JPH02233175A - Coating apparatus - Google Patents

Coating apparatus

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Publication number
JPH02233175A
JPH02233175A JP1051854A JP5185489A JPH02233175A JP H02233175 A JPH02233175 A JP H02233175A JP 1051854 A JP1051854 A JP 1051854A JP 5185489 A JP5185489 A JP 5185489A JP H02233175 A JPH02233175 A JP H02233175A
Authority
JP
Japan
Prior art keywords
film thickness
coated
output voltage
reflected light
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1051854A
Other languages
Japanese (ja)
Inventor
Kenji Marumoto
健二 丸本
Atsushi Aya
淳 綾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1051854A priority Critical patent/JPH02233175A/en
Publication of JPH02233175A publication Critical patent/JPH02233175A/en
Pending legal-status Critical Current

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  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To reduce the irregularity of a film thickness at the time of rotary coating by a method wherein monochromatic light is allowed to be incident to the surface of an object to be coated and the intensity of the reflected light from said surface is monitored during rotary coating and the rotational speed of the object to be coated is controlled on the basis of the intensity of the reflected light. CONSTITUTION:An object 1 to be coated is irradiated with laser beam from a laser 10 and the intensity of the reflected light from said object 1 is detected by a light detector 11 and the output voltage of said detector 11 is inputted to a motor control part 6. In this case, since the output voltage V of the light detector cyclically varies corresponding to the reduction of a film thickness, the output voltage V and the film thickness (l) does not correspond in a ratio of 1 : 1 but said output voltage V corresponds to the film thickness (l) as a combination of V and the time differentiation value of V. Therefore, by observing V and the time differentiation value thereof in place of the measurement of the film thickness (l) itself, the rotation of a motor 5 is controlled. The time differentiation value of V is calculated by the timer built in the controller 6. That is, said value is calculated using the values of standard voltage V, measured voltage Vm, a standard voltage gradient and a measured voltage gradient at time (t).

Description

【発明の詳細な説明】 [産業上の利用分野] この発明は、液体の塗布装置、例えば半導体ウエハの表
面にフォトレジストを回転塗布する塗布装置に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a liquid coating device, for example, a coating device for spin-coating a photoresist onto the surface of a semiconductor wafer.

[従来の技術] この種の塗布装置は平板に液体を均一に塗布することか
比較的容易であることから種々の分野で利用されている
。半導体製造プロセスにおいても、株式会社工業調査会
発行[電子材料J  (1988、12月号別冊)゛7
8〜83ページに示されるように、シリコンウエハ上に
フォトレジストを塗布スるのに用いられている。
[Prior Art] This type of coating device is used in various fields because it is relatively easy to uniformly coat a liquid onto a flat plate. In the semiconductor manufacturing process as well, published by Kogyo Kenkyukai Co., Ltd. [Electronic Materials J (1988, December issue special issue)
As shown on pages 8-83, it is used to coat photoresist onto silicon wafers.

第6図は従来の塗布装置を示し(以下従来例1と呼ぶ)
、(1)はシリコンウエハなどの被塗布体、(2)はフ
オトレジストなどの塗布液、(3)は塗布液を被塗布体
に滴下するためのノズル、(4)はチャック、(5)は
モータ、(6)はモータ制御部である。
Figure 6 shows a conventional coating device (hereinafter referred to as conventional example 1).
, (1) is an object to be coated such as a silicon wafer, (2) is a coating liquid such as photoresist, (3) is a nozzle for dropping the coating liquid onto the object to be coated, (4) is a chuck, and (5) is (6) is a motor, and (6) is a motor control section.

次に動作について、シリコンウエハにフォトレジストを
塗布する場合を例にとり説明する。まず、モータ(5)
に接続されたチャック(4)の上にウエハ(1)が設置
され、さらに例えば真空吸引力によりウエハ(1)が固
定される。次いで、ノズル(3)から適量のフォトレジ
スト液(2)がウエハ(1)上に滴下される。このレジ
スト液(2)の滴下は以下に行うウエハ(1)の回転が
開始されてからでもよい。
Next, the operation will be explained using a case where a photoresist is applied to a silicon wafer as an example. First, the motor (5)
The wafer (1) is placed on a chuck (4) connected to the chuck (4), and the wafer (1) is further fixed by, for example, a vacuum suction force. Next, an appropriate amount of photoresist liquid (2) is dropped onto the wafer (1) from the nozzle (3). The resist liquid (2) may be dropped after the rotation of the wafer (1), which will be described below, has started.

次に、ウエハ(1)が、予め決定された回転パターンに
従って回転するモータ(5)の回転にチャック(4)を
介して連動して回転する。この間レジスト(2)は、溶
媒の蒸発を伴いながら遠心力によってウエハ(1)上を
拡がり薄膜を形成する。
Next, the wafer (1) is rotated via the chuck (4) in conjunction with the rotation of the motor (5), which rotates according to a predetermined rotation pattern. During this time, the resist (2) spreads over the wafer (1) by centrifugal force while the solvent evaporates, forming a thin film.

モータ(5)の回転数や回転時間などの回転パターンは
、使用するレジスト(2)の粘度や、所望の膜厚から、
予め条件出しを行って決定されている。
The rotation pattern such as the rotation speed and rotation time of the motor (5) is determined based on the viscosity of the resist (2) used and the desired film thickness.
This is determined by setting conditions in advance.

以上のような従来例1では、予め決められた条件で一律
に運転されるため、通常、多数枚のウエハが連続して処
理される際に、雰囲気条件や供給液温などの微妙な変化
に対して、ウエノ\表面に形成されるレジストの膜厚を
一定にすることが困難であり、膜厚のばらつきを招くと
いう欠点があった。
In Conventional Example 1, as described above, the operation is uniformly performed under predetermined conditions, so when a large number of wafers are processed in succession, it is usually difficult to deal with subtle changes in atmospheric conditions, supply liquid temperature, etc. On the other hand, it is difficult to make the thickness of the resist formed on the Ueno surface constant, resulting in variations in the film thickness.

以上のような欠点を解消する手段としては、特開昭63
−51976号公報に示された発明がある(以下、この
発明を従来例2と呼ぶ)。これを第7図に示す。図にお
いて(104)は膜厚測定部、(105)は膜厚制御部
、(106)はモータ制御部、(100)はレーザ光で
ある。この従来例2は、回転されつつある被塗布体(1
)における溶液(2)の膜厚を計測する膜厚測定部(1
04)と、この測定部(104)における測定値に基づ
いて、回転されつつある被塗布体(1)の回転速度を制
御し、所定の膜厚を得るための膜厚制御部(105)を
有することを特徴としている。
As a means to eliminate the above-mentioned drawbacks, there is
There is an invention disclosed in Japanese Patent No. -51976 (hereinafter, this invention will be referred to as Conventional Example 2). This is shown in FIG. In the figure, (104) is a film thickness measurement section, (105) is a film thickness control section, (106) is a motor control section, and (100) is a laser beam. In this conventional example 2, the object to be coated (1
) for measuring the film thickness of solution (2) in
04) and a film thickness control part (105) for controlling the rotational speed of the object to be coated (1) being rotated based on the measured value in the measuring part (104) to obtain a predetermined film thickness. It is characterized by having

膜厚の測定方法としては被塗布体(1)に対して、ほぼ
垂直にレーザ光(100)を入射させ、塗布膜によるレ
ーザ光(100)の干渉縞などを観測するという方法を
採っている。
The method for measuring the film thickness is to make the laser beam (100) almost perpendicular to the object to be coated (1) and observe the interference fringes of the laser beam (100) due to the coating film. .

そして、予め記憶された時間一膜厚関係と回転中の膜厚
計測値の比較により、モータの回転数を塗布中動的に制
御するようになっている。
The rotational speed of the motor is dynamically controlled during coating by comparing the time-film thickness relationship stored in advance with the film thickness measurement value during rotation.

このように従来例2では、従来は従来例lのように予め
決められた条件で一律に運転されていた回転塗布装置に
フイードバノク制御の考えをとり入れることにより、膜
厚のばらつきの問題を解決しようとしたものであり、フ
ィードバック制御を行うというX点に関してはこの発明
と一致している。
In this way, Conventional Example 2 attempts to solve the problem of film thickness variations by incorporating the idea of feed vanock control into the rotary coating device, which was conventionally operated uniformly under predetermined conditions as in Conventional Example 1. This is consistent with the present invention regarding the point X that feedback control is performed.

しかしながら従来例2においては、フィードバック制御
を行うために、膜厚値そのものを測定するものとし、さ
らに、その測定方法の一例としてレーザによる干渉縞の
観察を挙げ、他の具体的な膜厚計測方法は述べていない
。通常、高々数十秒程度で終了する回転塗布の動的な制
御のためには、高速に制御方策が決定されねばならず、
このために、膜厚そのものを計測することは不適当であ
ると考えられる。従って、より速《制御方法を与えるた
めには、膜厚値そのものを計測するよりも、膜゛厚と関
連した少なくとも1つの他の情報量をモニタする方が望
ましい。無論、この情報量が、例えば何らかの方法で−
ff計測されたウェハ上のレジスト重量といった場合の
ように、容易に膜厚に換算できる場合はこの限りではな
いが、上記従・来例2のように干渉縞の観察から液膜の
厚さを高速に求めることは、通常、困難であり、高価な
装置を必要とする。
However, in Conventional Example 2, in order to perform feedback control, the film thickness value itself is measured, and one example of the measurement method is observation of interference fringes by a laser, and other specific film thickness measurement methods are used. has not been stated. Normally, in order to dynamically control spin coating, which completes in a few tens of seconds at most, control strategies must be determined quickly.
For this reason, it is considered inappropriate to measure the film thickness itself. Therefore, in order to provide a faster control method, it is preferable to monitor at least one other amount of information related to the film thickness rather than measuring the film thickness value itself. Of course, if this amount of information is
ff This does not apply to cases where it can be easily converted to film thickness, such as the measured weight of resist on a wafer, but it is possible to calculate the thickness of the liquid film from observation of interference fringes, as in the conventional/conventional example 2 above. Requiring high speeds is usually difficult and requires expensive equipment.

[発明が解決しようとする課題コ 以上のような従来例2の塗布装置は、フィードバック制
御のために、膜厚値そのものをモニタしていること、加
えて、その方法として干渉縞の観察という煩雑な手法を
用いている。また、装置が高価であるなどの問題があっ
た。
[Problems to be Solved by the Invention] The coating device of Conventional Example 2 as described above monitors the film thickness value itself for feedback control, and in addition, the method involves the complicated observation of interference fringes. A method is used. Furthermore, there were other problems such as the equipment being expensive.

この発明は上記の課題を解決するためになされたもので
、供給液温や、雰囲気温度に伴う膜厚のばらつきを防止
するために、フィードバック制御の考え方を採用するが
、その際、制御のための情報量の検出と制御方策の決定
を高速に行うことにより制御をより確実なものとし、か
つ、構造簡単で安価な塗布装置を得ることを目的とする
This invention was made in order to solve the above problems, and in order to prevent variations in film thickness due to supply liquid temperature and ambient temperature, the idea of feedback control is adopted. The purpose of the present invention is to detect the amount of information and determine control measures at high speed, thereby making the control more reliable, and to obtain a coating device with a simple structure and low cost.

[課題を解決するための手段] この発明に係る塗布装置は、単色光を被塗布体の表面に
入射させ、その反射光の強度を回転塗布中モニタし、そ
の反射光強度に基づいて被塗布体の回転速度の制御を行
うようにしたものである。
[Means for Solving the Problems] The coating device according to the present invention makes monochromatic light incident on the surface of the object to be coated, monitors the intensity of the reflected light during spin coating, and determines the direction of the object to be coated based on the intensity of the reflected light. It is designed to control the rotation speed of the body.

[作 用] この発明においては、高速に膜厚のフイード/sjツタ
制御が行え、この結果、供給液温や雰囲気条件の変動に
伴う膜厚のばらつきを極小とする。
[Function] In this invention, feed/sj ivy control of film thickness can be performed at high speed, and as a result, variations in film thickness due to fluctuations in supply liquid temperature and atmospheric conditions are minimized.

[実施例] 以下、この発明の一実施例を第1図〜第5図について説
明する。第1図において被塗布体(1)、塗布液(2)
、チ忙ノク(4)、モータ(5)等は第7図に示した従
来例1と同様である。塗布液滴下用ノズルは省略した。
[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 to 5. In Figure 1, the object to be coated (1), the coating liquid (2)
, the stopper (4), the motor (5), etc. are the same as those in the conventional example 1 shown in FIG. The nozzle for dropping the coating liquid was omitted.

ここでは、単色光源であるレーザ(10)、例えばフォ
トダイオードなどの光強度検出器(l1)が設けられて
いる。(6)はモータ制御部である。
Here, a laser (10) which is a monochromatic light source and a light intensity detector (11) such as a photodiode are provided. (6) is a motor control section.

次に動作について説明する。被塗布体(1)上に滴下さ
れた塗布液(2)は、モータ(5)の回転に伴う被塗布
体(1)の回転により遠心力を受け、被塗布体(1)上
をうずく拡がってゆ《。塗布iffl(2)が、半導体
プロセスにおけるフォトレジストのように、蒸発性の溶
媒を含む場合には、上記遠心力による液膜の減少に加え
て、溶媒蒸発による液膜の減少も生じる。さて、この従
来例ではモータ回転開始時、あるいはその前から連続し
て、レーザ(lO)よりレーザ光を被塗布体(1)上に
照射し、その反射光の強度を検出器(11)により検出
している。この実施例では、レーザ(IO)として数m
W程度のlie−Meレーザ(波長6328オングスト
ローム)を用いている。また、光検出器(l1)として
はフオトダイオ・−ドを用い、電流出力を定抵抗両端の
電圧出力に変換して検出している。
Next, the operation will be explained. The coating liquid (2) dropped onto the object to be coated (1) is subjected to centrifugal force due to the rotation of the object to be coated (1) due to the rotation of the motor (5), and spreads over the object to be coated (1). Teyu《. When the coating iffl(2) contains an evaporable solvent, such as a photoresist in a semiconductor process, in addition to the reduction of the liquid film due to the centrifugal force, the reduction of the liquid film also occurs due to solvent evaporation. Now, in this conventional example, a laser beam (lO) is irradiated onto the object to be coated (1) at the start of motor rotation or continuously before that, and the intensity of the reflected light is measured by a detector (11). Detected. In this example, the laser (IO) is several meters long.
A lie-Me laser (wavelength: 6328 angstroms) of about W is used. A photodiode is used as the photodetector (l1), and current output is converted into voltage output across a constant resistor for detection.

このとき電圧出力として、容易に数I QmV以上の電
圧が得られ、また、フォトダイオードは、光量と電圧出
力の直線性にもすぐれ、さらに応答速度も回転塗布のフ
ィードバック制御に対し十分に速い。
At this time, a voltage of several IQmV or more can be easily obtained as a voltage output, and the photodiode has excellent linearity of light amount and voltage output, and furthermore, the response speed is sufficiently fast for feedback control of spin coating.

なお、レーザの入射角については特別なる制限はないが
、ここではほぼ垂直に近い条件とした。
Although there is no particular restriction on the incident angle of the laser, here the condition is set to be almost perpendicular.

光検出器(11)で出力された電圧信号はモータ制御部
(6)に取込まれ、ここで制御方策が決定される。以下
、この実施例の制御方法を説明する前に、その基本原理
について述べる。反射光のエネルギ強度は液膜(2)の
厚さQの変化に伴って周期的に変動する。この様子を第
2図に示す。第2図には3つのグラフが示されているが
、全て横軸は回転時間を示す。縦軸はグラフ(2−1)
では膜厚e、グラフ(2−2)では反射光強度■、グラ
フ(2−3)では光強度検出器の出力電圧■である。グ
ラフ(2−1)は、回転に伴い液膜の厚さが減少してゆ
く様子を示している。グラフ(2−2)は、液膜厚さの
減少に伴って反射光強度が周期的に変動する様子を示し
ている。この反射光強度の振動は、液膜厚さが一定量Δ
g減少する毎に起こり、 λ ?e =■  ・ ・ ・ ・(1) 2nt で与えられる。λはレーザ光の波長,n,は塗布液(2
)の屈折率である。この実施例ではHe−Neレーザを
用いているので波長λは6328人である。
The voltage signal output by the photodetector (11) is taken into the motor control section (6), where a control policy is determined. Below, before explaining the control method of this embodiment, its basic principle will be described. The energy intensity of the reflected light changes periodically as the thickness Q of the liquid film (2) changes. This situation is shown in FIG. Three graphs are shown in FIG. 2, and the horizontal axis in all graphs indicates rotation time. The vertical axis is the graph (2-1)
Graph (2-2) shows the film thickness e, graph (2-2) shows the reflected light intensity (■), and graph (2-3) shows the output voltage of the light intensity detector (■). Graph (2-1) shows how the thickness of the liquid film decreases with rotation. Graph (2-2) shows how the reflected light intensity changes periodically as the liquid film thickness decreases. This oscillation of reflected light intensity is caused by a constant amount Δ of the liquid film thickness.
It occurs every time g decreases, and λ? e =■ ・ ・ ・ ・(1) Given by 2nt. λ is the wavelength of the laser beam, n is the coating liquid (2
) is the refractive index. In this example, since a He-Ne laser is used, the wavelength λ is 6328.

n,を液体の一般的な値として例えば1.5とすると、
△eはおよそ2100人= 0. 21μmとなる。た
だし、式(1)は垂直入射の場合の式であり、以下も同
様に簡単のためレーザビームが被塗布体と垂直であると
して説明を行う。
If n is a typical value for liquids, for example 1.5, then
△e is approximately 2100 people = 0. It becomes 21 μm. However, equation (1) is an equation in the case of vertical incidence, and for the sake of simplicity, the following description will be made assuming that the laser beam is perpendicular to the object to be coated.

グラフ(2−3)は、光検出器(11)によって出力さ
れる電圧信号の時間変化を示したものである。
Graph (2-3) shows the time change of the voltage signal output by the photodetector (11).

すでにのべたように、この実施例で光検出器として用6
ているフォトダイオードは線形性に優れているため、出
力電圧■の時間変化は反射光強度Iの時間変化に相似な
ものとなる。
As already mentioned, in this example, the 6
Since the photodiode shown in FIG.

ところで回転塗布においては、膜厚の変化は時間の経過
と共に次第に小さくなって《る。例えば3μmから2μ
mまでlμm減少するのに要する時冊と、そこからさら
にll1m減少し1μmの膜厚が形成されるのに要する
時間は、溶媒の蒸発がなく液体の粘性が変化しない場合
でも5倍以上異.なる。
By the way, in spin coating, the change in film thickness gradually becomes smaller with the passage of time. For example, from 3μm to 2μm
The time required to reduce the film thickness by 1μm to 1μm and the time required to further decrease by 1m to form a film thickness of 1μm are more than 5 times different even when the solvent does not evaporate and the viscosity of the liquid does not change. Become.

光検出器(11)の出力電圧■は、膜厚の減少に応じて
周期的に変動するため、■と膜厚Qは1対1に対応して
はいないが、上述のことから、■と■の時間/微分■の
組み合わせとしては膜厚ρと対応している。従って膜厚
Qそのものを測定する代わりに、■とVをみることによ
り、モータ(5)の回転速度を制御することが可能であ
る。■は光検出器(l1)の出力そのものであるし、■
もモータ制御部(6)に当然内蔵されているタイマによ
り容易に算出することができる。
Since the output voltage (■) of the photodetector (11) changes periodically as the film thickness decreases, there is not a one-to-one correspondence between (■) and the film thickness Q, but from the above, The combination of time/differential (2) corresponds to the film thickness ρ. Therefore, instead of measuring the film thickness Q itself, by looking at ■ and V, it is possible to control the rotational speed of the motor (5). ■ is the output of the photodetector (l1) itself, and ■
can also be easily calculated using a timer built into the motor control section (6).

以下、光検出器(l1)の出力電圧Vとその時間微分■
を用いてモータ回転数を制御する方法について具体的に
説明する。第3図に示した2つのグラフは共に時間(に
対する出力電圧Vの変化を示している。図中t,はモー
タの回転終了時間である。
Below, the output voltage V of the photodetector (l1) and its time differential ■
A method of controlling the motor rotation speed using the following will be explained in detail. The two graphs shown in FIG. 3 both show changes in the output voltage V with respect to time. In the graph, t is the end time of the motor rotation.

実線の曲線は予め実験などにより決められた標準的な時
間一出力電圧関係であり、この関係は、モタ制御部(6
)に記憶されている。図中の破線は光検出器(1l)の
出力電圧Vの計測値を示している。(a)のグラフでは
、破線は実線より遅れており、この場合、モータの回転
速度を大きくする必要がある。(b)では逆に破線は実
線より進んでおりモータの回転速度を小さくしなければ
ならない。このような制御方策の決定は、その時刻むに
おける標準電圧■、計測電圧Vm,標準電圧勾に行うこ
とができる。このフローチャートを第4図に示す。図中
V1は出力電圧の極大値と極小値の中間程度の任意の電
圧であり、計測時点が極大値近傍か極小値近傍かの判定
に用いる。
The solid curve is a standard time-output voltage relationship determined in advance through experiments, etc., and this relationship is based on the motor control unit (6
) is stored in The broken line in the figure indicates the measured value of the output voltage V of the photodetector (1l). In the graph (a), the broken line lags behind the solid line, and in this case, it is necessary to increase the rotational speed of the motor. In (b), conversely, the broken line is ahead of the solid line, and the rotational speed of the motor must be reduced. Such a control strategy can be determined based on the standard voltage (2), measured voltage Vm, and standard voltage gradient at that time. This flowchart is shown in FIG. In the figure, V1 is an arbitrary voltage approximately between the maximum value and the minimum value of the output voltage, and is used to determine whether the measurement time point is near the maximum value or the minimum value.

図中■〜■で示した8つの場合の標準電圧出力と、計測
電圧出力の関係を第5図に示す。
FIG. 5 shows the relationship between the standard voltage output and the measured voltage output in eight cases indicated by ■ to ■ in the figure.

実線は標準値、破線は計測値である。The solid line is the standard value, and the broken line is the measured value.

なお、上記実施例では、光検出器(1t)からの出力電
圧値■をモニタしていたが、回転塗布中に反射光強度を
検出しながら回転塗布中くり返し光検出器(U)から出
力される。極太値Vpを制御部で記憶し、出力電圧■に
代わってx 一V / V pをモニタし、この値とそ
の時間微分Xを用いて同様の制御を行ってもよい。上記
のような判断が行える制御部を備えたことにより、例え
ばレーザ(10)の出力の変動や光検出器(1l)の検
出面の汚れ等による信号レベルの長期的な変化に対して
、制御部のI準値に関するメモリの変更が不要になると
いう効果があり、装置の信頼性を高めることができる。
In the above embodiment, the output voltage value ■ from the photodetector (1t) was monitored, but the output voltage value ■ from the photodetector (U) was monitored repeatedly during spin coating while detecting the reflected light intensity during spin coating. Ru. The extremely thick value Vp may be stored in the control section, x-V/Vp may be monitored instead of the output voltage (2), and similar control may be performed using this value and its time differential X. Equipped with a control unit that can make the above judgments, it is possible to control long-term changes in signal level due to fluctuations in the output of the laser (10), dirt on the detection surface of the photodetector (1l), etc. This has the effect that it is not necessary to change the memory regarding the I standard value of the part, and the reliability of the device can be improved.

[発明の効果] 以上のように、この発明によれば、単色光の彼塗布体に
よる反射光をモニタし、反射光強度に基いて被塗布体の
回転速度を制御するので、簡単な装置で高速に、膜厚の
フィードバックを行うことができ、回転塗布時の膜厚の
ばらつきを小さくすることができるという効果があり、
例えば半導体製品の品質向上や歩留り向上に寄与する所
大である。
[Effects of the Invention] As described above, according to the present invention, the monochromatic light reflected by the object to be coated is monitored and the rotational speed of the object to be coated is controlled based on the intensity of the reflected light. It has the effect of being able to provide feedback on film thickness at high speed and reducing variations in film thickness during spin coating.
For example, it greatly contributes to improving the quality and yield of semiconductor products.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第5図はこの発明の一実施例を示し、第1図は
概略側面図、第2図は膜厚、反射光強度および出力電圧
の時間変化特性線図、第3図反射光制御方法の基本を説
明するための出力電圧特性線図、第4図はフローチャー
ト図、第5図は第4図の補足説明のための電“圧特性線
図である。 第6図および第7図はそれぞれ従来の塗布装置の概略側
面図である。 (1)  ・・被塗布体、(2)・・塗布液、ぐ5)・
・モータ、(6)・・モータ制御部、(10)・レーザ
(単色光源) 、(11)・・先検出器。 なお、各図中、同一符号は同一又は相当部分を示す。 代  理  人 曾  我  道  照 弟 図 1 : ネ友七Qドイ1逼イ2ト; 2二至布液 5: そーフ 10: レーザ゛(単色光先式) 11:光技七魯 第 図 (a) (b) 第 図 第 図 第 図
Figures 1 to 5 show an embodiment of the present invention, with Figure 1 being a schematic side view, Figure 2 being a time-varying characteristic diagram of film thickness, reflected light intensity, and output voltage, and Figure 3 being a graph of reflected light. FIG. 4 is an output voltage characteristic diagram for explaining the basics of the control method, FIG. 4 is a flowchart diagram, and FIG. 5 is a voltage characteristic diagram for supplementary explanation of FIG. 4. FIGS. 6 and 7 Each figure is a schematic side view of a conventional coating device. (1) ... object to be coated, (2) ... coating liquid, 5)
- Motor, (6)... Motor control unit, (10) - Laser (monochromatic light source), (11)... Predetermined detector. In each figure, the same reference numerals indicate the same or equivalent parts. 1: Neyushichi Qdoi 1st place 2nd; 22nd cloth liquid 5: Sofu 10: Laser (monochromatic light point type) 11: Optical technique 7th grade (a) (b) Figure Figure Figure

Claims (1)

【特許請求の範囲】[Claims] 被塗布体上に塗布液を滴下し、前記被塗布体を回転させ
て前記塗布液を遠心力により拡げ、前記被塗布体上に塗
布液膜を形成させる塗布装置において、単色光を前記被
塗布体の表面に入射させる手段と、この反射光の強度を
検出するための光検出器と、前記光検出器で塗布時に検
出された光強度に基づいて回転中の前記被塗布体の回転
速度を制御するモータ制御部とを備えてなることを特徴
とする塗布装置。
In a coating device that drops a coating liquid onto an object to be coated, rotates the object to spread the coating liquid by centrifugal force, and forms a film of the coating liquid on the object to be coated, monochromatic light is applied to the object to be coated. a means for making the reflected light incident on the surface of the body; a photodetector for detecting the intensity of the reflected light; and a rotational speed of the rotating object to be coated based on the light intensity detected by the photodetector during coating. A coating device comprising: a motor control section for controlling the coating device.
JP1051854A 1989-03-06 1989-03-06 Coating apparatus Pending JPH02233175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1051854A JPH02233175A (en) 1989-03-06 1989-03-06 Coating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1051854A JPH02233175A (en) 1989-03-06 1989-03-06 Coating apparatus

Publications (1)

Publication Number Publication Date
JPH02233175A true JPH02233175A (en) 1990-09-14

Family

ID=12898448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1051854A Pending JPH02233175A (en) 1989-03-06 1989-03-06 Coating apparatus

Country Status (1)

Country Link
JP (1) JPH02233175A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005082550A1 (en) * 2004-03-01 2005-09-09 Origin Electric Company, Limited Disk producing method and device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005082550A1 (en) * 2004-03-01 2005-09-09 Origin Electric Company, Limited Disk producing method and device
DE112005000463B4 (en) * 2004-03-01 2011-04-28 Origin Electric Company, Ltd. Manufacturing method and manufacturing device for a disc

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