JPH02225366A - Production of oxide sintered compact - Google Patents
Production of oxide sintered compactInfo
- Publication number
- JPH02225366A JPH02225366A JP1045454A JP4545489A JPH02225366A JP H02225366 A JPH02225366 A JP H02225366A JP 1045454 A JP1045454 A JP 1045454A JP 4545489 A JP4545489 A JP 4545489A JP H02225366 A JPH02225366 A JP H02225366A
- Authority
- JP
- Japan
- Prior art keywords
- sintered
- ito
- sintered body
- temperature
- sintering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Physical Vapour Deposition (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【発明の詳細な説明】
【産業上の利用分野]
本発明は酸化インジウム・酸化スズ(以下!TOと2.
載)焼結体の%A遣方法に用途に関するものである。Detailed Description of the Invention [Industrial Field of Application] The present invention relates to indium oxide/tin oxide (hereinafter referred to as !TO and 2.
) This relates to the use of %A of sintered bodies.
[従来の技術]
近年、太陽電池や液晶デイスプレーの適切電極やタッチ
パネルなどに用いる透明導電性膜とじてITO薄膜の需
要が急増している。このようなlTo薄膜の形成方法と
してはITO微粒子を基材の表面に塗布する方法、IT
O前駆体を基材の表面に塗布した後熱分解する方法、又
はITO焼結体ターゲットをスパッタリングする方法等
が知られているが、現在では特にスパッタリング法が最
も一般的に用いられている0本発明によるITO煉結体
は、スパッタリング法によって透明導電性膜を作成する
隙のスパッタリングターゲットとして、極めて優れた性
能を有するものである。[Prior Art] In recent years, there has been a rapid increase in demand for ITO thin films as transparent conductive films used in solar cells, suitable electrodes for liquid crystal displays, touch panels, and the like. Methods for forming such an ITo thin film include coating ITO fine particles on the surface of a base material,
Methods such as applying an O precursor to the surface of a base material and then thermally decomposing it, or sputtering an ITO sintered target are known, but sputtering is currently the most commonly used method. The ITO brick body according to the present invention has extremely excellent performance as a sputtering target for forming a transparent conductive film by a sputtering method.
従来ITO焼結体は酸化インジウムと酸化スズの粉末を
混合したものを加圧成型後、焼結させることによって製
造されている。しかしITO粉末は難焼結性のため、こ
れまでITO焼結体を用いた際のスパッタリングによる
成膜操作性及び得られる透明導電膜が品質に優れたもの
であるITO焼結体を製造することは非常に困難であつ
た。Conventionally, ITO sintered bodies have been manufactured by press-molding a mixture of indium oxide and tin oxide powders and then sintering the mixture. However, since ITO powder is difficult to sinter, it has not been possible to manufacture an ITO sintered body that has excellent film forming operability by sputtering and the quality of the resulting transparent conductive film when using an ITO sintered body. was extremely difficult.
従来のITOa結体の色調は黄緑色で、焼結粒子は結晶
性の低い球状あるいは不定形のものであった。このよう
な!丁0焼結体は結晶性が低いために割れやすく、また
成膜時に投入可能な電力が苦しく小くなるためにスパッ
タリングによる成膜速度が遅く、さらに放電状態が非常
に不安定であった。さらに従来のITO焼結体ではスパ
ッタ時に焼結体表面に還元物質(黒色物質)が生成し、
このものが、a材表面に生成する透明導電膜の質低下を
もたらすので、焼結体表面に還元物質が生成する毎に運
転を停止してこれを除去しなければならなかった。そし
てこのことがスパッタリングの連続運転において著しい
障害となっており、これらの問題はスパッタリングによ
るITOFWIIKの生成技術において著しい制約とな
っていた。The color tone of conventional ITOa bodies is yellowish green, and the sintered particles are spherical or amorphous with low crystallinity. like this! The 00 sintered body was easily cracked due to its low crystallinity, and the power that could be input during film formation was painfully small, resulting in a slow film formation rate by sputtering, and the discharge state was extremely unstable. Furthermore, in conventional ITO sintered bodies, reducing substances (black substances) are generated on the surface of the sintered bodies during sputtering.
Since this substance deteriorates the quality of the transparent conductive film formed on the surface of material a, the operation had to be stopped and removed every time a reducing substance was formed on the surface of the sintered body. This has been a significant hindrance in the continuous operation of sputtering, and these problems have been a significant constraint on the technology for producing ITOFWIIK by sputtering.
スパッタリングターゲットとして好適に用いられる高密
度あるいは低抵抗なITO焼結体を得る方法はいくつか
提案されている
例えば−旦1200℃以上で仮焼したITO粉末を原料
に用いることにより高密度とすることが提案されている
(特開昭62−21751 )。しかしこの方法で得ら
れるITO焼結体の焼結密度は5g/cm’以下で黄H
色であり、これをターゲットとして用いてスパッタリン
グすると焼結体表面が黒色化し、透明導電膜の品質安定
化には至らなかった。またITO焼結体に酸素の格子欠
陥を導入することにより焼結体を低抵抗化する方法が提
案されている(特開昭63−40756 )。しかし酸
素の格子欠陥が多いITOではその焼結体は低抵抗には
なるか、スパッタリング成膜時における酸素導入−の7
1竪、均一な成膜という点に問題が有り、この方法も必
ずしも満足のいく方法ではなかった。Several methods have been proposed to obtain a high density or low resistance ITO sintered body suitable for use as a sputtering target. has been proposed (Japanese Patent Laid-Open No. 62-21751). However, the sintered density of the ITO sintered body obtained by this method is less than 5 g/cm', and the yellow H
When sputtering using this as a target, the surface of the sintered body turned black, and the quality of the transparent conductive film could not be stabilized. Furthermore, a method has been proposed for reducing the resistance of an ITO sintered body by introducing oxygen lattice defects into the sintered body (Japanese Patent Laid-Open No. 63-40756). However, with ITO, which has many oxygen lattice defects, the sintered body will not have low resistance.
There was a problem in forming a film vertically and uniformly, and this method was not always satisfactory.
[本発明が解決しようとする3題コ
本発明の目的は、上記した間之点を改善できるITo焼
結体の製造方法を提供することにある。[Three Problems to be Solved by the Present Invention] An object of the present invention is to provide a method for manufacturing an ITo sintered body that can improve the above-mentioned disadvantages.
[課題を解決する手段〕
本発明者等はITO焼結体に関し鋭意検討を重ねた結果
、lTO粉末を1400℃を越える高温で焼結させると
、得られたITO焼結体は焼結粒子の表面が平面となる
まで結晶成長したものとなり、可視部に吸収を持つバン
ド構造となった暗緑色から黒色の焼結体が得られること
を見出し、そのような焼結体は低抵抗であり、かつこの
ようなIT0焼結体を用いてスパッタリングすることに
よって得られる透明導電膜は低抵抗で、又可視透IA率
も従来以上のものであることを見出し、本発明を完成す
るに至ったものである。[Means for Solving the Problems] As a result of intensive studies regarding ITO sintered bodies, the present inventors found that when ITO powder is sintered at a high temperature exceeding 1400°C, the obtained ITO sintered bodies have sintered particles. It was discovered that a dark green to black sintered body can be obtained which has crystal growth until the surface becomes flat and has a band structure with absorption in the visible region, and that such a sintered body has low resistance. We also discovered that the transparent conductive film obtained by sputtering using such an IT0 sintered body has low resistance and a visible transmittance IA higher than that of the conventional one, which led us to complete the present invention. It is.
即ち本発明は、酸化インジウム・・酸化スズ粉末を14
00℃を越える温度で焼結し焼結粒子表面の少なくとも
一部が平面となるまで結晶成長させ、可視波長領域光の
反射が20%以下で、暗緑色を呈する高結晶性酸化イン
ジウム・酸化スズ焼結体の製造方法に関するものである
。That is, in the present invention, indium oxide/tin oxide powder is
Highly crystalline indium oxide/tin oxide that is sintered at a temperature exceeding 00°C and grown as a crystal until at least a portion of the sintered particle surface becomes flat, reflecting less than 20% of visible wavelength light and exhibiting a dark green color. The present invention relates to a method for manufacturing a sintered body.
本発明で用いるITO粉末の製造方法はいかなる方法も
適用できるが、例えば各々の金属水酸化物、酸化物水和
物、有機金属塩又は無機金属塩の粉末、あるいはそれぞ
れのゾル又はゲルを加熱脱水又は熱分解する方法。また
ITOを共沈法で得る方法があるがこれらのいかなる方
法で得られたものでも良い。例えば、インジウム塩とス
ズ塩の混合水溶液に沈殿剤を添加(特開昭62−762
7、特開昭6O−IJlfi41B)又は加水分解(特
開昭58−38925)した後沈殿物を加熱分解する方
法等がある。Any method can be used to produce the ITO powder used in the present invention, but for example, each metal hydroxide, oxide hydrate, organic metal salt or inorganic metal salt powder, or each sol or gel is heated and dehydrated. Or a method of thermal decomposition. There is also a method of obtaining ITO by a coprecipitation method, but ITO obtained by any of these methods may be used. For example, adding a precipitant to a mixed aqueous solution of indium salt and tin salt (Japanese Patent Application Laid-Open No. 62-762
7, JP-A-6O-IJlfi41B) or a method of thermally decomposing the precipitate after hydrolysis (JP-A-58-38925).
さらにインジウムとスズの混合有機酸水溶液から得られ
る混合有機酸塩を熱分解する方法(特開昭62−195
101)も本発明で用いるに適したITO共沈粉末を提
供し得る。Furthermore, a method for thermally decomposing a mixed organic acid salt obtained from a mixed organic acid aqueous solution of indium and tin (Japanese Unexamined Patent Publication No. 62-195
101) may also provide an ITO co-precipitated powder suitable for use in the present invention.
これらの方法で得られる酸化インジウム、酸化スズ又は
ITO粉末の一次粒径は一般に数μ■から0.01μm
程度であるが、本発明で用いるこれらの粉末の粒径とし
てはlu1以下、特に0.−μ層から0,05μmの範
囲のものが好ましい。酸化物の焼結性は一次粒径が微細
であるほど良好であるため、微細なITO粉末からはよ
り結晶性が良くかつ高密度な焼結体が得られる。The primary particle size of indium oxide, tin oxide or ITO powder obtained by these methods is generally from several μm to 0.01 μm.
However, the particle size of these powders used in the present invention is 1 l or less, particularly 0. - A range of 0.05 μm from the μ layer is preferred. The finer the primary particle size, the better the sinterability of the oxide, so a finer ITO powder can yield a sintered body with better crystallinity and higher density.
本発明ではITO粉末の焼結温度が重要である。In the present invention, the sintering temperature of the ITO powder is important.
本発明の焼結体を得るための焼結温度は1400℃を越
える温度が必要であり、特に好ましくは1450℃以上
であることである。lτ0の焼結は約1050℃から開
始するが、1400℃以下では本発明に特徴的な焼結粒
子の成長が進行せず、1800℃以上では焼結粒子は成
長するがスズが揮散する。そのため本発明の焼結温度は
1400℃を越える温度から18[)D”C1特に好ま
しくは1450℃〜1700℃以下である。The sintering temperature for obtaining the sintered body of the present invention needs to be higher than 1400°C, particularly preferably 1450°C or higher. Sintering of lτ0 starts at about 1050°C, but at temperatures below 1400°C, the growth of sintered particles characteristic of the present invention does not proceed, and at temperatures above 1800°C, sintered particles grow but tin volatilizes. Therefore, the sintering temperature in the present invention ranges from a temperature exceeding 1400°C to 18[)D''C1, particularly preferably from 1450°C to 1700°C.
本発明の焼結温度での保持時間は数時間から数+時間、
特に5時間から20時間で十分である。ざらに焼結時に
おける昇温速度及び降温速度、特に降温速度が焼結粒子
の形成に大きく影響するため、昇温速度及び隣温辻度は
200℃1時間以下、特に100″C/時間以下が望ま
しい。The holding time at the sintering temperature of the present invention ranges from several hours to several + hours.
In particular, 5 to 20 hours is sufficient. The temperature increase rate and temperature decrease rate during sintering, especially the temperature decrease rate, greatly affects the formation of sintered particles, so the temperature increase rate and temperature cross-sectional temperature should be 200℃ or less for 1 hour, especially 100"C/hour or less. is desirable.
本発明では焼結にさきだって原料ITO粉末を予ら成型
する。この子偏成型は、通常の方法例えばを金型に封入
し圧力を加えて成形する。In the present invention, the raw material ITO powder is preformed prior to sintering. This uneven molding is carried out by a conventional method, for example, by enclosing the mold in a mold and applying pressure.
又、原$41 T O粉末の酸化インジウム、酸化スズ
のvI含は、酸化インジウムノ酸化スズー98ノ2〜8
0/20、特に9515〜90/10の範囲が好ましい
。In addition, the vI content of indium oxide and tin oxide in the original $41 TO powder is indium oxide and tin oxide 98-2 to 8.
A range of 0/20, particularly 9515 to 90/10 is preferred.
上記した条件で原¥41TO粉末を焼結することにより
本発明で限定した焼結体が得られる。By sintering the raw TO powder under the above conditions, the sintered body defined in the present invention can be obtained.
ITO焼結体の焼結密度は、スズの含有−によって多少
+Aするが、理論密度100%の焼結体の焼結密度は、
約7.1g/cm3である。本発明で得られる焼結体の
焼結密度は4.5gノC暑 から7−0g/cs’ 、
特に本発明で得る特徴的な焼結粒子を形成した場合、多
くは5.5H/c−以上の高密度の焼結体となる。The sintered density of an ITO sintered body increases somewhat by +A depending on the tin content, but the sintered density of a sintered body with a theoretical density of 100% is
It is about 7.1 g/cm3. The sintered density of the sintered body obtained by the present invention ranges from 4.5g/cs' to 7-0g/cs',
In particular, when the characteristic sintered particles obtained by the present invention are formed, the resulting sintered bodies often have a high density of 5.5 H/c- or more.
本発明で得られるITO焼結体は、従来のITO焼結体
とは異なり各焼結粒子の表面の一邪又は全てが平面とな
るまで成長したものであり又このものは、バルクのバン
ド構造が変化し、従来の黄緑色ではなくti緑色から黒
色を呈した焼結体となる。従来のITO焼結体が、焼結
体の光反射率から、赤外及び紫外領域に著しい吸収を持
ち、その波長領域の光反射率はlO%程度であるのに対
して、可視領域においては吸収が小さく40%近(反射
する。−力木発明で得たITO焼結体は赤外及び紫外M
l域の吸収は従来のものと同様であるが、可視領域にお
ける吸収が著しく大きく、可視領域光を20%以下、多
くは10%以下しか反射しない。これらの違いはITO
結晶のバンド構造の変化によるものと考えられる。この
ような本発明の可視領域光を吸収するITO焼結体のス
パッタリングにより得られる透明導電膜は可視光領域に
おいて高透明なものが得られる。またこのようなバンド
構造変化により本発明の焼結体の比抵抗はlXl0’Ω
・cl以下多くは5X10’Ω・01以下となる。The ITO sintered body obtained by the present invention differs from conventional ITO sintered bodies in that each sintered particle has grown until one or all of the surfaces become flat, and this one has a bulk band structure. The color of the sintered body changes, and the color of the sintered body changes from ti-green to black instead of the conventional yellow-green color. Conventional ITO sintered bodies have significant absorption in the infrared and ultraviolet regions due to the light reflectance of the sintered bodies, and while the light reflectance in these wavelength regions is about 10%, in the visible region It has a small absorption of about 40% (reflects.) - The ITO sintered body obtained by the Rikiki invention has infrared and ultraviolet M
The absorption in the I region is similar to that of conventional products, but the absorption in the visible region is extremely large, reflecting less than 20%, often less than 10%, of light in the visible region. These differences are ITO
This is thought to be due to changes in the band structure of the crystal. The transparent conductive film obtained by sputtering the ITO sintered body that absorbs light in the visible region of the present invention has high transparency in the visible light region. Furthermore, due to such a change in band structure, the specific resistance of the sintered body of the present invention is 1Xl0'Ω
・Most of the resistance below cl is 5X10'Ω・01 or below.
[発明の効果]
本発明による高結晶性ITO焼結体は透明導電膜を作成
するスパッタリングターゲットとして極めて優れた性能
を有している。まず非常に結晶性の良い焼結体粒子表面
をスパッタリングすることによって得られる透明導電膜
は、結合性に優れた酸化物イオンが基板上に透明導電膜
として堆積する二とによって形成されるため、特に導電
性が優れており、比抵抗で2X10−’Ω・cm以下が
可能である。また操作性において、結晶性の良いITO
焼結体は割れ難く、さらに焼結体にアルゴンイオンのグ
ーゲット表面のエツチング率、すなわちスパツタ率が向
上し、その結果スパッタリング速度が速くなる。加えて
焼結体表面の結晶性が良いためにスパッタリングによる
酸素の選択的なスパッタリングが起こり難く、透明導電
膜の品質低下を引き起こすターゲット表面の還元が抑制
され、透明導電膜作成の膜質及び連続運転において極め
て有利となる。また本発明の焼結体の色=変化が酸素の
酵素欠陥によるものではないため、スパッタリングによ
りて得られる透明導電膜が非常に均一で週明である。[Effects of the Invention] The highly crystalline ITO sintered body according to the present invention has extremely excellent performance as a sputtering target for creating a transparent conductive film. First, a transparent conductive film obtained by sputtering the surface of a sintered particle with very good crystallinity is formed by oxide ions with excellent bonding properties being deposited as a transparent conductive film on a substrate. In particular, it has excellent conductivity, and can have a specific resistance of 2×10-'Ω·cm or less. In addition, in terms of operability, ITO with good crystallinity
The sintered body is difficult to crack, and furthermore, the etching rate of the googet surface of the sintered body with argon ions, that is, the sputtering rate is improved, and as a result, the sputtering rate is increased. In addition, because the surface of the sintered body has good crystallinity, selective sputtering of oxygen during sputtering is difficult to occur, and reduction of the target surface that causes quality deterioration of the transparent conductive film is suppressed, which improves the quality of the transparent conductive film and the continuous operation. This is extremely advantageous. Furthermore, since the color change of the sintered body of the present invention is not due to oxygen enzyme defects, the transparent conductive film obtained by sputtering is very uniform and bright.
また特に共沈によって得られたITO粉末を用いて得た
焼結体は、焼結体中の組成分布が極めて均一であるため
、得られる透明導電膜中の組成もより均一となり、均質
な透明導電膜が得られる。In particular, the sintered body obtained using ITO powder obtained by coprecipitation has an extremely uniform composition distribution in the sintered body, so the composition of the resulting transparent conductive film is also more uniform, resulting in a homogeneous transparent film. A conductive film is obtained.
これらの諸性質から本発明における高密度ITO焼結体
はスパッタリングターゲットとして極めて侵れた性能が
期待できる。From these properties, the high-density ITO sintered body of the present invention can be expected to have extremely excellent performance as a sputtering target.
【実施例コ
以下、実施例に基づき本発明を説明するが、本発明はこ
れに限定されるものではない。[Example] The present invention will be explained below based on Examples, but the present invention is not limited thereto.
実施例1
インジウムlスズ比が90710の割合でこれらを含む
酢酸水溶液を濃縮し、インジウム・スズ混合酢酸塩を得
、当該酢酸塩を熱分解することによりITO共沈粉末を
調製した。Example 1 An acetic acid aqueous solution containing these at an indium/tin ratio of 90,710 was concentrated to obtain an indium/tin mixed acetate, and the acetate was thermally decomposed to prepare an ITO coprecipitated powder.
二の共沈粉末を金型で加圧成型し、3.7g/c+a”
の成型体とした後、常圧、大気中で1500℃で加熱焼
結した。焼結における昇温速度は100℃1時間、15
00℃では10時間保持、降温速度は100℃1時間と
した。このような焼結条件で、焼結密度64g/e−1
比抵抗3X10−’Ω・C■の焼結体が得られた。Pressure mold the second coprecipitated powder with a mold, 3.7g/c+a"
After forming a molded body, it was heated and sintered at 1500° C. in the atmosphere at normal pressure. The temperature increase rate during sintering is 100°C for 1 hour, 15
The temperature was maintained at 00°C for 10 hours, and the temperature drop rate was 100°C for 1 hour. Under these sintering conditions, the sintered density was 64 g/e-1
A sintered body with a specific resistance of 3×10-'Ω·C was obtained.
走査型電子顕微鏡による観察からこの焼結体の焼結粒子
は表面が平面となるまで成長しており、焼結体の色調は
暗緑色から黒色で、550n■における光反射率は9%
であった。またElectron Prove Mlc
ro Analyzer(EPMA) による組成分
析によ°ると黄緑色の焼結体と同様酸化物であった。組
成分析結果を表1に示す。又、焼結体の焼結粒子の走査
型電子類rIL鏡による像(5(100倍)を図1に、
光反射特性を図2(1)に示す。Observation with a scanning electron microscope shows that the sintered particles of this sintered body have grown until the surface becomes flat, the color tone of the sintered body is dark green to black, and the light reflectance at 550 nm is 9%.
Met. Also Electron Prove Mlc
According to the composition analysis using RO Analyzer (EPMA), it was found to be an oxide like the yellow-green sintered body. The compositional analysis results are shown in Table 1. In addition, an image (5 (100x)) of the sintered particles of the sintered body by a scanning electronic rIL mirror is shown in Figure 1.
The light reflection characteristics are shown in FIG. 2(1).
実施例2
実施例1で得られた焼結体を用い、DCマグネトロンス
パッタリングによる成膜を行った。スパッタリング条件
を表2に、得られた透明導電膜の特性を表3に示した。Example 2 Using the sintered body obtained in Example 1, a film was formed by DC magnetron sputtering. The sputtering conditions are shown in Table 2, and the characteristics of the obtained transparent conductive film are shown in Table 3.
当該高結晶性ITO焼結体では極めて高速で低抵抗、高
透明な成膜が可能であった。With the highly crystalline ITO sintered body, it was possible to form a film with low resistance and high transparency at extremely high speed.
実施例3
酢酸インジウム、酢酸スズをそれぞれ熱分解し、酸化イ
ンジウム及び酸化スズをれ3i製した後、酸化インジウ
ムl酸化スズ比が90/10となるように混合した。そ
の後は実施例1と同様の条件で焼結体を:l!製し、焼
結密度6.1g/cm” 、比抵抗4X10−4Ω・C
−の焼結体が得られた。実施例1と同様に走査型電子顕
微鏡観察によると焼結体の焼結粒子は表面が平面となる
まで成長しており、焼結体の色調は暗緑色から黒色で5
5on−における光反射率は11%であった。またEP
MAによる組成分析によると従来の黄緑色の焼結体と同
様酸化物であった。Example 3 Indium acetate and tin acetate were respectively thermally decomposed to produce indium oxide and tin oxide, and then mixed so that the ratio of indium oxide to tin oxide was 90/10. After that, the sintered body was made under the same conditions as in Example 1: l! sintered density 6.1g/cm", specific resistance 4X10-4Ω・C
- A sintered body was obtained. As in Example 1, scanning electron microscope observation revealed that the sintered particles of the sintered body had grown until the surface became flat, and the color tone of the sintered body was from dark green to black.
The light reflectance at 5on- was 11%. Also EP
According to the composition analysis by MA, it was an oxide like the conventional yellow-green sintered body.
組成分析結果を表1に示す。焼結体の焼結粒子の走査型
電子顕微鏡による像(2000倍)を図3に、光反射特
性を図2(2)に示す。The compositional analysis results are shown in Table 1. A scanning electron microscope image (2000x) of the sintered particles of the sintered body is shown in FIG. 3, and the light reflection characteristics are shown in FIG. 2 (2).
実施例4
実施例3で得られた焼結体を用い、DCマグネトロンス
パッタリングによる成膜を行った。スパッタリング条件
を表2に、得られた透明導電膜の特性を表3に示した。Example 4 Using the sintered body obtained in Example 3, a film was formed by DC magnetron sputtering. The sputtering conditions are shown in Table 2, and the characteristics of the obtained transparent conductive film are shown in Table 3.
この高結晶性ITO焼結体も実施例2同林、極めて高速
に低抵抗、高透明な成膜が可能であった。As in Example 2, this highly crystalline ITO sintered body could also be formed into a low resistance, highly transparent film at extremely high speed.
比較例1
実施例3で使用したITO粉末を1300℃で焼結し、
焼結密度4.5g/cm 、比抵抗2XIO−3Ω”
cmの焼結体を得た。Comparative Example 1 The ITO powder used in Example 3 was sintered at 1300°C,
Sintered density 4.5g/cm, specific resistance 2XIO-3Ω"
A sintered body of cm was obtained.
走査型電子類m鏡観察からこの焼結体の焼結粒子は不定
形で、焼結体の色調は黄緑色で550nsにおける光反
射率は45%であった。またEPMAによる組成分析か
らこのものは酸化物であった。組成分析結果を表1に示
す、この焼結体の焼結粒子の走査型電子顕微fIl像(
2000倍)を図4に、光反射特性を図2(3)に示す
。比較例2
比較例1で得た焼結体を用い実施例2.3と同様な条件
でDCマグネトロンスパッタリングによる成膜を行った
。Scanning electron microscope observation revealed that the sintered particles of this sintered body were irregular in shape, the color of the sintered body was yellowish green, and the light reflectance at 550 ns was 45%. Furthermore, compositional analysis by EPMA revealed that this material was an oxide. The compositional analysis results are shown in Table 1, and the scanning electron microscope fl image of the sintered particles of this sintered body (
2000 times) is shown in FIG. 4, and the light reflection characteristics are shown in FIG. 2 (3). Comparative Example 2 Using the sintered body obtained in Comparative Example 1, film formation was performed by DC magnetron sputtering under the same conditions as in Example 2.3.
スパッタリング条件を表2に、得られた透明導電膜の特
性を表3に示した。このITOfi結体では成膜速度が
遅く、特に導電性の低い透明導電膜しか得られなかった
。The sputtering conditions are shown in Table 2, and the characteristics of the obtained transparent conductive film are shown in Table 3. With this ITOfi aggregate, the film formation rate was slow, and only a transparent conductive film with particularly low conductivity could be obtained.
表1 表2 表3Table 1 Table 2 Table 3
図1.3.4は実施例、比較例で得た焼結体の結晶粒子
の構造を示す図面代用の、走査型電子顕微?7!耳真で
、図2は実施例、比較例で得た焼結体の光反射特性を示
す図である。図中(1)、(2)、(3)は夫々実施例
1.3、比較例1の結果を示す。
特許出願人 東ソー株式会社
2面のn・占(内容に変更なし)
図2
波長 (nm)
80゜
I!13
手続補正書
(方式)
6補正の内容
「願書に最初に添付した図面(図2)の浄書°別紙のと
おり平成
年
7月18日
(内容に変更なし)」
特5′1庁長官
占■文穀殿
11件の表示
平成1年特許願第45454号
2発明の名称
酸化物焼結体の製造方法
3?!i正をする者
事件との関係
特二′E出願人
住所〒748山口県新i!i陽市大字富田4560番地
東ソー株式会社 特 許 室
電話番号(505)4471Figure 1.3.4 is a scanning electron microscope used as a substitute for a drawing showing the structure of crystal grains of the sintered bodies obtained in Examples and Comparative Examples. 7! FIG. 2 is a diagram showing the light reflection characteristics of the sintered bodies obtained in Examples and Comparative Examples. In the figure, (1), (2), and (3) show the results of Example 1.3 and Comparative Example 1, respectively. Patent applicant: Tosoh Co., Ltd. Page 2 n・Zan (no change in content) Figure 2 Wavelength (nm) 80°I! 13 Procedural amendment (formality) 6. Contents of the amendment “Engraving of the drawing (Figure 2) originally attached to the application dated July 18, 2008 as shown in the attached sheet (no change in content)” Bunkoden 11 Displays 1999 Patent Application No. 45454 2 Name of Invention Method for Manufacturing Oxide Sintered Body 3? ! Relationship with case of person who makes i correction Special 2'E Applicant Address 748 Yamaguchi Prefecture New i! Tosoh Corporation Patent Office 4560 Oaza Tomita, Iyo City Telephone number (505) 4471
Claims (1)
る温度で焼結し焼結粒子表面の少なくとも一部が平面と
なるまで結晶成長させ、可視波長領域光の反射が20%
以下で、暗緑色を呈する高結晶性酸化インジウム・酸化
スズ焼結体の製造方法。 2)酸化インジウム・酸化スズ粉末が共沈法により得た
ものを用いる特許請求の範囲第1項記載の方法。[Claims] 1) Indium oxide/tin oxide powder is sintered at a temperature exceeding 1400°C and crystals are grown until at least a part of the sintered particle surface becomes flat, so that the reflection of light in the visible wavelength range is 20%.
The following describes a method for producing a highly crystalline indium oxide/tin oxide sintered body that exhibits a dark green color. 2) The method according to claim 1, in which the indium oxide/tin oxide powder is obtained by a coprecipitation method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1045454A JPH02225366A (en) | 1989-02-28 | 1989-02-28 | Production of oxide sintered compact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1045454A JPH02225366A (en) | 1989-02-28 | 1989-02-28 | Production of oxide sintered compact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02225366A true JPH02225366A (en) | 1990-09-07 |
Family
ID=12719797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1045454A Pending JPH02225366A (en) | 1989-02-28 | 1989-02-28 | Production of oxide sintered compact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02225366A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06128019A (en) * | 1992-10-23 | 1994-05-10 | Sumitomo Metal Mining Co Ltd | Method for manufacturing ITO sintered body |
| WO1995018080A1 (en) * | 1993-12-28 | 1995-07-06 | Showa Denko Kabushiki Kaisha | Ito sintered body, ito transparent conductive film and method of forming the film |
| JP2012031460A (en) * | 2010-07-29 | 2012-02-16 | Sumitomo Metal Mining Co Ltd | Oxide vapor deposition material, transparent conductive film, and solar cell |
-
1989
- 1989-02-28 JP JP1045454A patent/JPH02225366A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06128019A (en) * | 1992-10-23 | 1994-05-10 | Sumitomo Metal Mining Co Ltd | Method for manufacturing ITO sintered body |
| WO1995018080A1 (en) * | 1993-12-28 | 1995-07-06 | Showa Denko Kabushiki Kaisha | Ito sintered body, ito transparent conductive film and method of forming the film |
| JP2012031460A (en) * | 2010-07-29 | 2012-02-16 | Sumitomo Metal Mining Co Ltd | Oxide vapor deposition material, transparent conductive film, and solar cell |
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