JPH0222542A - Photomask defect inspecting device - Google Patents

Photomask defect inspecting device

Info

Publication number
JPH0222542A
JPH0222542A JP63172868A JP17286888A JPH0222542A JP H0222542 A JPH0222542 A JP H0222542A JP 63172868 A JP63172868 A JP 63172868A JP 17286888 A JP17286888 A JP 17286888A JP H0222542 A JPH0222542 A JP H0222542A
Authority
JP
Japan
Prior art keywords
chip
photomask
data
stage
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63172868A
Other languages
Japanese (ja)
Inventor
Hiroyuki Shigemura
茂村　弘之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63172868A priority Critical patent/JPH0222542A/en
Publication of JPH0222542A publication Critical patent/JPH0222542A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To perform efficient inspection even with a photomask where a chip of different kind is inserted and to improve the inspection efficiency by performing the inspection by a chip comparison system and a data matching system continuously. CONSTITUTION:A stage 13 is driven by an X driver 10 and a Y driver 11 in the direction of an X and a Y axis and while the chip of the photomask 18 on the stage 13 is scanned, is irradiated with the light from a light source 12, so that sensors 14 and 15 receive its transmitted light through lenses 16 and 17. The chip A is inspected by using the chip comparison system which detects a defect part while comparing the signals of the sensors with each other by a defect detection part 7. Then the stage 13 is moved so that the inspection start point of an inserted chip B which is stored previously by a CPU 6 comes to the position of the lens 17, and only the chip B is scanned. The signal obtained from the lens 17 is compared with data which is extracted from the data of the chip B stored in the memory 4 in synchronism with the stage movement and a defect detection part 5 inspects the chip B by using the data matching system. A chip C is also inspected similarly.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体集積回路の製造工程に使用されるフォト
マスク上に発生する欠陥を検出するフォトマスク欠陥検
査装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a photomask defect inspection apparatus for detecting defects occurring on a photomask used in the manufacturing process of semiconductor integrated circuits.

〔従来の技術〕[Conventional technology]

従来、この種のフォトマスク欠陥検査装置としてはフォ
トマスク上の隣接する等しいチップを比較することによ
りこれらの間の不一致部分すなわち欠陥を検出するチッ
プ比較方式の検査装置と。Conventionally, this type of photomask defect inspection apparatus is a chip comparison type inspection apparatus that compares adjacent equal chips on a photomask to detect mismatched portions, that is, defects between them.

フォトマスク上のパターンを形成するために使用された
データと出来上がったフォトマスクのパターンを照合す
ることにより欠陥を検出するデータ照合方式の検査装置
がある。There is an inspection apparatus that uses a data comparison method to detect defects by comparing data used to form a pattern on a photomask with a pattern on a completed photomask.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のフォトマスク欠陥検査装置４はチップ比
較方式又はデータ照合方式のそれぞれ個別の機能を有す
るものであるために、例えば第３図に示すように同一チ
ップＡが配列された中に異種チップＢ及びＣが挿入され
たフォトマスクの欠陥検査を行う場合、チップ比較方式
では異種チップの欠陥検査ができず、別に異種チップの
みをデータ照合による検査、あるいは光学顕微鏡を用い
た検査を行う必要があり、検査効率が著しく悪いという
欠点がある。Since the conventional photomask defect inspection device 4 described above has separate functions of the chip comparison method and the data verification method, for example, as shown in FIG. When inspecting a photomask with B and C inserted, it is not possible to inspect different types of chips using the chip comparison method, and it is necessary to separately inspect only the different types of chips by data comparison or using an optical microscope. However, the drawback is that the inspection efficiency is extremely low.

本発明の目的は前記課題を解決したフォトマスク欠陥検
査装置を提供することにある。An object of the present invention is to provide a photomask defect inspection apparatus that solves the above problems.

〔発明の従来技術に対する相違点〕[Differences between the invention and the prior art]

上述した従来のフォトマスク欠陥検査装置に対し、本発
明はチップ比較方式とデータ照合方式の欠陥検査を連続
して行えるという相違点を有する。The present invention differs from the conventional photomask defect inspection apparatus described above in that it can perform defect inspection using the chip comparison method and the data comparison method in succession.

〔課題を解決するための手段〕[Means to solve the problem]

前記目的を達成するため、本発明はフォトマスク上に発
生する欠陥を検出するフォトマスク欠陥検査装置におい
て、フォトマスク上の隣接するチップ同士を比較して欠
陥を検出するチップ比較方式と、フォトマスク上のパタ
ーンを形成するためのデータとフォトマスク上に実際に
形成されたパターンのデータとを照合して欠陥を検出す
るデータ照合方式による欠陥検査を連続して行う機能を
有するものである。To achieve the above object, the present invention provides a photomask defect inspection apparatus for detecting defects occurring on a photomask, and a chip comparison method for detecting defects by comparing adjacent chips on a photomask. It has a function of continuously performing defect inspection using a data comparison method in which defects are detected by comparing the data for forming the upper pattern with the data of the pattern actually formed on the photomask.

〔実施例〕〔Example〕

以下、本発明の実施例を図により説明する。 Embodiments of the present invention will be described below with reference to the drawings.

（実施例１） 第１図は本発明の実施例１を示す構成図である。(Example 1) FIG. 1 is a configuration diagram showing a first embodiment of the present invention.

図において、１３はステージ、１０はステージ１３をＸ
軸方向に駆動するＸドライブ、１１はステージ１３をＸ
軸と直交するＹ軸方向に駆動するＹドライブ、１２は光
源、１４．１５はセンサ、１６．１７はレンズ、１８は
フォトマスクである。９はステージコントローラ、４は
メモリ、５，７は欠陥検出部、２，６はｃｐｕ、３はイ
ンターフェイス、ｌはテープである。In the figure, 13 is the stage, 10 is the stage 13
X drive 11 drives the stage 13 in the axial direction
12 is a light source, 14.15 is a sensor, 16.17 is a lens, and 18 is a photomask. 9 is a stage controller, 4 is a memory, 5 and 7 are defect detection units, 2 and 6 are CPUs, 3 is an interface, and l is a tape.

実施例において、被検フォトマスク１８は本チップＡ及
び挿入チップＢ、Ｃから構成されている。ステージ１３
をＸドライブ１０、Ｙドライブ１１でＸＹＹ軸方向駆動
させてステージ１３上のフォトマスク１８のチップを走
査しつつ光源１２から光を照射し、その透過光をフォト
マスクに配列されたチップサイズの整数倍（１，２，・
・・ｎ）の間隔にセットされたレンズ１６及び１７を通
してセンサ１４及び１５で受ける。この信号を欠陥検出
部７で比較しながら、信号の不一致部分すなわち欠陥部
を検出するチップ比較方式を用いて本チップＡの欠陥検
査を行う。本チップＡの欠陥検査が終了すると、ＣＰＵ
　６によりあらかじめ記憶させていた挿入チップＢの検
査スタート点がレンズ１７の位置にくるようにステージ
１３を移動させ次いでチップＢのみを走査する。In the embodiment, the photomask 18 to be tested is composed of a main chip A and insert chips B and C. stage 13
is driven in the XYY axis directions by the X drive 10 and Y drive 11 to scan the chips of the photomask 18 on the stage 13 while irradiating light from the light source 12, and transmitting the transmitted light to the integer size of the chips arranged on the photomask. times (1, 2,・
It is received by the sensors 14 and 15 through the lenses 16 and 17 set at an interval of . This chip A is inspected for defects using a chip comparison method in which the defect detection section 7 compares these signals and detects a signal mismatch portion, that is, a defective portion. When the defect inspection of this chip A is completed, the CPU
6, the stage 13 is moved so that the inspection start point of the inserted chip B, which has been stored in advance, is at the position of the lens 17, and then only the chip B is scanned.

レンズ１７から得られる信号と、テープ１より読み込み
、メモリ４にたくわえられた挿入チップＢのデータから
ステージ移動に同期させながら取り出したパターンデー
タとを比較し、欠陥検出部５によりデータネ−敷部すな
わち欠陥部を検出するデータ照合方式を用いて゛挿入チ
ップＢの欠陥検査を行う。挿入チップＣについても同様
に検査を実施し、フォトマスクの欠陥検査が終了する。The signal obtained from the lens 17 is compared with the pattern data read from the tape 1 and extracted from the data of the inserted chip B stored in the memory 4 in synchronization with the movement of the stage, and the defect detection unit 5 detects the data The inserted chip B is inspected for defects using a data matching method for detecting defective parts. The inserted chip C is similarly inspected, and the photomask defect inspection is completed.

（実施例２） 第２図は本発明の実施例２を示す構成図である。(Example 2) FIG. 2 is a configuration diagram showing a second embodiment of the present invention.

本実施例ではメモリ８を有するために、チップ比較方式
を行いながら、挿入チップＢ及びＣからの信号がレンズ
１７を通して入ってきたときにパターン情報をたくわえ
ておき、データ照合を実施することが可能である。従っ
て、−回の走査でフォトマスク全面の欠陥検査ができる
のでより効率的な検査ができる利点がある。Since this embodiment has the memory 8, it is possible to perform data comparison by storing pattern information when the signals from the inserted chips B and C enter through the lens 17 while performing the chip comparison method. It is. Therefore, since the entire surface of the photomask can be inspected for defects in -times of scanning, there is an advantage that more efficient inspection can be carried out.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明はチップ比較方式とデータ照
合方式による欠陥検査を連続して行える機能を有するこ
とにより、異種チップが挿入されたフォトマスクでも効
率的な欠陥検査が可能で検査効率を大巾に向上できる効
果がある。As explained above, the present invention has a function to perform continuous defect inspection using the chip comparison method and the data matching method, thereby enabling efficient defect inspection even on photomasks into which different types of chips are inserted, thereby increasing inspection efficiency. It has the effect of improving the width.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は本発明のフォトマスク欠陥検査装置を
示す構成図、第３図は異種チップが挿入されたフォトマ
スクの一配置例を示す図である。 １・・・テープ　　　　　　２，６・・・ＣＰＵ３・・
・インターフェイス　４，８・・・メモリ５．７・・・
欠陥検出部　　９・・・ステージコントローラ１０・・
・Ｘドライブ　　　　　１１・・・Ｙドライブ１２・・
・光源　　　　　　　１３・・・ステージ１４．１５・
・・センサ　　　　　１６，１７・・・レンズ１８・・
・フォトマスクFIGS. 1 and 2 are block diagrams showing a photomask defect inspection apparatus of the present invention, and FIG. 3 is a diagram showing an example of the arrangement of a photomask into which a different type of chip is inserted. 1... Tape 2, 6... CPU3...
・Interface 4, 8...Memory 5.7...
Defect detection section 9... Stage controller 10...
・X drive 11...Y drive 12...
・Light source 13...Stage 14.15・
...Sensor 16, 17...Lens 18...
・Photomask

Claims (1)

【特許請求の範囲】[Claims] （１）フォトマスク上に発生する欠陥を検出するフォト
マスク欠陥検査装置において、フォトマスク上の隣接す
るチップ同士を比較して欠陥を検出するチップ比較方式
と、フォトマスク上のパターンを形成するためのデータ
とフォトマスク上に実際に形成されたパターンのデータ
とを照合して欠陥を検出するデータ照合方式による欠陥
検査を連続して行う機能を有することを特徴とするフォ
トマスク欠陥検査装置。(1) In a photomask defect inspection device that detects defects occurring on a photomask, there is a chip comparison method that detects defects by comparing adjacent chips on the photomask, and a method for forming patterns on the photomask. What is claimed is: 1. A photomask defect inspection apparatus having a function of continuously performing defect inspection using a data comparison method of detecting defects by comparing data of a pattern actually formed on a photomask with data of a pattern actually formed on a photomask.
JP63172868A 1988-07-12 1988-07-12 Photomask defect inspecting device Pending JPH0222542A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63172868A JPH0222542A (en) 1988-07-12 1988-07-12 Photomask defect inspecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63172868A JPH0222542A (en) 1988-07-12 1988-07-12 Photomask defect inspecting device

Publications (1)

Publication Number Publication Date
JPH0222542A true JPH0222542A (en) 1990-01-25

Family

ID=15949790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63172868A Pending JPH0222542A (en) 1988-07-12 1988-07-12 Photomask defect inspecting device

Country Status (1)

Country Link
JP (1) JPH0222542A (en)

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