JPH0222560B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting apparatus for suctioning and holding chip-shaped electronic components onto an electronic circuit board or the like.

Conventional technology A conventional electronic component mounting device is, for example,
No. 16915 describes its specific configuration, and its outline is shown in Figure 1.

1 is arm, 2 is vacuum nozzle, 3 is hose, 4
is a leaf spring, 5 is a diaphragm, 6 is a pressing piece, 7 is a compression spring, and 8 is a shaft on which the spring is arranged on arm 1. A compression spring 10 is attached to the shaft 9.

Next, the movement of the suction nozzle in the apparatus configured as described above will be explained. As the air pressure inside the hose 3 increases, the diagram 5 connected to the hose 3 works, and the pressing piece 6 in contact with the diagram 5 raises the leaf spring 4, causing the tip of the leaf spring 4 to rise. Raise the suction nozzle 2 attached to the The lowering of the lever 11, which is attached to interlock with the pressing piece 6, is carried out by bringing the lever 11 into contact with a lever lowering means (not shown).

Problems to be Solved by the Invention However, with the above configuration, the suction head that suctions and holds the parts and moves them becomes unnecessarily complicated, and the suction head moves vertically and horizontally, making the movement process difficult. was large, and there was a problem with high speed.

In view of the above-mentioned problems, the present invention provides an electronic component mounting apparatus that has a simplified suction head and is capable of high-speed mounting.

Means for Solving the Problems The present invention is an electronic component mounting device that suction-holds a chip-shaped electronic component using a suction nozzle and mounts the electronic component on a board, and the electronic component is intermittently supplied to an electronic component take-out position. a suction nozzle that suctions the electronic component placed at the electronic component take-out position, transfers the electronic component to a mounting position on the board, and mounts it on the board; a suction nozzle holding means for movably holding the electronic component and rotating around a rotation axis parallel to the substrate to transfer the suction nozzle from an electronic component take-out position to a mounting position on the board, the suction nozzle , characterized in that the suction nozzle is configured to slide in the direction of the electronic component take-out position and the substrate with respect to the suction nozzle holding means.

Operation With the above configuration, the suction nozzle slides with respect to the holding means and after suctioning the electronic component located at the electronic component removal position, the holding means rotates about the axis parallel to the substrate. By transferring the electronic component toward the substrate and then sliding it on the holding means, the electronic component that has been attracted can be attached to the substrate.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 shows the main parts of an electronic component mounting apparatus according to an embodiment of the present invention. 21 is a mounting rod, 22 is a fulcrum shaft, and 23 is a bolt. Reference numeral 24 denotes suction nozzle holding means, which is rotatably mounted around the fulcrum shaft 22 by bolts 23.

Reference numeral 25 denotes a suction nozzle for picking up electronic components, which is held by suction nozzle holding means 24 so as to be movable in the A direction, and is biased by a spring 26. At the center of the suction nozzle 25, a flange portion 25 is provided.
A is provided to form a piston. Further, 27 is a ring seal, which seals the suction nozzle holding means 24 and the suction nozzle 25. Further, a cover 28 is fixed to the suction nozzle holding means 24, and a tube 29 is attached to the piping portion 28a, which is an air inlet, in order to operate the suction nozzle 25.
is connected to an external compressed air generator (not shown). The suction nozzle 25 is provided with a through hole 25b, and a tube 30 is attached to one end. This tube 30 is connected to an external vacuum generator (not shown).

31 is an electronic component supply means, and 32 is a taped chip component assembly. This chip component assembly 32 is intermittently transferred by a tape transfer roller 33. 34 is the tape on the parts storage side, 3
5 is a covering tape that covers the opening of the parts storage tape. 36 is an electronic component housed in the chip component assembly 32, and 37 is a board on which the electronic component 36 is mounted.

The operation of the electronic component mounting apparatus configured as described above will be described below.

The chip parts assembly 32 is connected to the tape transport roller 3
3, the cover tape 35 is removed intermittently and the covering tape 35 is removed before the parts are picked up. After stripping, the electronic components 36 are removed from the component storage tape 34.
In order to prevent the electronic component from falling, a protrusion prevention part 31b is provided to hold down the electronic component until the electronic component is taken out by the suction nozzle 25 until the electronic component is taken out.
The surface to be attracted is made perpendicular to the substrate 37. At this time, the suction nozzle 25 moves its tip 25c to a position where the suction surface of the electronic component 36 matches and approaches the suction surface of the electronic component 36, and the tube 2
Compressed air is supplied into the chamber 9. In this state, the electronic component 36 is vacuum-suctioned through the through hole 25b of the suction nozzle 25.
is maintained. After that, the compressed air in the tube 29 is released, and the compression spring 26 causes the suction nozzle 2
The tip 25c of the tape 5 moves in a direction that is more difficult than the tape 34 on the component storage side.

Next, the suction nozzle holding means 24 is rotated about the fulcrum side 22 by an external driving force, and as shown by arrow B, the suction nozzle holding means 24 holds the electronic component 36 by suction onto the substrate 3.
Rotate to the position facing 7, and in this state again,
Send compressed air to tube 29 and vacuum nozzle 25
25c is moved in a direction away from the suction nozzle holding means 24. By this movement, the electronic components 36 held by suction are carried onto the substrate 37, and at this time, the vacuum suction from the tube 30 is released and the mounting of the chip components on the substrate 37 is completed.

As described above, according to this embodiment, the rotation of the suction nozzle holding means 24, the on/off timing of compressed air from the tube 29, and the on/off timing of vacuum suction from the tube 30 are controlled by the feed of the component supply means 31. By repeating this process, the electronic component 36 can be mounted on the board 37 reliably and at high speed. Figure 3 shows the case where a vibrating parts feeder is used. Reference numeral 38 denotes a feeder section for transferring parts; 39 denotes an intermittent feeding section for intermittently transferring the parts separated from the vibrating feeder section 38 to a component take-out section 40; and a recess 41 in which parts can be stored.
have. It goes without saying that similar effects can be obtained even if the component supply section is configured as shown in FIG.

Effects of the Invention As described above, the present invention is an electronic component mounting apparatus that suction-holds an electronic component supplied by an electronic component supply means with a suction nozzle and mounts the electronic component on a substrate, in which the suction nozzle Since it is movably held by the suction nozzle holding means, there is no need for the suction nozzle holding means to move, and electronic components can be suctioned and mounted at high speed and with low vibration. Furthermore, by moving the suction nozzle, it is possible to easily cope with the case where electronic components of different heights are suctioned and mounted. Further, since the suction nozzle holding means is configured to rotate, it is possible to hold and transfer electronic components at a high speed compared to a device in which electronic components are transferred by linear motion.

In addition, the component supply means for electronic components is arranged substantially perpendicular to the board at the component pick-up position, and is rotated around an axis parallel to the surface of the board to transfer the electronic components onto the board. With a simple configuration, electronic components can be supplied in parallel.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a main part of a conventional electronic component mounting device, FIG. 2 is a cross-sectional view of a main part of an electronic component mounting device according to an embodiment of the present invention, and FIG. 3 is a partial cross-sectional view showing the delivery of components from a chute. It is a diagram. 24...Suction nozzle holding means, 25...Suction nozzle, 31...Electronic component supply means, 36...Electronic component, 37...Substrate.

Claims (1)

[Claims] 1. An electronic component mounting device that suction-holds a chip-shaped electronic component using a suction nozzle and mounts the electronic component on a board, which includes a storage tape that stores the electronic component in storage holes provided at predetermined intervals, and this electronic component mounting device. an electronic component supply means that intermittently supplies an electronic component assembly constituted by a covering tape that covers the electronic components stored in the storage tape to an electronic component retrieval position; A means for peeling off multiple electronic components at separate positions at intervals between storage holes, and a suction system for picking up electronic components placed at the electronic component extraction position, transferring the electronic components to a mounting position on the board, and mounting them on the same board. a nozzle, and a suction nozzle holding means that movably holds the suction nozzle, rotates about a rotation axis parallel to the substrate, and transfers the suction nozzle from an electronic component removal position to a mounting position on the substrate; a holding means provided on the storage hole to prevent the electronic component from falling out of the storage hole of the storage tape between a position where the covering tape is peeled off and a position where the electronic component is sucked, and the suction nozzle moves in a direction substantially parallel to the board when picking up the electronic component placed at the electronic component extraction position;
An electronic component mounting device characterized in that when mounting an electronic component on a board, the electronic component mounting device moves in a direction substantially perpendicular to the board.