JPH02229444A - Removal of conductive line for plating from film carrier - Google Patents

Abstract

PURPOSE:To reduce the cost without a need of a metal mold and by eliminating a need of a stamping process and to eliminate a disadvantage regarding a layout of a circuit by a method wherein a cutout is formed, by using a cutter, at a connection part of a conductive line for plating use on a film carrier and each wiring lead of a circuit pattern and the conductive line for plating use is stripped off while the film carrier is being fed. CONSTITUTION:A film carrier 10 is drawn out from a reel 11; a cutout 15 is formed, by using a cutter 13, at a connection part 14 of a conductive line 4 for plating use and each wiring lead 2 of a circuit pattern; the part is cut completely or is made thin. After that, the film carrier 10 is drawn out from a reel 12 and is wound on a separate reel 16. While the film carrier 10 is being fed in a direction shown by an arrow, the conductive line 4 for plating use is stripped off. Thereby, the conductive line is separated at the cutout 15 and is cut from each wiring lead 2. While only the conductive line 4 for plating use is being stripped off one after another from a film substrate 1, it can be wound.

Description

DETAILED DESCRIPTION OF THE INVENTION This invention relates to a film carrier on which a circuit pattern is formed on a film substrate and ICs, LSIs, etc. are mounted thereon.
Specifically, in the manufacturing process of such film carriers, conductive lines for plating are provided by connecting to each wiring lead of the circuit pattern, but the present invention provides a method for removing the conductive lines for plating after plating. Concerning a method for removing conductive lines. Figure 6 shows the film carrier. The reference numeral 1 in the figure is a film substrate, 2 is each wiring lead that forms a circuit pattern on the film substrate 1, and 3 is a film substrate 1 bonded to the tip of a finger portion 2a of each wiring lead 2. It is an electronic component such as IC-LSI that is mounted on the top. Conventionally, in this type of film carrier, each wiring lead 2 is plated with metal to prevent oxidation, especially at the tip of the finger portion 2a, to prevent an increase in electrical resistance at that part, and to ensure reliability of IC bonding. Ta.
Metal plating includes electrolytic plating, in which plating is performed by passing a current through each wiring lead 2, and electroless plating, in which plating is performed chemically.The former is more advantageous than the latter in terms of reliability. Therefore, in order to carry out electrolytic plating in some conventional film carriers, conductive lines 4 for plating are formed on both sides of the film substrate 1 in the length direction thereof, as shown in FIG. There is a device in which the wiring leads 2 are connected to each other, and a current is applied to each of the wiring leads 2 through the conductive line 4 for plating. However, with such a configuration, since a plurality of wiring leads 2 are connected to each conductive line 4 for plating, a shoot will be required later when an electrical test is performed using the test electrode 2b. Therefore, in order to avoid damage, it was necessary to remove the plating conductive line 4 portion after plating and before conducting the electrical test. Conventionally, this was done by punching with a press. However, punching with a press had the following problems. 1) A mold must be made.

2) A punching process is required.

3) There must be sufficient space on the film substrate for punching, which is disadvantageous in terms of circuit layout. Therefore, the purpose of this invention is to solve such conventional problems in the method for removing conductive lines for plating film carriers, to reduce costs by eliminating the need for molds and punching processes, and to improve circuit layout. The goal is to ensure that the upper management is not at a disadvantage. Therefore, the method for removing conductive lines for plating on a film carrier according to the present invention is to remove conductive lines for plating on a film substrate 1 along with a circuit pattern in the longitudinal direction of the film substrate 1, for example, as shown in the illustrated embodiment below. A film carrier 10 forming a conductive line 4 for plating extending over the area is sent, and the film carrier 10 is connected to the connecting portion 13 between the conductive line 4 for plating and each wiring lead 2 of the circuit pattern. The feature is that a cut 14 is made with a cutter 12, and the conductive line 4 for plating is peeled off while the film carrier 10 is being fed. ■ Then, peel off the conductive line 4 for plating from one end side of the film substrate 1, separate it from each wiring line 2 at the cut 14,
Peel off only the conductive line 4 for plating. Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

Figure 5 shows a partially enlarged plan view of the film carrier shown in Figure 6. Reference numeral 1 in the figure is a film substrate, on which a circuit pattern and conductive lines 4 for plating are formed. Then, a conductive line 4 for plating is extended in the length direction shown by the arrow in the figure of the film substrate 1, and each wiring lead 2 of the circuit pattern is connected to it. Reference numeral 5 in the figure indicates sprocket holes formed at regular intervals on the side edge of the film substrate 1. Electrolytic plating is then performed using this conductive line 4 for plating, and a current is passed through each wiring lead 2 to apply metal plating. Thereafter, the plating conductive line 4 is stripped off using the removal method according to the present invention.

That is, in the method for removing conductive lines for plating according to the present invention, first, as shown in FIG.
is let out from a reel 11, wound up on another reel 12, and the film carrier 10 is sent in the direction of the arrow in the figure. At this time, using a power ivy 13, cut a cut 15 as shown in FIG.
, and either cut the gap completely or make the gap thinner. Thereafter, as shown in FIG. 3, the film carrier 10 is unwound from the reel 12 and wound on another reel 16, and the conductive line 4 for plating is peeled off while the film carrier 10 is being fed in the direction of the arrow in the figure. Then,
It can be separated at the cut 15 and separated from each wiring lead 2, and only the conductive line 4 for plating can be sequentially peeled off from the film substrate/board 1 and rolled up. In addition, as a cutter, instead of the cutter 12 shown in FIG. 1, for example, a rotating power ivy as shown in FIG. 4 may be used.

Therefore, according to this invention, there are the following effects. 1) It is economical because no mold is required. 2) It is economical as it eliminates the time-consuming punching process. 3) Since no punching is required, there is more leeway in the circuit layout, making it easier to arrange and configure the circuit patterns.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of an embodiment of the present invention, showing the process of making cuts in the connecting parts between the conductive line for plating and each wiring lead, Fig. 2 is a cross-sectional view of the film carrier showing the cuts, and Fig. 3 Figure 4 is a perspective view illustrating the process of peeling off conductive lines for plating, Figure 4 is a diagram showing another example of a cutter for making cuts, Figure 5 is a partially enlarged plan view of a film carrier, and a partial plan view of a lum carrier. 1... Film board 2... Wiring lead 4... Conductive line for plating 10...
......Film carrier 13...Cutter 14...Connection part 15...The cuts in Fig. 6 are

Claims (1)

[Claims] A film carrier that forms a conductive line for plating extending in the length direction of the film substrate together with a circuit pattern is sent onto the film substrate, and the conductive line for plating and the circuit of the film carrier are A method for removing a conductive line for plating on a film carrier, comprising making a cut with a cutter at the connection part with each wiring lead of the pattern, and peeling off the conductive line for plating while feeding the film carrier.