JPH02230677A - Package of semiconductor device - Google Patents

Abstract

PURPOSE:To easily mount and dismount the package of SOJ without wearing an IC socket or disfiguring SOJ with the package by changing the shape of the package of SOJ. CONSTITUTION:When the package 6 of SOJ is mounted on and dismount from an IC socket 1, a key-like material 7 is hung at a recessed portion of the package 6 so that it can be mounted and dismounted by utilizing the leverage of the key-like material 7 and SOJ by using the IC socket 1 as a fulcrum. Moreover, a hollow projection 8 may be installed on the base face of a package 4; furthermore, projection 9 may be installed at the side of the package 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a package for a semiconductor device.

[Conventional technology]

FIG. 4 is a diagram showing a state in which a conventional semiconductor device (hereinafter referred to as 80J) is attached to a socket, where IILI is a front cross-sectional view and tb+ is a side seal view.

In the figure, the crest is the socket with 0 sockets. 1211 (Works O socket...Pole part, 131i'ff80.7 lead, 14
1 is an SOJ package, and 151 is a rod-shaped object used when removing So and T.

Next, the operation will be explained. Conventionally, SO. T to its work 0
When persuading from socket ill, Kke, engineering C good + I
In the slight gap between + and 80, T package {41,
Insert the rod-shaped object, 51, and use the lever to remove it.

[Problem to be solved by the invention]

Conventionally, a rod-shaped *
1 is inserted and removed using lever action, which caused problems such as wear of the O socket and damage to the 80.7 package.

This invention has the vanishing point between the above points j9i and 80J.
The aim is to obtain a package of

[Means to solve the problem]

The 80J package according to the present invention can be easily attached and detached from a SOYA socket by changing the shape of the 80J package.

[Effect]

The semiconductor device in this invention is SO. T/《Changing the shape of the cage can reduce wear and tear on the semiconductor socket.
80, No scratches on T package, easily 130J'
iIt can be attached and detached.

〔Example〕

Hereinafter, the 13'lJ'k diagram of one embodiment of the invention of C will be described. Figure 1 is a diagram when the SOJ is attached to the IC socket, and the front sectional view of lalH %Ib+ is l! It is an IJ plane sectional view. +lI is the electrode part of the 10 socket, 1t1ζIC socket}m, which is in contact with the SOJ lead -31. {6) is the SOJ package. +lα is the package (61 recess, t?llds O J f I O
This is a gentleman's item used when attaching and detaching from socket 1■.

The missing K operation VC will be explained. SOJ package (6
1) When attaching or detaching from the IC socket +l+, hook the recess 11(l) of the package (6)
IC socket} Using the tll as a fulcrum, connect the broken one (7) and the 80
．． It can be attached and detached using the lever action in step 7.

In addition, in the above embodiment, there is a recess on the sword face of the package (6):
The one with I01 is shown, but Fig. 8+! Ll #
A hollow protrusion {8} may be provided on the bottom surface of the package 0υ like fbi.

Further, in the above embodiment, a recess (lO) was provided in the edge of the package j61, but as shown in FIG.
Like l, there is a protrusion (91
It is also possible to provide the same effect as the above-mentioned example.

[@Ming no Kirika]

As described above, according to the present invention, it is possible to achieve this by simply changing the shape of the package. Leadless semiconductor devices such as SOJ can be easily attached and detached from IC sockets, and
This has the effect of preventing socket wear and damage to the package.

[Brief explanation of the drawing]

Fig. 1 is a diagram when the soy according to an embodiment of the Kogno invention is layered into a socket, and Fig. 1 is a front section view, lb + horizontal cross sectional view, Fig. 8 + ILl lbl, and Fig. 3 +JL
l +t)l is a diagram showing another embodiment of this invention, (
a1 is a front sectional view, +b+ is a regular sectional view, Figure 4 IL1
(131 is a diagram when attached to a conventional B OJt-socket, IILI V'i. front sectional view, (b1 is a t!II plane sectional view. In the figure, Ill is a semiconductor socket}, 12+ 131 is the SOJ lead. (41 is the package, tlil is the rod-like thing when attaching and detaching the 80J, 61 is the 4th part of the side of the package (7) is the one-shaped thing when attaching and detaching the f30J. (8} indicates a hollow protrusion on the bottom of the package, and (9) indicates a protrusion on the first side of the package. In the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] A semiconductor device package characterized in that the semiconductor device can be easily attached and detached from a semiconductor socket by changing the shape of the package.