JPH0222956Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial field of application] The present invention relates to an IC socket for maintaining the allowable junction temperature of an IC, and in particular,
This invention relates to an IC socket with a heat dissipating connecting member, in which a heat dissipating connecting member connected to a heat dissipating member is interposed between the socket and the IC.

In recent years, there has been a strong demand for various electronic devices to be small, lightweight, and high-performance.In order to meet these demands, the components that make up circuit units must be mounted in high density, and with this, the housing There is a strong demand for the development of a heat dissipation structure that efficiently dissipates heat generated from high-power components such as ICs within the body.

[Conventional technology]

FIG. 3 is a mounting side view for explaining the heat dissipation structure of a conventional IC.

The IC 3 is inserted into the IC socket 2 mounted on the printed wiring board 1 together with a large number of components, and the heat dissipation surface 31 of the IC 3 is made of a metal with good heat conduction, such as copper or aluminum, and a heat dissipation fin 41 is attached to one end. A heat dissipation structure in which the heat sink 4 is bonded is common, but the heat generated from the IC 3 is transferred from the heat dissipation surface 31 to the heat sink 4 and radiated only through the heat dissipation fins 41, resulting in efficient heat dissipation. can't be done, IC3
The device itself exceeded its operating temperature rise limit.

[Problem that the invention attempts to solve]

In the case of the above configuration, if the heat generated from the IC3 itself exceeds the allowable junction temperature, the circuit inside the IC element may be destroyed, and the adjacent components mounted in the housing unit may be affected. There were some issues that raised concerns.

[Means for solving problems]

The present invention provides an IC socket with a heat dissipation connecting member that solves the above problems and has good heat dissipation efficiency. A socket that protrudes beyond the IC socket body and has a connection means with other heat dissipation members,
It is fixed between the parallel terminal rows of the IC socket body.

[Effect]

In the above-mentioned IC socket with a connecting member for heat dissipation, a flat plate-shaped connecting member 6 for heat dissipation is fitted into the mounting surface of the IC socket 5, so that when the IC 3 is attached to the IC socket 5, the bottom part that generates the most heat is used for heat dissipation. Since the IC 3 is in close contact with the connecting member 6, the heat generated by the IC 3 is efficiently transferred to the connected heat radiating member via the heat radiating connecting member 6, thereby making it possible to efficiently radiate the heat.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of an IC socket with a heat dissipation connecting member according to the present invention will be described in detail with reference to the drawings.

Figure 1 shows an IC with a connecting member for heat dissipation according to the present invention.
FIG. 1A is an exploded perspective view and FIG. 2B is an assembled perspective view for explaining one embodiment of the socket.

A heat dissipation coupling plate insertion groove 52 into which the heat dissipation coupling plate 6 is fitted is provided in the center along the arrangement direction of the pins 51 of the IC socket 5 made of a synthetic resin molded product.
form. Then, the narrow part 61 of the I-shaped heat dissipation connecting plate 6, which is a flat plate made of a metal with good thermal conductivity such as copper or aluminum, and has both edges widened and provided with holes 62 for joining with a heat dissipation member, is used for heat dissipation. By fitting into the connecting plate insertion groove 52, it becomes as shown in FIG. 1b. In this case, the thickness t of the heat dissipation coupling plate 6 is determined from the depth d of the heat dissipation coupling plate insertion groove 52 of the IC socket 5.
It is preferable to make it slightly larger. and IC
The socket 5 and the heat dissipation connecting plate 6 may be bonded together using an adhesive having good thermal conductivity, or they may be integrally molded with the socket by slanting both sides of the narrow portion 61.

Figure 2 shows an IC with a heat dissipation connecting member according to the present invention.
A is a perspective view for explaining an example of mounting a socket;
b is a perspective view of the heat dissipation plate bent at right angles, in which the same parts as in FIGS. 1 and 3 are given the same reference numerals.

FIG. 2a shows a horizontal structure of a metal plate with good heat conduction, such as a heat sink 7 made of copper, aluminum, etc., which is included in the printed wiring board 1.
Both ends of the heat dissipation connecting plate 6 fixed to the IC socket 5 are brought into close contact with each other, and the joining holes 6 of the heat dissipation connecting plate 6 are
The IC 3 is configured to be inserted into the IC socket 5 by screwing a tightening screw 8 into the IC 3 and joining the heat dissipation connecting plate 6. When IC3 is operated in this way,
The IC 3 generates heat, and the generated heat is radiated from the bottom of the IC 3, which generates a large amount of heat, through the heat radiating connecting plate 6 and from the heat radiating plate 7. However, in this structure, the heat sink 7 has a horizontal structure, which limits the space for mounting components.
It has a structure in which the heat sink 7 is bent at right angles to expand the component mounting space and enable high-density mounting.

In this embodiment, a structure in which the heat dissipation plate 7 is bent horizontally or at right angles has been described, but in order to further improve heat dissipation efficiency, a structure in which heat dissipation fins or the like are attached to the heat dissipation plate may be used.

[Effect of idea]

As is clear from the above explanation, by using the IC socket with a heat dissipation connecting member according to the present invention, the heat dissipation efficiency is improved and high-density mounting is possible, which greatly contributes to improving the reliability of the device. It is.

[Brief explanation of the drawing]

Figure 1 shows an IC with a connecting member for heat dissipation according to the present invention.
A is an exploded perspective view, B is an assembled perspective view, and FIG. FIG. 3B is a perspective view of the heat dissipation plate bent at right angles, and FIG. 3 is a mounting side view for explaining the heat dissipation structure of a conventional IC. In the figure, 1 is a printed wiring board, 2 and 5 are IC sockets,
3 is an IC, 4 is a heat sink, 6 is a heat sink connecting plate, 7 is a heat sink, 8 is a tightening screw, 31 is a heat sink, 41 is a heat sink, 51 is a pin, 52 is a heat sink connecting plate insertion groove, Reference numeral 61 indicates a narrow portion, and reference numeral 62 indicates a joining hole.

Claims (1)

[Scope of utility model registration request] A heat transfer surface in contact with the bottom surface of the IC body to be installed,
A heat dissipation connecting member whose end protrudes beyond the IC socket body and is equipped with means for connecting to another heat dissipation member is attached to the IC socket body.
An IC socket with a heat dissipation connecting member, which is fixed between parallel terminal rows of an IC socket body.