH02220770 A JP H02220770A JP 4459689 A JP4459689 A JP 4459689A JP 4459689 A JP4459689 A JP 4459689A JP H02220770 A JPH02220770 A JP H02220770A
- Authority
- JP
- Japan
- Prior art keywords
- tray
- printed circuit
- tank
- vapor phase
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 239000012808 vapor phase Substances 0.000 title claims abstract description 18
- 229920006395 saturated elastomer Polymers 0.000 claims description 26
- 239000007788 liquid Substances 0.000 claims description 11
- 238000005192 partition Methods 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 2
- 230000005496 eutectics Effects 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 230000001174 ascending effect Effects 0.000 abstract 1
- 239000012071 phase Substances 0.000 description 9
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 235000002566 Capsicum Nutrition 0.000 description 1
- 239000006002 Pepper Substances 0.000 description 1
- 235000016761 Piper aduncum Nutrition 0.000 description 1
- 235000017804 Piper guineense Nutrition 0.000 description 1
- 244000203593 Piper nigrum Species 0.000 description 1
- 235000008184 Piper nigrum Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はリフローはんだを用いるバッチ式ペパーフェー
ズソルダリング装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a batch type pepper phase soldering apparatus using reflow soldering.
［従来の技術］
従来、この種のバッチ式ベーパーフェーズソルダリング
装置は、ベーパーフェーズ槽の槽内下部にヒータが、槽
内上部の内側に凝縮装置が設けられ、槽内に不活性液を
入れ、該不活性液をヒータで加熱して沸騰させ飽和蒸気
を発生させて、プリント基板に搭載された面実装部品の
リフローはんだ付けを行なうとともに、該飽和蒸気を凝
縮装置で凝縮させるようになっていた。[Prior Art] Conventionally, this type of batch type vapor phase soldering equipment has a heater in the lower part of the vapor phase tank, a condensing device inside the upper part of the tank, and an inert liquid is placed in the tank. The inert liquid is heated with a heater and boiled to generate saturated steam to perform reflow soldering of surface mount components mounted on printed circuit boards, and the saturated steam is condensed with a condensing device. Ta.
［発明が解決しようとする課題］
上述した従来のバッチ式ペーパーフェーズソルタリング
装置は、飽和蒸気の境界層が不安定で温度分布は一様と
なっておらず、プリント基板に実装された部品をリフロ
ーはんだ付けする際、温度上昇カーブは急峻な立上がり
となり、本来のベーパーフェーズ装置の機能を発揮する
が、逆にこの温度特性かリフローはんだ付けにおいて未
はんだの発生要因となり、特にＪリードを持つ部品にお
いて顕著に発生するという欠点がある。[Problems to be Solved by the Invention] In the conventional batch-type paper phase sorting device described above, the boundary layer of saturated steam is unstable and the temperature distribution is not uniform. During reflow soldering, the temperature rise curve rises steeply, demonstrating the original function of the vapor phase device, but on the other hand, this temperature characteristic can cause unsolder to occur during reflow soldering, especially for parts with J leads. It has the disadvantage that it occurs noticeably in
本発明のバッチ式ベーパーフェーズソルダリング装置は
、
ベーパーフェーズ槽の槽内の中央部に、プリント基板を
収容したトレーが出入りでき、発生した飽和蒸気が充満
する、筒状の隔壁で形成された飽和蒸気室が設けられ、
前記トレーをペーパーフェーズ槽の上方から下降させて
前記飽和蒸気室に入れ、リフローはんだ付けが終了する
と、上昇させてペーパーフェーズ槽の上方に引き上げる
機構であり、プリント基板のリフローはんだ付けを安定
に行なうため、前記トレーの少なくとも下降速度を可変
に設定できるようになっているエレベータ機構を有して
いる。The batch type vapor phase soldering apparatus of the present invention has a vapor phase tank in which a tray containing printed circuit boards can go in and out at the center of the tank, and a saturated vapor phase tank formed by a cylindrical partition wall is filled with generated saturated vapor. A steam chamber is provided, and the tray is lowered from above the paper phase tank into the saturated steam chamber, and when reflow soldering is completed, it is raised and raised above the paper phase tank. In order to perform soldering stably, an elevator mechanism is provided in which at least the lowering speed of the tray can be variably set.
［作用］
不活性液をヒータにより一定時間以上加熱すると沸騰し
、飽和蒸気が飽和蒸気室内４こ充満する。[Function] When the inert liquid is heated with a heater for a certain period of time or more, it boils and saturated steam fills the four saturated steam chambers.
飽和蒸気室とベーパーフェーズ槽内壁の間には空間があ
るので相変化が平衡状態になると、飽和蒸気室の上部に
ほぼ平面の空気との境界面が形成される１次に、エレベ
ータ機構によりトレーを下降させ、境界面の所でトレー
を停止させてプリント基板の温度を実装部品よりも先に
上昇させた後、トレーを下降させて飽和蒸気室内に入れ
、実装部分のリフローはんだ付けを行なう。There is a space between the saturated vapor chamber and the inner wall of the vapor phase tank, so when the phase change reaches an equilibrium state, an almost flat interface with the air is formed at the top of the saturated vapor chamber. After lowering the tray and stopping the tray at the interface to raise the temperature of the printed circuit board before the mounted parts, the tray is lowered and placed in a saturated steam chamber to perform reflow soldering of the mounted parts.
したがって、実装部品、特にＪリードを持つ部品のリフ
ローはんだ付けを安定して行なうことができる。Therefore, reflow soldering of mounted components, especially components with J leads, can be performed stably.
〔実施例１
次に、本発明の実施例について図面を参照して説明する
。[Example 1 Next, an example of the present invention will be described with reference to the drawings.
第１図は本発明のバッチ式ベーパーフェーズソルダリン
グ装置の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment of the batch type vapor phase soldering apparatus of the present invention.
ペーパーフェーズ槽１の槽内下部には不活性液５を加熱
するヒータ２が、槽内上部の内側に冷却コイル３が設け
られている。さらに、槽内中央部には槽内壁に支持され
、プリント基板８を収容したトレー６が出入りでき、不
活性液５を加熱することにより発生した飽和蒸気５ａが
充満する、筒状の隔壁で形成された飽和蒸気室４が設け
られている。ペーパーフェーズ槽ｌにはトレー６を上昇
／下降させるエレベータ機構７が支持されており、この
エレベータ機構７はトレー６の上昇／下降速度を可変で
きるようになっている。なお、不活性液５として共晶は
んだの融点１８３℃より高い沸点のものが使用されてい
る。A heater 2 for heating an inert liquid 5 is provided in the lower part of the paper phase tank 1, and a cooling coil 3 is provided inside the upper part of the tank. Furthermore, the central part of the tank is supported by the inner wall of the tank, a tray 6 containing a printed circuit board 8 can go in and out, and is formed of a cylindrical partition wall filled with saturated steam 5a generated by heating the inert liquid 5. A saturated steam chamber 4 is provided. An elevator mechanism 7 for raising/lowering the tray 6 is supported in the paper phase tank 1, and this elevator mechanism 7 can vary the speed of raising/lowering the tray 6. Note that the inert liquid 5 used has a boiling point higher than the melting point of 183° C. of the eutectic solder.
次に１本装置におけるリフローはんだ付けの動作を説明
する。Next, the reflow soldering operation using this single device will be explained.
不活性液５をヒータ２により一定時間以上加熱すると沸
騰を始め、飽和蒸気が飽和蒸気室４の内部に充満し、飽
和蒸気室４よりはみ出すが、冷却コイル３により冷却さ
れるため再び液となり槽内に落下する。この相変化が平
衝状態になると飽和蒸気室４の上面にほぼ平面の境界面
５ｂが安定した状態で出現する０次に、エレベータ機構
７を作動させて、トレー６を下降させ、境界面５ｂの位
置にプリント基板８が来ると、トレー６を−たん停止さ
せる。この状態でまずプリント基板８が温度上昇を始め
る。そして、プリント基板８の温度が共晶はんだの融点
１８３℃を越えると、再びトレー６の下降が開始し、飽
和蒸気室４内にプリント基板８と面実装部品９全体が入
れられ１面実装部品９のリフローはんだ付けが行なわれ
る。リフローはんだ付けが完了すると、トレー６は上昇
動作に切換えられ、プリント基板８がベーパーフェーズ
Ｉ！ｌの上側に出される。When the inert liquid 5 is heated for more than a certain period of time by the heater 2, it starts to boil, and saturated steam fills the inside of the saturated steam chamber 4 and protrudes from the saturated steam chamber 4, but it becomes liquid again because it is cooled by the cooling coil 3 and flows into the tank. fall inside. When this phase change reaches an equilibrium state, a substantially flat boundary surface 5b appears in a stable state on the upper surface of the saturated steam chamber 4.Next, the elevator mechanism 7 is operated to lower the tray 6, and the boundary surface 5b When the printed circuit board 8 comes to the position, the tray 6 is immediately stopped. In this state, the temperature of the printed circuit board 8 begins to rise. Then, when the temperature of the printed circuit board 8 exceeds the melting point of eutectic solder, 183° C., the tray 6 starts descending again, and the entire printed circuit board 8 and surface mount component 9 are put into the saturated steam chamber 4, and the single surface mount component 9 reflow soldering is performed. When the reflow soldering is completed, the tray 6 is switched to the upward movement, and the printed circuit board 8 is in the vapor phase I! It is served on the upper side of l.
このように、境界面５ｂにプリント基板８が来たところ
で、トレー６を−たん停止させ、プリント基板８の温度
を共晶はんだの融点１８３℃以上に上げるので、面実装
部品９のリフローはんだ付けを安定して行なうことがで
きる。In this way, when the printed circuit board 8 comes to the boundary surface 5b, the tray 6 is temporarily stopped and the temperature of the printed circuit board 8 is raised above the melting point of eutectic solder, 183°C, so that the surface mount components 9 can be reflow soldered. can be performed stably.
〔発明の効果１
以上説明したように本発明は、飽和蒸気室をベーパーフ
ェーズ糟に設けて、はぼ平面の、安定した境界層を形成
するとともに、エレベータ機構を設けて、トレーの下降
速度を可変にし、プリント基板の温度を面実装部品より
も先に共晶はんだ融点以上に上げることにより、表面実
装部品、特にＪリードを持つ部品のリフローはんだ付け
を安定して行なうことができる効果がある。[Effects of the Invention 1] As explained above, the present invention provides a saturated steam chamber in a vapor phase tank to form a nearly flat and stable boundary layer, and also provides an elevator mechanism to reduce the descending speed of the tray. By making it variable and raising the temperature of the printed circuit board above the eutectic solder melting point before surface mount components, it is possible to stably perform reflow soldering of surface mount components, especially components with J leads. .
第１図は本発明のバッチ式ベーパーフェーズソルダリン
グ装置の一実施例の縦断面である。
１−−−−・・ペーパーフェーズｊ１！、２−−−−−
−ヒータ、
３・・・・・・冷却コイル、
４・・・・・・飽和蒸気室、
５・・・・・・不活性液、
５ａ・・・飽和蒸気、
５ｂ−・・境界面、
６・・・・・・トレー
７・・・・・・エレベータ機構、
８・・・・・・プリント基板、
９・・・・・・面実装部品。FIG. 1 is a longitudinal section of an embodiment of the batch type vapor phase soldering apparatus of the present invention. 1------Paper phase j1! , 2------
- Heater, 3... Cooling coil, 4... Saturated steam chamber, 5... Inert liquid, 5a... Saturated steam, 5b... Boundary surface, 6 ...Tray 7...Elevator mechanism, 8...Printed circuit board, 9...Surface mount component.
Claims (1)
部の内側に凝縮装置が設けられ、槽内に不活性液を入れ
、該不活性液をヒータで加熱して沸騰させ飽和蒸気を発
生させて、プリント基板に搭載された面実装部品のリフ
ローはんだ付けを行なうとともに、該飽和蒸気を凝縮装
置で凝縮させるバッチ式ベーパーフェーズソルダリング
装置において。 ベーパーフェーズ槽の槽内の中央部に、前記プリント基
板を収容したトレーが出入りでき、発生した飽和蒸気が
充満する、筒状の隔壁で形成された飽和蒸気室が設けら
れ、 前記トレーをベーパーフェーズ槽の上方から下降させて
前記飽和蒸気室に入れ、リフローはんだ付けが終了する
と、上昇させてベーパーフェーズ槽の上方に引き上げる
機構であり、プリント基板のリフローはんだ付けを安定
に行なうため、前記トレーの少なくとも下降速度を可変
に設定できるようになっているエレベータ機構を有する
ことを特徴とするバッチ式ベーパーフェーズソルダリン
グ装置。[Claims] 1. A heater is provided in the lower part of the vapor phase tank, and a condensing device is provided inside the upper part of the tank, and an inert liquid is placed in the tank and the inert liquid is heated by the heater. In a batch-type vapor phase soldering device that generates saturated steam by boiling and performs reflow soldering of surface-mounted components mounted on a printed circuit board, and condenses the saturated steam in a condensing device. A saturated steam chamber formed by a cylindrical partition wall is provided in the center of the tank of the vapor phase tank, into which the tray containing the printed circuit board can go in and out, and is filled with generated saturated steam. The tray is lowered from the top of the tank into the saturated vapor chamber, and when reflow soldering is completed, is raised and pulled up to the top of the vapor phase tank. A batch type vapor phase soldering apparatus characterized by having an elevator mechanism in which at least a descending speed can be variably set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1044596A JP2600886B2 (en) | 1989-02-22 | 1989-02-22 | Batch type vapor phase soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1044596A JP2600886B2 (en) | 1989-02-22 | 1989-02-22 | Batch type vapor phase soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02220770A true JPH02220770A (en) | 1990-09-03 |
| JP2600886B2 JP2600886B2 (en) | 1997-04-16 |
Family
ID=12695841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1044596A Expired - Lifetime JP2600886B2 (en) | 1989-02-22 | 1989-02-22 | Batch type vapor phase soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2600886B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1036626A3 (en) * | 1999-03-17 | 2002-06-12 | Asscon Systemtechnik Electronik GmbH | Reflow soldering method using a vacuum vapour-condensation soldering apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60111841A (en) * | 1983-10-11 | 1985-06-18 | ピエゾ−セラム・エレクトロニク | Device for heating article or product by condensation of steam |
| JPS6264473A (en) * | 1985-09-17 | 1987-03-23 | Kenji Kondo | Fusion joining device for article |
-
1989
- 1989-02-22 JP JP1044596A patent/JP2600886B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60111841A (en) * | 1983-10-11 | 1985-06-18 | ピエゾ−セラム・エレクトロニク | Device for heating article or product by condensation of steam |
| JPS6264473A (en) * | 1985-09-17 | 1987-03-23 | Kenji Kondo | Fusion joining device for article |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1036626A3 (en) * | 1999-03-17 | 2002-06-12 | Asscon Systemtechnik Electronik GmbH | Reflow soldering method using a vacuum vapour-condensation soldering apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2600886B2 (en) | 1997-04-16 |
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