JPH02222555A - Test head for semiconductor device - Google Patents

Abstract

PURPOSE:To enable a semiconductor device test head main body to be used as both semiconductor wafer test head and semiconductor device test head by a method wherein the terminal section of the semiconductor wafer test head main body on which a semiconductor wafer contact is mounted is equipped with a semiconductor device test socket. CONSTITUTION:The terminal section of a semiconductor wafer test head main body on which a semiconductor wafer contact is mounted is equipped with a semiconductor device test socket 5 provided with a contact which is connected with the above terminal section and the leads of a semiconductor device are inserted into. For instance, a connector 14 of a wafer test board 12 and a connector 22 of a test box main body 21 are connected together through a cable 25, and the wafer test board 12 is installed inside the test box main body 21. Then, an IC sample card 23 is installed on the wafer test board 12 instead of a probe card. A support metal 8 for an IC socket 7 is screwed to an upper lid 24, the contact of the IC socket 7 is inserted into a master socket 5, and the upper lid 24 is fixed to the test box main body 21.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to testing semiconductor wafers, semiconductor devices, etc.
The present invention relates to a test head for semiconductor devices used to measure their performance.

[Conventional technology]

Conventionally, performance tests have been performed on semiconductor wafers and semiconductor devices after their respective manufacturing processes have been completed. In this performance test, dedicated test heads were used for semiconductor wafers and semiconductor devices, respectively. This will be explained with reference to FIGS. 5 and 6.

FIG. 5 is a perspective view showing a conventional test head used when testing semiconductor devices, and FIG. 6 is a plan view showing a conventional test head used when testing semiconductor wafers. In these figures, 1 is the final test box body (hereinafter simply referred to as the box body),
A support rod 1a for supporting a peripheral circuit board (to be described later) is erected inside the box body 1, and a connector 2 to which a cable of a tester (not shown) is connected is provided on the outside of the box body 1. is installed. Reference numeral 3 denotes a peripheral circuit board, on which electronic components 4 such as a relay IC are mounted, and a parent socket 5 into which an IC socket (described later) is mounted is attached via a spacer 5a. , is fixed to the tip of the support rod 1a in the box body 1 while being electrically connected to the connector 2. Reference numeral 6 denotes an upper lid that closes the upper part of the box body 1. The upper lid 6 is provided with an opening (not shown) through which the parent socket 5 faces, and is fixed on the box body 1. 7 is an IC socket into which an IC to be measured (not shown) is mounted; 8 is a support for preventing the force applied to the peripheral circuit board 3 to attach or detach the IC to be measured from the IC socket 7; The IC socket 7 is connected to the parent socket 4 and includes a contact (not shown) into which an IC lead is inserted, with the IC mounting part facing upward. It is fixed on a supporting metal plate 8. Further, this IC socket 7 is fixed to the box body 1 by connecting the contacts to the parent socket 5 and fixing the supporting metal plate 8 to the upper M6. That is, by fitting the leads of the IC to be measured into the IC socket 7, the IC to be measured is electrically connected to the peripheral circuit board 3 via the parent socket 5.

In order to perform a final test on an IC or the like using the test head for semiconductor devices configured as described above, first, the connector 2 of the box body 1 and the tester are connected by a cable.Then, the box body 1 is connected to the handler (Fig. It is sufficient to place it on a table (not shown), and an automatic test is performed in this state.

Further, in FIG. 6, reference numeral 11 is a test head for semiconductor wafers, and this test head 11 is connected to a wafer test substrate 12.
and a probe card 13 mounted on the wafer test board 12. Further, electronic components 4 such as relay ICs are mounted on the wafer test board 12, and a connector 14 to which a cable of a tester (not shown) is connected is mounted. Through holes 15 for attaching the substrate 12 are bored at four locations. The probe card 13 has a needle-shaped contact 13a that contacts an electrode pad of a chip on a wafer to be measured (not shown), and the probe card 13 has a needle-shaped contact 13a that contacts an electrode pad of a chip on a wafer to be measured (not shown). is configured to be electrically connected to the wafer test board 12.

In order to perform a wafer test using the semiconductor wafer test head configured as described above, first, the wafer test substrate 12 is placed on the linear head of the prober device, and the screw member inserted into the through hole 15 is attached to the linear head. Fix it. Next, the connector 14 and the tester are connected by a cable.

Then, the linear head is moved by operating the control lever of the blower device, and the needle-like contacts 13a of the probe card 13 are brought into contact with the electrode pads on the chips of the wafer to be measured.In this state, the wafer test is performed. will be implemented.

[Problem to be solved by the invention]

However, as mentioned above, using two types of test heads, the test head for final testing and the test head for wafer testing, means that the peripheral circuit boards 3 and 12 used for each test head have equivalent functions. Even though it is equipped with the above, two types have to be manufactured to fit each test head, which raises the problem of high manufacturing cost and long manufacturing time.

[Means to solve the problem]

A semiconductor device test head according to the present invention includes a terminal portion of a semiconductor wafer test head main body to which a semiconductor wafer contact is attached, and a contact that is connected to the terminal portion and into which a lead of a semiconductor device is inserted. It is equipped with a socket for testing semiconductor devices.

[For production]

The semiconductor device test head according to the present invention can test a semiconductor device by attaching a semiconductor device test socket to the semiconductor wafer test head body, and the semiconductor wafer contact can be used instead of the semiconductor device test socket. By attaching this to the semiconductor wafer test head body, semiconductor wafers can also be tested, so the semiconductor wafer test head body can be used as both the semiconductor wafer test head and the semiconductor device test head. be able to.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 1 to 4.

FIG. 1 is a perspective view showing a test head for semiconductor devices according to the present invention, FIG. 2 is a plan view of the test head for semiconductor devices, FIG. 3 is a sectional view of the test head for semiconductor devices, and FIG. 4 is a cross-sectional view of the test head for semiconductor devices. It is a perspective view which expands and shows a principal part. In these figures, the same or equivalent members as those explained in FIGS. 5 and 6 are given the same reference numerals, and detailed explanations will be omitted here. In these figures,
Reference numeral 21 denotes a test box body, and within this test box body 21, a support rod 21a for supporting the wafer test substrate 12 is provided upright at a position corresponding to the through hole 15 of the wafer test substrate 12. A connector 22 to which a cable of a tester (not shown) is connected is attached to the outside of the box body 1. 23 is an IC for mounting the IC socket 7 on the wafer test board 12;
As shown in FIG. 4, a pin 23 is inserted into the probe card connection pin hole 12a of the wafer test board 12 at the bottom of the sample card 23.
A is provided in a protruding manner, and a parent socket 5 connected to the pin 23a is provided on the upper part. 24 is an upper lid that closes the upper part of the test box main body 21;
is provided with an opening (not shown) through which the parent socket 4 faces, and is fixed on the test box body 21. Note that 25 is a cable for connecting the connector 14 of the wafer test board Fi12 and the connector 22 of the test box main body 21, and 26 is a cable for connecting the connector 22 of the test box 21 and a tester (not shown). It is. To assemble this semiconductor device test head, first, the wafer test substrate 12 is mounted inside the test box body 21.

When installing the wafer test board 12, connect the connector 14 of the wafer test board 12 and the connector 22 of the test box main body 21 with the cable 25,
With the support rod 21a inserted into the through hole 15 of the wafer test substrate 12, the support rod 21a and the wafer test substrate 12 are screwed together. Next, an IC sample card 23 is mounted on the wafer test board 12 instead of the probe card. Then, the supporting metal plate 8 of the IC socket 7 is screwed to the upper lid 24, and this IC socket 7 is
The contact (not shown) is inserted into the parent socket 4 to be attached to the parent socket 5, and the top cover 24 is fixed to the test box body 21.

In order to carry out the final test of IC etc. using the semiconductor device test head assembled in this way,
The connector 22 of the test box body 21 and the tester may be connected by the cable 26, and then the test box body 21 may be placed on the table of a handler (not shown). Further, when performing a wafer test, the IC socket 7 is removed by removing the upper M24 from the above-mentioned test head, and the wafer test board 12 is removed from the test box body 21. Then, with the IC sample card 23 also removed from this wafer test board 12, this wafer test board 12 is
Place the probe card on the linear head of the prober device and fix it to the linear head with the screw member pushed through the through hole 15.Next, the probe card is attached to the pin hole 12a of this wafer test board 12, and the connector 14 and the tester are connected. Connect by cable. A wafer test can be performed in this state.

Therefore, by attaching the IC sample card 23 and the IC socket 7 to the wafer test board 12, a semiconductor device can be tested.
By attaching a probe card to the wafer test board 12 instead, semiconductor wafers can also be tested, so the wafer test board 12 can be used as both a test head for semiconductor devices and a test head for semiconductor wafers. can do.

In this embodiment, a type in which a DIP type semiconductor device is mounted in the IC socket 7 and the parent socket 5 is used, but the present invention is not limited to such a limitation.

A socket to which a SIL type semiconductor device can be mounted may also be used. Further, although amphenol type connectors are used for each connector 14 and 22, other connectors such as a flat type may also be used. Furthermore, the wafer test board 12 and the IC sample card 23 can be made of a material such as epoxy resin or ceramic, and the same effect can be obtained no matter what material they are made of.

〔Effect of the invention〕

As explained above, the test head for semiconductor devices according to the present invention has the terminal portion of the main body of the test head for semiconductor wafers to which the semiconductor wafer contacts are attached, and the leads of the semiconductor device connected to the terminal portions and inserted into the terminal portions. Since the socket for semiconductor device testing is equipped with a contactor that can be used for semiconductor wafers, it is possible to test semiconductor devices by attaching the socket for semiconductor device testing to the main body of the test head for semiconductor wafers. By attaching the wafer contact to the semiconductor wafer test head body, semiconductor wafers can also be tested, so the semiconductor wafer test head body can be used for both semiconductor wafer test head and semiconductor device test head. It can be used for the head. Therefore, semiconductor devices and semiconductor wafers can be tested by manufacturing only one type of semiconductor wafer test head body, so manufacturing costs can be kept low and manufacturing time can be shortened.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a test head for a semiconductor device according to the present invention, FIG. 2 is a plan view of the test head for a semiconductor device, and FIG. 3 is a cross-sectional view of the test head for a semiconductor device. 5 is a perspective view showing a conventional test head used when testing semiconductor devices. FIG. 6 is a perspective view showing a conventional test head used when testing semiconductor wafers. It is a top view showing a test head. 5... Parent socket, 7... IC socket, 1
2...Wafer test board, 12a-9...Bin hole,
21. ,,. Test box body, 23...IC sample card, 23a...pin...

Claims (1)

[Claims] It is confirmed that a semiconductor device test socket equipped with a contact that is connected to this terminal portion and into which a semiconductor device lead is inserted is attached to the terminal portion of the semiconductor wafer test head body into which the semiconductor wafer contact is attached. Characteristic test head for semiconductor devices.