JPH02228054A - Semiconductor device - Google Patents

Abstract

PURPOSE:To improve design efficiency and manufacturing efficiency by supporting a tab by tab-suspending leads so that inner leads may enter any of quadrilateral directions on a semiconductor pellet main face. CONSTITUTION:This is made in such structure that a tab 4 is supported by tab-suspending leads 3a and 3b so that inner leads 2b can enter any of quadrilateral directions on the main face of a semiconductor pellet 5. For example, by putting it in such structure that a second tab-suspending lead 3b is downed vertically from a first tab-suspending lead 3a being extended horizontally, and that the tab is supported at the midway part of this second tab-suspending lead 3b, it becomes possible to draw around the inner leads 2b to any direction of the four sides of the semiconductor pellet 5. For this reason, it becomes possible to mount semiconductor pellets, which are provided with the same function, by different package methods. Hereby, the design efficiency and manufacturing efficiency of a semiconductor device can be improved.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to semiconductor devices, particularly SIP (Single
In-1ine Package) or ZIP
(Zig-zag In-1ine Package
) method that is effective when applied to the package structure.

[Conventional technology]

An example of this type of SIP or ZIP packaging technology described is Japanese Patent Application Laid-Open No. 55-146.
There is a publication No. 952.

The SIP or ZIP method is attracting attention because it occupies a small area on a mounting board and enables high-density mounting.

A package structure based on the ZIP method according to the prior art will be explained with reference to FIG.

In the figure, the inside of the bag main body 41 made of epoxy resin or the like has a tab 44 supported from three directions by tab hanging leads 43, and the main surface of the tab 44 is made of silver. A semiconductor pellet 45 is bonded using a technique such as a paste or a gold-silicon eutectic method.

Around the tab 44, the tips of the inner leads 42b are arranged in different shapes.
The tip of the tip 2b and the corresponding pad electrode 46 on the semiconductor pellet 45 are electrically connected by a conductive wire 47 made of gold or the like.

Further, from the bottom surface of the package body 41, outer leads 42a, which are connected to the inner leads 42b, protrude in one direction (downward in the figure) and constitute external terminals.

[Problem to be solved by the invention]

However, in the structure in which the tab 44 is supported by the tab suspension leads 43 from three directions of the tab 44 as described above, due to the presence of the tab suspension leads 43 extending in the left-right direction in the figure, the semiconductor pellet 45 is has a structure that prevents the inner lead 42 from entering.
Naturally, it was impossible to arrange the pad electrode 46 on this upper side.

For this reason, it is not possible to realize a ZIP or SIP package structure in logic and microcomputer products that require a large number of pad electrodes 46, and even in products with a small number of pad electrodes, P L CC (Plas
tic Leaded Chip Carrier)
There are products with outer leads protruding from four directions, such as this product, and products with outer leads protruding from one direction, such as this ZIP product.
For the second protruding product, the arrangement of the pad electrodes 46 on the semiconductor pellet 45 must be changed, and even semiconductor pellets 46 with the same function are prepared with different specifications depending on the packaging method. This caused problems in terms of design efficiency or manufacturing efficiency.

The present invention has been made in view of the above-mentioned problems, and its purpose is to enable packaging using the ZIP or SIP method even for semiconductor pellets in which electrode pads are arranged on four sides, thereby improving design efficiency and manufacturing efficiency. The object of the present invention is to provide a highly versatile semiconductor device.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the structure is such that the tab is supported by the tab suspension lead so that the inner lead can enter into any of the four sides on the main surface of the semiconductor pellet.

[Effect]

According to the above-mentioned means, for example, the second tab suspension lead is lowered in the vertical direction from the first tab suspension lead extending in the horizontal direction, and the tab is supported in the middle of the second tab suspension lead. With this structure, it is possible to route the inner leads in any direction on the four sides of the semiconductor pellet. For this reason, SIP or ZI
Even in the P-type package structure, it is possible to use semiconductor pellets with pad electrodes arranged on all sides, making it possible to mount semiconductor pellets with the same function in different packaging methods, improving the design efficiency and manufacturing of semiconductor devices. Efficiency can be significantly improved.

〔Example〕

FIG. 1(a) is a plan view of a semiconductor device which is an embodiment of the present invention, FIG. 1(a) is an explanatory front view showing its internal structure, FIG. The figure is a perspective view showing the appearance of the semiconductor device of this example.

The external appearance of the semiconductor device of this embodiment is as shown in FIG. 3, and outer leads 2a are protruded from the bottom surface of the package body I in a line and at a predetermined pitch in the direction. Each one is bent in directions away from each other, that is, in a zigzag shape.

Such a semiconductor device can be obtained, for example, as follows.

First, a plate member made of copper (Cu) or nickel (Ni) alloy is processed into a predetermined shape by pressing or etching to obtain a lead frame.

Such a lead frame has a structure in which a tab 4 supported by first and second tab suspension leads 3a and 3b is arranged in the center, and a large number of inner leads 2b extend from the tab 4. It has become. inner lead 2
b is connected to the outer lead 2a exposed to the outside during molding, and the tip of the inner lead 2b is connected to the tab 4.
There is no contact with.

In this embodiment, the tab suspension leads 3a and 3b are shown in FIG.
), they are arranged in a T-shape, with a first tab suspension lead 3a extending horizontally in the figure, and a second tab suspension lead 3a hanging from the center of the first tab suspension lead 3a. It is composed of a tab suspension lead 3b. The tab 4 is supported at a midway portion of the second tab suspension lead 3b, and the second tab suspension lead 3b has a branch portion at the connection portion with the tab 4. This branch portion is provided to prevent the tab 4 from being rotated and deformed about the tab suspension lead 3b during pellet bonding or handling.

A semiconductor pellet 5 is attached to the main surface of the tab 4 using an adhesive such as silver paste (not shown). This semiconductor pellet 5 is produced by forming a plurality of circuit regions on a semiconductor wafer made of silicon (Si) through a predetermined diffusion process using photoresist technology, and then dividing the semiconductor wafer into square shapes for each circuit region. This is what you get.

On the main surface of the semiconductor pellet 5, a pad electrode 6 made of a conductive material of aluminum (A1) is arranged along the periphery of the four sides, and this pad electrode 6 is made of gold (Au).
, copper (Cu), aluminum (A+), or the like, the tip thereof is electrically connected to the inner lead 2b disposed around the tab 4. The connection using the conductive wire 7 uses a so-called known wire bonding technique.

Note that the conductive wire 7 is usually a bare wire with an exposed conductive material, but a coated wire with an insulating material applied around the conductive core wire may also be used.

By using such coated wires, complex connections such as cross bonding become possible. In this example,
As a result of the above-mentioned cross-bonding being made possible, there are the following advantages.

That is, the semiconductor pellet 5 having the same function is, for example, PL
When changing the packaging method from CC to ZIF, it is necessary to change the pin arrangement of the outer leads 2a. That is, since the pin arrangement of the outer leads 2a normally corresponds to the arrangement of the pad electrodes 6 of the semiconductor pellet 5, a PLCC in which the outer leads 2a are arranged in four directions,
ZI in which outer leads 2a are arranged only in one direction
With F, it is necessary to change the pin arrangement. However, by cross-bonding using covered wire, this conversion of pin arrangement can be realized inside the package, and implementation can be performed without being aware of differences in pin arrangement due to differences in packaging methods.

The area covering the right side of the tab 4 and the inner lead 2b is sealed by the package body 1 formed by resin molding, and only the outer lead 2a is exposed to the outside.

As mentioned above, in this embodiment, the tab 4 is placed in the second position from the top and bottom.
The uppermost part of the tab suspension lead 3b is supported by the first tab suspension lead 3a extending in the left-right (horizontal) direction. A spatial margin is formed between the first tab suspension lead 3a and the second tab suspension lead 3a. Therefore, since the inner lead 2b can be routed in this margin, wire bonding can also be performed upward when viewed from the semiconductor pellet 5 in the figure. This means that it is also possible to arrange the pad electrode 6 along the periphery of the upper side of the semiconductor pellet 5 in the figure.

Therefore, according to this embodiment, it is possible to arrange the pad electrodes 6 all around the four sides of the semiconductor pellet 5, and it is possible to remove the restriction on the arrangement of the pad electrodes 6 of the semiconductor pellet 5 in SIP or ZIP.

Therefore, the semiconductor pellet 5 can be shared between semiconductor devices using different packaging methods such as SIF and PLCC, and the design efficiency and manufacturing efficiency of semiconductor devices can be greatly improved.

In this example, as shown in FIG. 1(b), the first
The tab suspension lead 3a is not formed in a straight line in the horizontal direction, but is gently curved along the routing shape of the inner lead 2b. In response to this curved shape, the package body 1 is also configured such that the distance Ml in the height direction is maximum at the central portion where the semiconductor pellet 5 is disposed, and becomes smaller toward the periphery thereof. As shown in FIG. 1(a), the surface along the curved shape of the package body l, that is, the top surface with the outer leads 2a disposed below, is marked, and the semiconductor It is now possible to check the specifications of the device.

In this way, in this embodiment, the markings are provided on the top surface, making it possible to identify the product even in a particularly high-density packaging state.

Further, since the top portion has a curved structure, a jig such as a chuck can easily fit between the package main bodies 1, which has the advantage of facilitating handling.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, a support structure for the tab 4 as shown in FIG. 3 may be used.

That is, the tab 4 in FIG. 3 is supported by a pair of L-shaped tab suspension leads 31, 31 hanging from above, and each tab suspension lead 31, 3I is bent in a right angle direction away from each other above the tab 4. It is curved and extends horizontally in the figure. Regarding the support structure for the tab 4, the tab 4 is supported at two points in the upper part of the figure, so that rotational deformation of the tab 4 in special pellet bonding is prevented. In this manner, also in the modification shown in FIG. 3, it is possible to mount the semiconductor pellet 5 with the pad electrodes 6 arranged along the four sides on the SIF or ZIP package body l.

Further, the present invention is not necessarily limited to those shown in FIGS. 1 and 3, and for example, a second tab suspension lead 3 may be provided which extends the tab 4 in the vertical direction with the outer lead 2a facing downward.
It may be a structure supported by a chisel as shown in b.

In the above explanation, the invention made by the present inventor is mainly applied to a semiconductor device using the so-called ZIP method, which is the field of application of the invention, but the invention is not limited to this. can.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

In other words, since the inner leads can be routed in any direction on the four sides of the semiconductor pellet, semiconductor pellets with the same function can be mounted in different packaging methods, increasing the design efficiency and manufacturing efficiency of semiconductor devices. can be significantly improved.

[Brief explanation of the drawing]

FIG. 1(a) is a plan view showing a semiconductor device according to an embodiment of the present invention, FIG. 1(b) is an explanatory front view thereof, and FIG. 2 is an explanatory front view showing a modification of the semiconductor device according to the embodiment. FIG. 3 is a perspective view showing the appearance of the semiconductor device of this embodiment. FIG. 4 is an explanatory front view showing the internal structure of a conventional semiconductor device. 1...Package body, 2a...Outer lead,
2b... Inner lead, 3a, 3b... Tab suspension lead, 4... Tab, 5... Semiconductor pellet,
6... Pad electrode, 7... Conductive wire, 31...
Tab suspension lead, 41...Package body, 42a.
...Outer word, 42b...Inner lead, 4
3...Tab suspension lead, 44...Tab, 45...
Semiconductor pellet, 46... Pad electrode, 47... Conductive wire. Figure 2

Claims (1)

[Claims] 1. A tab having an outer lead projecting in one direction outward from the bottom surface of the package, a tab to which a semiconductor pellet is attached within the package, and a tab suspension lead supporting the tab. A semiconductor device characterized in that the hanging lead supports a tab so that the inner lead can enter into any of the four sides on the main surface of the semiconductor pellet. 2. The tab suspension lead according to claim 1, wherein the tab suspension lead supports the tab from above and below with the outer lead positioned below, and the upward tab suspension lead is branched in the left and right direction. Semiconductor equipment. 3. With the outer leads positioned downward, the vertical height of the package is maximum near the center where the semiconductor pellet is located, and becomes smaller toward the periphery. The semiconductor device according to claim 1, characterized in that: