JPH02229577A - Coating device - Google Patents
Coating deviceInfo
- Publication number
- JPH02229577A JPH02229577A JP1048597A JP4859789A JPH02229577A JP H02229577 A JPH02229577 A JP H02229577A JP 1048597 A JP1048597 A JP 1048597A JP 4859789 A JP4859789 A JP 4859789A JP H02229577 A JPH02229577 A JP H02229577A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- film thickness
- coating liquid
- coated
- coating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[産業上の利用分野]
こ.め発明は、液体の塗布装置に関し、さらに詳しくい
うと、例えば半導体ウェハの表面にレジストを回転塗布
するスビンコー夕と呼ばれる塗布装置に1関するもので
ある。[Detailed description of the invention] [Industrial application field] The present invention relates to a liquid coating device, and more specifically, to a coating device called a subin coater that spins and coats resist onto the surface of a semiconductor wafer, for example.
[従来の技術]
従来、この柵の塗布装置は、株式会社工業調査会発行、
「電子材料J 1988年12月号別冊、78−83ペ
ージに示されているように、膜厚の均一な薄膜をウエハ
などの1Ijl塗布体上に形成するのに用いられる。第
4図は従来の一般的な塗布装置(以下、従来例1と呼ぶ
)を示し、被塗布体(1)はチャック(4)上に置かれ
、真空吸着などの方法により固定される。塗布液(2)
をノズル(3)から披塗布体(1)上に滴下し、モータ
(5)によりチャック(4)・被塗布体(1)を一定時
間、高速回転させることにより、遠ロカで塗布液(2)
を拡げ、その薄膜を形成する。[Prior art] Conventionally, this fence coating device was manufactured by Kogyo Kenkyukai Co., Ltd.
As shown in "Electronic Materials J, December 1988 Special Issue, pages 78-83, it is used to form a thin film with a uniform thickness on a 1Ijl coated body such as a wafer. Figure 4 shows the conventional method. A general coating device (hereinafter referred to as conventional example 1) is shown in which the object to be coated (1) is placed on a chuck (4) and fixed by a method such as vacuum suction.Coating liquid (2)
The coating liquid (2) is dripped from the nozzle (3) onto the coating material (1), and the motor (5) rotates the chuck (4) and the coating material (1) at high speed for a certain period of time. )
to form a thin film.
モータ(5)の回転数や回転時間などは使用する塗布液
の粘度や、所望の膜厚から予め条件出しを行って決定さ
れている。The rotation speed and rotation time of the motor (5) are determined in advance by determining conditions based on the viscosity of the coating liquid used and the desired film thickness.
以上のような従来の塗布装置は、予め決められた条件で
一律に運転されるため、通常、多数枚の形成されるレジ
ストの膜厚を一定にすることが困難であり、膜厚のばら
つきを措くという欠点があった。Conventional coating equipment as described above is operated uniformly under predetermined conditions, so it is usually difficult to make the film thickness of many resists uniform, and it is difficult to prevent variations in film thickness. There was a drawback to this.
このような欠点を解消する手段としては、特開昭63−
51976号公報に示された発明(以下この発明を従来
例2と呼ぶ)があり、これを第5図に示す。図において
(104)は膜厚測定部、(105)は膜厚制御部、(
tOa)はモーター制御部、(100)はレーザ光であ
る。As a means to eliminate such drawbacks, Japanese Patent Application Laid-Open No. 63-
There is an invention disclosed in Japanese Patent No. 51976 (hereinafter this invention will be referred to as Conventional Example 2), which is shown in FIG. In the figure, (104) is a film thickness measurement section, (105) is a film thickness control section, (
tOa) is a motor control unit, and (100) is a laser beam.
上記従来例2では、回転されつつある被塗布体(1)に
おける塗布液(2)の膜厚を、レーザ光(100)によ
る干渉縞の観察により計測する膜厚測定部(104)と
、この測定部における測定値に基づいて、膜厚制御部(
106)により、回転されつつある被塗布体の回転速度
を制御し所定の膜厚を得るものである。ここでは予め記
憶された時間一膜厚関係と回転中の膜厚計測値の比較に
よりモータの回転数を塗布中に動的に制御するようにな
っている。In the conventional example 2, the film thickness measuring section (104) measures the film thickness of the coating liquid (2) on the rotating object (1) by observing interference fringes with a laser beam (100); Based on the measured value in the measurement section, the film thickness control section (
106), the rotational speed of the object to be coated that is being rotated is controlled to obtain a predetermined film thickness. Here, the rotational speed of the motor is dynamically controlled during coating by comparing the time-film thickness relationship stored in advance with the film thickness measurement value during rotation.
このように上記従来例2では、従来は、従来例1のよう
に予め決められた条件で一律に運転されていt一塗布装
置に、フィードバック制御の考えを取り入れることによ
り膜厚のばらつきの問題を解決しようとしたものである
。In this way, in Conventional Example 2, the problem of film thickness variation is solved by incorporating the idea of feedback control into the coating device, which was conventionally operated uniformly under predetermined conditions as in Conventional Example 1. This is what I was trying to solve.
[発明が解決しようとする課題]
るものとしているが、通常回転塗布工程に要する時間は
高々数十秒程度であり、この間に回転塗布の動的な制御
を行うためには、高速に膜厚が計測され、高速に制御方
策が決定され、かつ、高速に制御が実行されねばならず
、このような制御系を構成するのは容易なことではない
。さらに、例えば半導体ウエハにフォトレジスト液を塗
布する装置においては、レジスト液塗布後のベーキング
エ程の方が所要時間が長く、回転塗布工程に要する時間
の変動はベーキング工程の待ち時間を変えるだけであり
、プロセス全体の所要時間には影響を与えず、従って、
回転塗布時間を敢えて一定に保つことに意味はない。[Problems to be Solved by the Invention] However, the time required for the spin coating process is usually several tens of seconds at most, and in order to dynamically control the spin coating during this time, it is necessary to rapidly increase the film thickness. It is not easy to construct such a control system, as it must be measured, a control policy must be determined at high speed, and control must be executed at high speed. Furthermore, in equipment that applies photoresist solution to semiconductor wafers, for example, the baking process after applying the resist solution takes a longer time, and the time required for the spin coating process can be changed simply by changing the waiting time of the baking process. Yes, it does not affect the overall duration of the process and therefore
There is no point in deliberately keeping the rotational coating time constant.
この発明は上記のような問題点を解消するためになされ
たもので、被塗布体の回転制御を容易にし、供給液温や
雰囲気条件の変動に伴う膜厚のばらつきを無《すことの
できる塗布装置を得ることを目的とする。This invention was made in order to solve the above-mentioned problems, and it is possible to easily control the rotation of the object to be coated and eliminate variations in film thickness due to fluctuations in supply liquid temperature and atmospheric conditions. The purpose is to obtain a coating device.
[i題,/(を解決するための手段]
この発明に係る塗布装置は、回転塗布中に膜厚と相関を
もつ他の物理量を計測し、その計測値に基づいてmt布
体の回転停止時間を決定するようにしたものである。[Means for Solving Problem i, /(] The coating device according to the present invention measures other physical quantities correlated with the film thickness during rotational coating, and stops the rotation of the mt cloth based on the measured values. It is designed to determine the time.
[゜作用]
この発明においては、例えば、塗布膜からの反射光強度
が所定の値に達したとき、vt塗布体の回転を停止する
。[°Function] In the present invention, for example, when the intensity of reflected light from the coating film reaches a predetermined value, the rotation of the VT coating body is stopped.
[実施例]
第1図はこの発明の一実施例を示し、ここで、被塗布体
(1)へ塗布液(2)の塗布を行う場合、まずチャック
(4)上に被塗布体(1)を載せ、真空吸着により固定
する。その後、ノズル′<3)から塗布液(2)を被塗
布体(1)上に滴下する。[Embodiment] FIG. 1 shows an embodiment of the present invention. Here, when applying the coating liquid (2) to the object to be coated (1), first the object to be coated (1) is placed on the chuck (4). ) and fix it by vacuum suction. Thereafter, the coating liquid (2) is dropped onto the object to be coated (1) from the nozzle '<3).
さらに、モータ(5)により被塗布体(1)およびチャ
ック(4)を一定時間、高速で回転し、被塗布体(1)
上の塗布液(2)を遠心力により拡げて、塗布液(2)
の膜を形成する。塗布中、光源(lO)から被塗布体(
1)上に光を照射し、その反射光強度を受光素子(l1
)で検出する。塗布時、塗布液(2)の膜厚が減少し、
従って、反射光強度が増加していく。この様子を第2図
に示す。同図(a)は時間七と膜厚Qの関係を示し、同
図(b)は時間tと反射光強度Iの関係を示す。図中、
Q,は所望の、膜厚、■,は上記所望の膜厚Qtのとき
の反射光強度を示している.Itは予め実験等により決
定し、モータ回転停止制御部(12)に記憶されている
。モータ回転停止制御部(l2)は、第3図に示すよう
に、受光素子(11)からの電気的信号を取り込み、そ
の信号強度から反射光強度Iを求め、その値がI,にな
った時点でモータ(5)の回転を停止する。Further, the motor (5) rotates the workpiece (1) and the chuck (4) at high speed for a certain period of time, and the workpiece (1)
Spread the upper coating liquid (2) by centrifugal force to form coating liquid (2).
Forms a film of During coating, the object to be coated (
1) Irradiate light onto the top and measure the intensity of the reflected light on the light receiving element (l1
) to detect. During coating, the film thickness of coating liquid (2) decreases,
Therefore, the intensity of reflected light increases. This situation is shown in FIG. The figure (a) shows the relationship between the time 7 and the film thickness Q, and the figure (b) shows the relationship between the time t and the reflected light intensity I. In the figure,
Q, indicates the desired film thickness, and 2, indicates the reflected light intensity when the desired film thickness is Qt. It is determined in advance through experiments and the like, and is stored in the motor rotation stop control section (12). As shown in FIG. 3, the motor rotation stop control unit (l2) receives the electrical signal from the light receiving element (11), calculates the reflected light intensity I from the signal strength, and determines that the value is I. At this point, the rotation of the motor (5) is stopped.
以上、この発明の一実施例を具体的に説明したが、この
発明は膜厚計測方法や膜厚と相関を持つ物理量の種類と
その計測方法を限定するものではない。上記実施例では
計測に光吸収法を利用したが、光干渉法や偏光法など他
の手段を用いてもよい。Although one embodiment of the present invention has been specifically described above, the present invention does not limit the film thickness measurement method, the types of physical quantities correlated with the film thickness, and the measurement methods thereof. In the above embodiment, the optical absorption method was used for measurement, but other means such as optical interference method or polarization method may be used.
[発明の効果]
以上のように、この発明によれば、塗布液の膜厚あるい
はこれと相関する物理量を測定して被塗布体の回転停止
時間を制御することにより塗布液膜の厚さを一定に保つ
ことができるため、膜厚のばらつきを小さくすることが
できるという効果があり、例えば、半導体製品の品質や
歩留りの向上に寄与するところ大である。[Effects of the Invention] As described above, according to the present invention, the thickness of the coating liquid film can be controlled by measuring the coating liquid film thickness or a physical quantity correlated thereto and controlling the rotation stop time of the object to be coated. Since it can be kept constant, it has the effect of reducing variations in film thickness, which greatly contributes to improving the quality and yield of semiconductor products, for example.
第l図はこの発明の一実施例の概略側面図、第2図は第
1図のものの動作特性線図、第3図は第1図のものの制
御方法を示したフローチャート図、第4図,第5図はそ
れぞれ従来の塗布装置の概略側面図である。
l・・披塗布体、2・・塗布液、3・・ノズル、5・・
モータ、10・・光源、1l・・受光素子、12・・モ
ーター回転停止制御部。
なお、各図中、同一符号は同一又は相当部分を示す。
第
図
1:被f季体
2:で昂洩
時間(t’)
第
図
第
図
手
続
補
正
書
6.
補正の内容
平成
2年
6月
1日
明細書第3頁第13行Fig. 1 is a schematic side view of an embodiment of the present invention, Fig. 2 is an operating characteristic diagram of the one shown in Fig. 1, Fig. 3 is a flowchart showing a control method of the one shown in Fig. FIG. 5 is a schematic side view of a conventional coating device. l... coating body, 2... coating liquid, 3... nozzle, 5...
Motor, 10...Light source, 1l...Light receiving element, 12...Motor rotation stop control unit. In each figure, the same reference numerals indicate the same or equivalent parts. Figure 1: Exposure time (t') in subject body 2 Figure Figure 6 Procedural amendment 6. Contents of amendment June 1, 1990 Specification, page 3, line 13
Claims (1)
て前記塗布液を遠心力により拡げ、前記被塗布体上に前
記塗布液の薄膜を形成させる塗布装置において、前記塗
布液の塗布中に前記塗布体上の前記塗布液の膜厚および
この膜厚と相関を有する物理量のいずれかを計測する測
定手段と、この測定手段における測定値に基づいて前記
被塗布体の回転停止時間を制御する制御手段とを備えて
なることを特徴とする塗布装置。In a coating device that drops a coating liquid onto an object to be coated, rotates the object to spread the coating liquid by centrifugal force, and forms a thin film of the coating liquid on the object to be coated. A measuring means for measuring either the film thickness of the coating liquid on the coating body during coating or a physical quantity having a correlation with this film thickness, and a rotation stop time of the coating body based on the measured value by this measuring means. A coating device comprising: a control means for controlling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1048597A JP2768720B2 (en) | 1989-03-02 | 1989-03-02 | Coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1048597A JP2768720B2 (en) | 1989-03-02 | 1989-03-02 | Coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02229577A true JPH02229577A (en) | 1990-09-12 |
| JP2768720B2 JP2768720B2 (en) | 1998-06-25 |
Family
ID=12807818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1048597A Expired - Fee Related JP2768720B2 (en) | 1989-03-02 | 1989-03-02 | Coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2768720B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008306220A (en) * | 2008-09-22 | 2008-12-18 | Renesas Technology Corp | Manufacturing method of semiconductor integrated circuit device |
| WO2021260943A1 (en) * | 2020-06-26 | 2021-12-30 | ミカサ株式会社 | Spin-coating device |
| TWI899398B (en) * | 2020-12-24 | 2025-10-01 | 日商東京威力科創股份有限公司 | Substrate processing device, substrate processing method, and storage medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5759111A (en) * | 1980-09-27 | 1982-04-09 | Matsushita Electric Ind Co Ltd | Measuring method for film thickness |
| JPS5998238A (en) * | 1982-11-26 | 1984-06-06 | Toshiba Corp | Data setting method |
| JPS6115072U (en) * | 1984-06-29 | 1986-01-28 | ホ−ヤ株式会社 | Resist coating equipment |
-
1989
- 1989-03-02 JP JP1048597A patent/JP2768720B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5759111A (en) * | 1980-09-27 | 1982-04-09 | Matsushita Electric Ind Co Ltd | Measuring method for film thickness |
| JPS5998238A (en) * | 1982-11-26 | 1984-06-06 | Toshiba Corp | Data setting method |
| JPS6115072U (en) * | 1984-06-29 | 1986-01-28 | ホ−ヤ株式会社 | Resist coating equipment |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008306220A (en) * | 2008-09-22 | 2008-12-18 | Renesas Technology Corp | Manufacturing method of semiconductor integrated circuit device |
| WO2021260943A1 (en) * | 2020-06-26 | 2021-12-30 | ミカサ株式会社 | Spin-coating device |
| JPWO2021260943A1 (en) * | 2020-06-26 | 2021-12-30 | ||
| CN115916420A (en) * | 2020-06-26 | 2023-04-04 | 三笠株式会社 | Spin coating device |
| TWI899398B (en) * | 2020-12-24 | 2025-10-01 | 日商東京威力科創股份有限公司 | Substrate processing device, substrate processing method, and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2768720B2 (en) | 1998-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |