JPH02223413A - Manufacture of molded product of synthetic resin - Google Patents
Manufacture of molded product of synthetic resinInfo
- Publication number
- JPH02223413A JPH02223413A JP4351389A JP4351389A JPH02223413A JP H02223413 A JPH02223413 A JP H02223413A JP 4351389 A JP4351389 A JP 4351389A JP 4351389 A JP4351389 A JP 4351389A JP H02223413 A JPH02223413 A JP H02223413A
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- synthetic resin
- mandrel
- electroforming
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、凸部を備えた合成樹脂成形品を製造する方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a synthetic resin molded article having a convex portion.
[従来の技術]
従来より、凹部を備えた電鋳金型の表面に合成樹脂粉末
や合成樹脂ペーストを付着させてスラッシュ成形又はロ
ーテーション成形することにより、凸部を備えた合成樹
脂成形品を製造する方法が行われている。例えば、第2
4図に示すような合成樹脂成形品41をスラッシュ成形
により製造する方法について、第13〜24図を参照し
て簡単に説明する。[Prior art] Conventionally, synthetic resin molded products with convex portions are manufactured by attaching synthetic resin powder or synthetic resin paste to the surface of an electroforming mold having concave portions and performing slush molding or rotation molding. method is being done. For example, the second
A method for manufacturing a synthetic resin molded product 41 as shown in FIG. 4 by slush molding will be briefly described with reference to FIGS. 13 to 24.
(1)第13図に示すモデル42の表面に第14図に示
す微細な原シボ模様43を備えた模様付与材44(ここ
では牛革)を貼り付けることにより、凸部45を備えた
マスターモデル46を形成する。(1) A master model with convex portions 45 is created by pasting a pattern imparting material 44 (cowhide in this case) with a fine original grain pattern 43 shown in FIG. 14 on the surface of a model 42 shown in FIG. 13. form 46.
(2)第15図に示すように前記マスターモデル46の
表面にシリコンゴムを注入してこれを硬化させることに
より、凹部47と前記原シボ模様43が転写してなる二
次逆シボ模様48とを備えた中間型49を形成し、第1
6図に示すように該中間型49を剥離する。(2) As shown in FIG. 15, by injecting silicone rubber onto the surface of the master model 46 and curing it, a secondary reverse grain pattern 48 is created by transferring the recesses 47 and the original grain pattern 43. forming an intermediate mold 49 having a first
As shown in FIG. 6, the intermediate mold 49 is peeled off.
(3)第17図に示すように前記中間型49の表面隙間
をおいて鉄、アルミニウム等よりなる補強部材52aを
あてがう。そして、該補強部材52aに設けた注入孔5
2bから前記隙間へエポキシ樹脂を注入してこれを硬化
させることにより、凸部50と前記二次逆シボ模様48
が転写してなる三次シボ模様51とを備えたマンドレル
52を形成し、第18図に示すように該マンドレル52
を剥離する。(3) As shown in FIG. 17, a reinforcing member 52a made of iron, aluminum, etc. is applied to the intermediate mold 49 with a gap between the surfaces thereof. The injection hole 5 provided in the reinforcing member 52a
By injecting epoxy resin into the gap from 2b and curing it, the convex portion 50 and the secondary reverse grain pattern 48 are formed.
A mandrel 52 having a tertiary grain pattern 51 formed by transferring the same is formed, and as shown in FIG. 18, the mandrel 52 is
Peel off.
(4)第19図に示すように、前記マンドレル52の表
面にペースト状銀ラッカーをスプレ塗布して薄い導電被
膜53を形成する。(4) As shown in FIG. 19, a thin conductive coating 53 is formed on the surface of the mandrel 52 by spraying paste silver lacquer.
(5)第20図に示すように前記導電被膜53の表面に
電鋳を行うことにより、凹部54と前記三次シボ模様5
1が転写してなる四次逆シボ模様55とを備えた電鋳金
型56を形成する。このとき、電鋳金属はマンドレル5
2の凸部50の頂上角部のような突出箇所には電着しや
すく、該凸部50の裾角部のような引込箇所には電着し
にくい性質があるため、前記電鋳金型56は凹部54の
底角部がより厚く形成され、該凹部54の開口角部がよ
り薄く形成される。(5) As shown in FIG. 20, by performing electroforming on the surface of the conductive film 53, the recesses 54 and the tertiary grain pattern 5 are formed.
An electroforming mold 56 having a quaternary reverse grain pattern 55 formed by transferring 1 is formed. At this time, the electroformed metal is made of mandrel 5
Electrodeposition is likely to occur at protruding locations such as the top corners of the convex portions 50 of No. 2, while electrodeposition is difficult to occur at recessed locations such as the bottom corners of the convex portions 50. In this case, the bottom corner of the recess 54 is formed thicker, and the opening corner of the recess 54 is formed thinner.
(6)第21図に示すように前記電鋳金型56を前記マ
ンドレル52から剥離し、該電鋳金型56に導電被膜5
3が付着してきた場合には該導電被膜53を化学的に又
は物理的に除去する。(6) As shown in FIG. 21, the electroforming mold 56 is peeled off from the mandrel 52, and a conductive coating 5 is applied to the electroforming mold 56.
3 has adhered, the conductive film 53 is removed chemically or physically.
(7)第22図に示すように支持部材57を取り付けて
加熱した電鋳金型56の表面に塩化ビニル樹脂パウダ5
8を付着させ、第23図に示すように該塩化ビニル樹脂
パウダを溶融及び冷却硬化させることにより(スラッシ
ュ成形)、凸部59と前記四次逆シボ模様55が転写し
てなる三次シボ模様60とを備えた合成樹脂成形品41
を成形する。(7) As shown in FIG. 22, vinyl chloride resin powder 5 is applied to the surface of the heated electroforming mold 56 with the supporting member 57 attached.
8, and by melting and cooling and hardening the vinyl chloride resin powder as shown in FIG. 23 (slush molding), a tertiary grain pattern 60 is formed by transferring the convex portions 59 and the quaternary reverse grain pattern 55. Synthetic resin molded product 41 comprising
to form.
このとき、電鋳金型56の凹部54の底角部は前述の通
り厚く形成され熱容量も大きいため、同部に多くの塩化
ビニル樹脂パウダ58が付着する。At this time, since the bottom corner of the recess 54 of the electroforming mold 56 is formed thickly and has a large heat capacity as described above, a large amount of the vinyl chloride resin powder 58 adheres to the bottom corner.
一方、電鋳金型56の凹部54の開口角部は前述の通り
薄く形成され熱容量も小さいため、同部には少しの塩化
ビニル樹脂パウダ58しか付着しない。On the other hand, since the opening corners of the recesses 54 of the electroforming mold 56 are formed thinly and have a small heat capacity as described above, only a small amount of the vinyl chloride resin powder 58 adheres thereto.
そのため、第24図に示すように、従来の合成樹脂成形
品41は凸部59の頂上角部がより厚く形成され、該凸
部59の裾角部がより薄く形成されていた。Therefore, as shown in FIG. 24, in the conventional synthetic resin molded product 41, the top corners of the convex portions 59 are formed thicker, and the bottom corners of the convex portions 59 are formed thinner.
[発明が解決しようとする課題]
上記のような従来の方法においては、凸部5つを備えた
合成樹脂成形品41を製造するのに、凹部54を備えた
電鋳金型56を使用していたため、該凹部54に塩化ビ
ニルパウダ58を供給しにくいという問題があった。[Problems to be Solved by the Invention] In the conventional method as described above, an electroforming mold 56 having a concave portion 54 is used to manufacture a synthetic resin molded product 41 having five convex portions. Therefore, there was a problem in that it was difficult to supply the vinyl chloride powder 58 to the recess 54.
また、上記のように偏肉のある電鋳金型56を使用して
製造された合成樹脂成形品41は、最も手に触れやすい
凸部59の頂上角部が特に厚くなることから、感触がご
つごつして弾力性に欠けた硬いものになりやすいという
問題があった。特に、最近は合成樹脂成形品のソフト化
を求める要請が強まっているが、従来の方法によりこの
要請に応えることは難しかった。In addition, the synthetic resin molded product 41 manufactured using the electroforming mold 56 with uneven thickness as described above has a rough feel because the top corner of the convex portion 59 that is most easily touched by the hand is particularly thick. There is a problem in that it tends to become hard and lack elasticity. In particular, recently there has been an increasing demand for softer synthetic resin molded products, but it has been difficult to meet this demand using conventional methods.
本発明の目的は、上記課題を解決した新規な合成樹脂成
形品の製造方法を提供することにある。An object of the present invention is to provide a novel method for manufacturing synthetic resin molded products that solves the above problems.
[課題を解決するための手段]
上記目的を達成するため、請求項1の合成樹脂成形品の
製造方法は、凸部を備えた金型の表面に合成樹脂材料を
付着させることにより四部を備えた中間成形品を成形す
る工程と、前記中間成形品の凹部を裏返すことにより凸
部を備えた合成樹脂成形品を形成する工程とから構成し
た。[Means for Solving the Problems] In order to achieve the above object, the method for manufacturing a synthetic resin molded product according to claim 1 is provided by attaching a synthetic resin material to the surface of a mold having a convex part. The method consisted of a step of molding an intermediate molded product, and a step of forming a synthetic resin molded product having a convex portion by turning over the recessed portion of the intermediate molded product.
また、請求項2の合成樹脂成形品の製造方法は、凹部を
備えたマンドレルを形成する工程と、前記マンドレルの
表面に導電被膜を形成する工程と、前記導電被膜の表面
に電鋳を行うことにより凸部を備えた電鋳金型を製造す
る工程と、前記マンドレルから電鋳金型を剥離する工程
と、前記電鋳金型の表面に合成樹脂材料を付着させるこ
とにより四部を備えた中間成形品を成形する工程と、前
記中間成形品の凹部を裏返すことにより凸部を備えた合
成樹脂成形品を形成する工程とから構成した。The method for manufacturing a synthetic resin molded product according to claim 2 further includes the steps of forming a mandrel with a recess, forming a conductive film on the surface of the mandrel, and performing electroforming on the surface of the conductive film. a step of manufacturing an electroforming mold having a convex portion, a step of peeling the electroforming mold from the mandrel, and a step of attaching a synthetic resin material to the surface of the electroforming mold to produce an intermediate molded product having four parts. The method consisted of a molding step and a step of forming a synthetic resin molded product having a convex portion by turning over the concave portion of the intermediate molded product.
[作用]
請求項1の合成樹脂成形品の製造方法によれば、従来と
は逆に凸部を備えた金型を使用するため、該金型の表面
に合成樹脂材料を容易に供給できる作用がある。[Function] According to the method for manufacturing a synthetic resin molded product according to claim 1, since a mold having a convex portion is used, contrary to the conventional method, the synthetic resin material can be easily supplied to the surface of the mold. There is.
請求項2の合成樹脂成形品の製造方法によれば、上記作
用に加えて、電鋳金型に偏肉があっても合成樹脂成形品
の凸部の頂上角部を薄く形成する作用がある。According to the method for manufacturing a synthetic resin molded product according to the second aspect, in addition to the above-mentioned effect, even if the electroforming mold has uneven thickness, the top corner of the convex portion of the synthetic resin molded product can be formed thin.
[実施例]
以下、本発明を具体化した一実施例について、第1〜1
2図を参照して説明する。本実施例は、第12図に示す
ような凸部19を備えた合成樹脂成形品1をスラッシュ
成形により製造する方法に係り、次のような工程から構
成される。[Example] Hereinafter, regarding an example embodying the present invention, 1st to 1st
This will be explained with reference to FIG. The present embodiment relates to a method of manufacturing a synthetic resin molded product 1 having a convex portion 19 as shown in FIG. 12 by slush molding, and includes the following steps.
(1)第1図に示すように所望の合成樹脂成形品と同一
形状のモデル2を木、合成樹脂、石膏、ロウその他の各
種材料により形成した後、第2図に示すように牛革、ス
ェード、布等のシボ模様の凹凸関係を逆にしてなる逆シ
ボ模様3を備えた透模様付与材4を前記モデル2の表面
に貼り付けることにより、凸部5を備えたマスターモデ
ル6を形成する。(1) As shown in Fig. 1, a model 2 having the same shape as the desired synthetic resin molded product is formed from wood, synthetic resin, plaster, wax, and other various materials, and then as shown in Fig. 2, it is made of cowhide, suede, etc. A master model 6 having convex portions 5 is formed by pasting a transparent pattern imparting material 4 having a reverse grain pattern 3 on the surface of the model 2, which is formed by reversing the uneven relationship of the grain pattern of cloth or the like. .
(2)第3図に示すように、前記マスターモデル6の表
面に隙間をおいて鉄、アルミニウム等よりなる補強部材
9aをあてがう。そして、該補強部材9aに設けた注入
孔9bから前記隙間へエポキシ樹脂その他の反応硬化性
材料を注入してこれを硬化させることにより、凹部7と
前記逆シボ模様3が転写してなる二次シボ模様8とを備
えたマンドレル9を形成し、第4図に示すように該マン
ドレル9を剥離する。(2) As shown in FIG. 3, a reinforcing member 9a made of iron, aluminum, etc. is applied to the surface of the master model 6 with a gap left in between. Then, by injecting an epoxy resin or other reaction-curing material into the gap from the injection hole 9b provided in the reinforcing member 9a and curing it, a secondary product is formed by transferring the concave portion 7 and the reverse grain pattern 3. A mandrel 9 having a grain pattern 8 is formed, and the mandrel 9 is peeled off as shown in FIG.
(3)第5図に示すように、前記マンドレル9の表面に
薄い導電被膜10を付着形成する。(3) As shown in FIG. 5, a thin conductive film 10 is deposited on the surface of the mandrel 9.
この導電被膜10の形成方法としては、銀鏡反応、ペー
スト状銀ラッカー等のスプレー塗布、無電解メツキ、蒸
着メツキ等を例示することができる。Examples of methods for forming the conductive film 10 include silver mirror reaction, spray application of paste silver lacquer, electroless plating, vapor deposition plating, and the like.
また、この導電被膜10の膜厚は、薄すぎると十分な導
電性が得られず、厚すぎると二次シボ模様8の忠実度が
低下するなめ、5〜30μmが好ましい。Further, the thickness of the conductive film 10 is preferably 5 to 30 μm, because if it is too thin, sufficient conductivity will not be obtained, and if it is too thick, the fidelity of the secondary grain pattern 8 will be reduced.
(4)第6図に示すように、前記導電被膜10の表面に
電鋳を行うことにより、凸部11と前記二次シボ模様8
が転写してなる三次逆シボ模様12とを備えた電鋳金型
13を形成する。(4) As shown in FIG. 6, by performing electroforming on the surface of the conductive coating 10, the protrusions 11 and the secondary grain pattern 8 are formed.
An electroforming mold 13 having a tertiary reverse grain pattern 12 formed by transferring the above is formed.
この電鋳法としては、公知の一般的な電鋳金属、電鋳浴
及び電鋳条件よりなる電鋳法を採用することができる。As this electroforming method, an electroforming method comprising a known general electroforming metal, electroforming bath, and electroforming conditions can be adopted.
本実施例では、スルファミン酸ニッケルと硼酸とピンホ
ール抑制用の界面活性剤とを主成分とする電鋳浴に、前
記マンドレル9と電鋳金属としてのニッケル電極(図示
路)とを浸漬し、導電液Jl(10(カソード)と前記
ニッケル電極(アノード)との間に直流電圧を通電して
一般的な電鋳を行った。In this example, the mandrel 9 and the nickel electrode (as shown in the figure) as the electroformed metal are immersed in an electroforming bath mainly composed of nickel sulfamate, boric acid, and a surfactant for suppressing pinholes. General electroforming was performed by applying a DC voltage between the conductive liquid Jl (10 (cathode) and the nickel electrode (anode)).
この電鋳時において、電鋳金属はマンドレル9の凹部7
の開口角部のような突出箇所には電着しやすく、該凹部
7の底角部のような引込箇所には電着しにくい性質があ
る。そのため、前記電鋳金型13には偏肉が起こり、凸
部11の裾角部はより厚く形成され、該凸部11の頂上
角部はより薄く形成される。During this electroforming, the electroformed metal is formed in the recess 7 of the mandrel 9.
Electrodeposition is likely to occur at protruding locations such as the opening corners of the recess 7, while electrodeposition is difficult to occur at recessed locations such as the bottom corners of the recess 7. Therefore, uneven thickness occurs in the electroforming mold 13, so that the bottom corners of the protrusions 11 are formed thicker, and the top corners of the protrusions 11 are formed thinner.
(5)第7図に示すように前記電鋳金型13を前記マン
ドレル9から剥離し、該電鋳金型13に導電液1(10
が付着してきた場合には該導電被膜10を化学的に又は
物理的に除去する。第8図は、以上のようにしてできた
電鋳金型13の三次逆シボ模様12を示している。(5) As shown in FIG. 7, the electroforming mold 13 is peeled off from the mandrel 9, and the conductive liquid 1 (10
If the conductive film 10 is attached, the conductive film 10 is removed chemically or physically. FIG. 8 shows the tertiary reverse grain pattern 12 of the electroforming mold 13 produced as described above.
(6)第9図に示すように電鋳金型13に支持部材14
を取り付け、加熱した該電鋳金型13の表面に塩化ビニ
ル樹脂パウダ15を付着させる。(6) As shown in FIG. 9, the support member 14 is attached to the electroforming mold 13.
is attached, and vinyl chloride resin powder 15 is adhered to the surface of the heated electroforming mold 13.
このとき本実施例においては、従来の凹部54を備えた
電鋳金型56と異なり、凸部11を備えた電鋳金型13
を使用しているため、塩化ビニル樹脂パウダ15を例え
ば公知の粉体静電法により容易に供給することができる
。この供給容易化の効果は、後述する合成樹脂ペースト
やウレタン反応液を使用する場合も同様である。At this time, in this embodiment, unlike the conventional electroforming mold 56 having a concave portion 54, an electroforming mold 13 having a convex portion 11 is used.
, the vinyl chloride resin powder 15 can be easily supplied by, for example, a known powder electrostatic method. This effect of facilitating supply is the same when using synthetic resin paste or urethane reaction liquid, which will be described later.
そして、第10図に示すように前記塩化ビニル樹脂パウ
ダ15を溶融及び冷却硬化させることにより(スラッシ
ュ成形)、凹部16と前記三次逆シボ模様12が転写し
てなる四次シボ模様17とを備えた中間成形品18を成
形する。Then, as shown in FIG. 10, by melting and cooling the vinyl chloride resin powder 15 and hardening it (slush molding), a concave portion 16 and a quaternary grain pattern 17 formed by transferring the tertiary reverse grain pattern 12 are formed. An intermediate molded product 18 is then molded.
この工程において、電鋳金型13の凸部11の裾角部は
前述の通り厚く形成され熱容量も大きいため、同部に多
くの塩化ビニル樹脂パウダ15が付着する。一方、電鋳
金型13の凸部11の頂上角部は薄く形成され熱容量も
小さいため、同部には少しの塩化ビニル樹脂パウダ15
しか付着しない。In this step, since the bottom corner portion of the convex portion 11 of the electroforming mold 13 is formed thickly as described above and has a large heat capacity, a large amount of the vinyl chloride resin powder 15 adheres to the bottom corner portion. On the other hand, since the top corner of the convex part 11 of the electroforming mold 13 is formed thinly and has a small heat capacity, a small amount of vinyl chloride resin powder 15 is added to the top corner of the convex part 11 of the electroforming mold 13.
It only sticks.
そのため、第11図に示すように、前記中間成形品18
は凹部16の開口角部がより厚く形成され、凹部16の
底角部がより薄く形成される。Therefore, as shown in FIG. 11, the intermediate molded product 18
In this case, the opening corners of the recess 16 are formed thicker, and the bottom corners of the recess 16 are formed thinner.
(7)第11図及び第12図に示すように、前記中間成
形品18の凹部16を反対側に押し出して裏返すことに
より、該凹部16が裏返ってなる凸部19と前記四次シ
ボ模様17とを備えた合成樹脂成形品1を形成する。(7) As shown in FIGS. 11 and 12, by pushing out the recessed part 16 of the intermediate molded product 18 to the opposite side and turning it over, the recessed part 16 is turned over to form a convex part 19 and the quaternary grain pattern 17. A synthetic resin molded product 1 is formed.
以上により、合成樹脂成形品1の凸部19の裾角部は厚
く形成されるが、最も手に触れやすい該凸部19の頂上
角部は薄く形成されるため、その感触は非常にソフトで
弾力性に富んだものとなる。As a result, the bottom corners of the convex portions 19 of the synthetic resin molded product 1 are formed thickly, but the top corners of the convex portions 19, which are most easily touched by the hand, are formed thinly, so the feel is very soft. It becomes highly elastic.
従って、本実施例によれば最近の合成樹脂成形品のソフ
ト化の要請に対して容易に応えることができる。Therefore, according to this embodiment, it is possible to easily meet the recent demand for softening of synthetic resin molded products.
なお、本発明は前記実施例の構成に限定されるものでは
なく、例えば以下のように発明の趣旨から逸脱しない範
囲で任意に変更して具体化することもできる。It should be noted that the present invention is not limited to the configuration of the above-mentioned embodiments, and may be modified and embodied as desired without departing from the spirit of the invention, for example, as described below.
(1)合成樹脂成形品1の成形方法は前記スラッシュ成
形に限定されず、次のような成形方法によることができ
る。また、合成樹脂成形品1の合成樹脂材料は前記塩化
ビニル樹脂パウダ15に限定されず、前記各成形方法に
ついて次のような材料を例示することができる。(1) The method of molding the synthetic resin molded product 1 is not limited to the slush molding described above, and the following molding methods may be used. Further, the synthetic resin material of the synthetic resin molded product 1 is not limited to the vinyl chloride resin powder 15, and the following materials can be exemplified for each of the above molding methods.
■スラッシュ成形又はローテーション成形a;ポリエチ
レン樹脂パウダ、エチレン酢ビ樹脂パウダ、その他の各
種合成樹脂パウダを電鋳金型に付着させる。■ Slash molding or rotation molding a: Adhere polyethylene resin powder, ethylene vinyl acetate resin powder, and other various synthetic resin powders to an electroforming mold.
b;塩化ビニル樹脂ペースト、ポリプロピレン樹脂ペー
スト、その他の各種合成樹脂ペーストを電鋳金型に付着
させる。b; Attach vinyl chloride resin paste, polypropylene resin paste, and other various synthetic resin pastes to the electroforming mold.
■ウレタン塗装成形
ポリオールとポリイソシアネートとからなるウレタン反
応液を電鋳金型に塗布する。■Urethane coating Molding A urethane reaction solution consisting of polyol and polyisocyanate is applied to the electroforming mold.
このウレタン反応液を使用すれば、アミンガスを供給し
てウレア反応を起させるだけで迅速に硬化するため、製
造効率をさらに高めることができる。例えば、塩化ビニ
ル樹脂パウダの溶融及び冷却による場合は製造1サイク
ルに約5分かかるのに対して、ウレタン反応液の硬化に
よる場合はこれを約1分に短縮することができる。If this urethane reaction liquid is used, it can be cured quickly simply by supplying amine gas to cause the urea reaction, so that production efficiency can be further improved. For example, one production cycle takes about 5 minutes when vinyl chloride resin powder is melted and cooled, whereas this time can be shortened to about 1 minute when a urethane reaction liquid is cured.
(2)請求項1の金型には、電鋳以外の方法により形成
された公知の各種金型を使用することもできる。(2) As the mold according to claim 1, various known molds formed by methods other than electroforming can also be used.
(3)マンドレル9の表面には前記二次シボ模様8以外
の各種微細凹凸模様を設けてもよいし、模様の無い鏡面
としてもよい。(3) The surface of the mandrel 9 may be provided with various fine uneven patterns other than the secondary grain pattern 8, or may have a mirror surface without a pattern.
(4)マンドレル9の形成方法は前記実施例の工程に限
定されず、公知のいろいろな方法により形成することが
できる。(4) The method for forming the mandrel 9 is not limited to the steps of the above embodiments, and can be formed by various known methods.
[発明の効果]
本発明の合成樹脂成形品の製造方法は、上記の通り構成
されているので、次のような効果を奏する。[Effects of the Invention] Since the method for manufacturing a synthetic resin molded article of the present invention is configured as described above, it has the following effects.
請求項1の合成樹脂成形品の製造方法によれば、金型へ
の合成樹脂材料の供給が容易になる。According to the method for manufacturing a synthetic resin molded article according to the first aspect, the synthetic resin material can be easily supplied to the mold.
請求項2の合成樹脂成形品の製造方法によれば、上記効
果に加え、ソフト感に富む凸部を備えた合成樹脂成形品
を容易に製造することができる。According to the method for manufacturing a synthetic resin molded article according to the second aspect, in addition to the above-mentioned effects, a synthetic resin molded article having convex portions with a rich soft feel can be easily manufactured.
第1〜12図は本発明を具体化した合成樹脂成形品の製
造方法の実施例を示し、第1図はモデルの断面図、第2
図はマスターモデルの断面図、第3図は該マスターモデ
ルにエポキシ樹脂を注入してマンドレルを形成したとき
の断面図、第4図は該マンドレルの断面図、第5図は該
マンドレルに導電被膜を形成したときの断面図、第6図
は該導電被膜に電鋳金型を電鋳形成したときの波面図、
第7図は該電鋳金型の断面図、第8図は該電鋳金型の部
分拡大斜視図、第9図は該電鋳金型に塩化ビニル樹脂パ
ウダを付着させたときの断面図、第10図は該塩化ビニ
ル樹脂により中間成形品が成形されたときの断面図、第
11図は該中間成形品の断面図、第12図は合成樹脂成
形品の断面図である。
第13〜24図は従来の合成樹脂成形品の製造方法を示
し、第13図はモデルの断面図、第14図はマスターモ
デルの断面図、第15図は該マスターモデルにシリコン
ゴムを注入して中間型を形成したときの断面図、第16
図は該中間型の断面図、第17図は該中間型にエポキシ
樹脂を注入してマンドレルを形成したときの断面図、第
18図は該マンドレルの断面図、第19図は該マンドレ
ルに導電被膜を形成したときの断面図、第20図は該導
電被膜に電鋳金型を電鋳形成したときの断面図、第21
図は該電鋳金型の断面図、第22図は該電鋳金型に塩化
ビニル樹脂パウダを付着させたときの断面図、第23図
は該塩化ビニル樹脂により合成樹脂成形品が成形された
ときの断面図、第24図は該合成樹脂成形品の断面図で
ある。
1・・・合成樹脂成形品、 7・・・凹部、9・・・マ
ンドレル、 10・・・導電被膜、11・・・凸部、
13・・・電鋳金型、15・・・合成樹脂
材料としての塩化ビニル樹脂パウダ、
16・・・凹部、 18・・・中間成形品、
19・・・凸部。1 to 12 show an example of the method for manufacturing a synthetic resin molded product embodying the present invention, and FIG. 1 is a sectional view of the model, and FIG.
The figure is a cross-sectional view of the master model, Figure 3 is a cross-sectional view when epoxy resin is injected into the master model to form a mandrel, Figure 4 is a cross-sectional view of the mandrel, and Figure 5 is a conductive coating on the mandrel. 6 is a wavefront diagram when an electroforming mold is electroformed on the conductive film,
FIG. 7 is a sectional view of the electroforming mold, FIG. 8 is a partially enlarged perspective view of the electroforming mold, FIG. 9 is a sectional view when vinyl chloride resin powder is attached to the electroforming mold, and FIG. 10 is a sectional view of the electroforming mold. The figure is a cross-sectional view of an intermediate molded product molded from the vinyl chloride resin, FIG. 11 is a cross-sectional view of the intermediate molded product, and FIG. 12 is a cross-sectional view of a synthetic resin molded product. Figures 13 to 24 show a conventional method for manufacturing synthetic resin molded products, with Figure 13 being a cross-sectional view of the model, Figure 14 being a cross-sectional view of the master model, and Figure 15 showing the process of injecting silicone rubber into the master model. Cross-sectional view when an intermediate mold is formed, No. 16
The figure is a sectional view of the intermediate mold, FIG. 17 is a sectional view of the mandrel formed by injecting epoxy resin into the intermediate mold, FIG. 18 is a sectional view of the mandrel, and FIG. 19 is a sectional view of the mandrel. FIG. 20 is a cross-sectional view when a film is formed, and FIG. 21 is a cross-sectional view when an electroforming mold is electroformed on the conductive film.
The figure is a cross-sectional view of the electroforming mold, Figure 22 is a cross-sectional view when vinyl chloride resin powder is attached to the electroforming mold, and Figure 23 is a cross-sectional view when a synthetic resin molded product is molded with the vinyl chloride resin. FIG. 24 is a cross-sectional view of the synthetic resin molded product. DESCRIPTION OF SYMBOLS 1... Synthetic resin molded product, 7... Recessed part, 9... Mandrel, 10... Conductive coating, 11... Convex part,
13... Electroforming mold, 15... Vinyl chloride resin powder as synthetic resin material, 16... Concave portion, 18... Intermediate molded product,
19...Protrusion.
Claims (1)
脂材料(15)を付着させることにより凹部(16)を
備えた中間成形品(18)を成形する工程と、前記中間
成形品(18)の凹部(16)を裏返すことにより凸部
(19)を備えた合成樹脂成形品(1)を形成する工程
とからなる合成樹脂成形品の製造方法。 2、凹部(7)を備えたマンドレル(9)を形成する工
程と、前記マンドレル(9)の表面に導電被膜(10)
を形成する工程と、前記導電被膜(10)の表面に電鋳
を行うことにより凸部(11)を備えた電鋳金型(13
)を製造する工程と、前記マンドレル(9)から電鋳金
型(13)を剥離する工程と、前記電鋳金型(13)の
表面に合成樹脂材料(15)を付着させることにより凹
部(16)を備えた中間成形品(18)を成形する工程
と、前記中間成形品(18)の凹部(16)を裏返すこ
とにより凸部(19)を備えた合成樹脂成形品(1)を
形成する工程とからなる合成樹脂成形品の製造方法。[Claims] 1. An intermediate molded product (18) having a concave portion (16) is molded by attaching a synthetic resin material (15) to the surface of a mold (13) having a convex portion (11). and forming a synthetic resin molded product (1) having a convex portion (19) by turning over the concave portion (16) of the intermediate molded product (18). 2. Forming a mandrel (9) with a recess (7), and forming a conductive coating (10) on the surface of the mandrel (9).
and electroforming mold (13) provided with convex portions (11) by performing electroforming on the surface of the conductive coating (10).
), peeling off the electroforming mold (13) from the mandrel (9), and attaching a synthetic resin material (15) to the surface of the electroforming mold (13) to form a recess (16). and a step of forming a synthetic resin molded product (1) having a convex portion (19) by turning over the concave portion (16) of the intermediate molded product (18). A method for manufacturing a synthetic resin molded product comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4351389A JPH02223413A (en) | 1989-02-25 | 1989-02-25 | Manufacture of molded product of synthetic resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4351389A JPH02223413A (en) | 1989-02-25 | 1989-02-25 | Manufacture of molded product of synthetic resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02223413A true JPH02223413A (en) | 1990-09-05 |
Family
ID=12665816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4351389A Pending JPH02223413A (en) | 1989-02-25 | 1989-02-25 | Manufacture of molded product of synthetic resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02223413A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020088795A (en) * | 2001-05-21 | 2002-11-29 | 유림산업 주식회사 | Product manufacture method using skin mold for molding |
| KR100410883B1 (en) * | 2001-07-23 | 2003-12-12 | 현대자동차주식회사 | Manufacturing method for embossed skin mold of prototype-car components |
-
1989
- 1989-02-25 JP JP4351389A patent/JPH02223413A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020088795A (en) * | 2001-05-21 | 2002-11-29 | 유림산업 주식회사 | Product manufacture method using skin mold for molding |
| KR100410883B1 (en) * | 2001-07-23 | 2003-12-12 | 현대자동차주식회사 | Manufacturing method for embossed skin mold of prototype-car components |
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