JPH02233723A - New functional polyphenylene oxide resin composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a functionalized polyphenylene ether resin composition, and more specifically, a functionalized polyphenylene ether resin composition that is imparted with curability and film-forming properties by reacting an epoxy compound to a polyphenylene ether resin. , relates to a novel functionalized polyphenylene ether resin composition with improved chemical resistance after curing.

[Prior Art] Polyphenylene ether resin is an engineering plastic with excellent mechanical properties and electrical properties, and is known as a resin with high heat resistance. However, this resin has a problem in that it has poor melt moldability and wet film forming properties, and therefore its uses have been limited. Therefore, in order to improve its melt moldability, a technique of blending it with styrene resin has been developed and is now being used more widely and in more fields. In addition, polyphenylene ether is acid, alkali,
Although it has strong resistance to hot water, it has very weak resistance to aromatic hydrocarbon compounds and halogen-substituted hydrocarbon compounds, and because it dissolves in these solvents, there have been various limitations in its use.

In order to improve the chemical resistance of such polyphenylene ether resins, a method has been proposed to introduce crosslinking functional groups into the chains of polyphenylene ether and use it as a curable polyphenylene ether. However, satisfactory results have not been obtained using this method. For example, US Pat. No. 3,417,053 discloses a polymer in which a nialkoxysilyl group is introduced into the chain of polyphenylene ether, but the alkoxysilyl group is easily hydrolyzed when it comes into contact with water, and siloxane is formed via silanol. Since this alkoxysilylated polyphenylene ether crosslinks when exposed to water vapor in the air at room temperature, it is extremely difficult to handle.

On the other hand, US Pat. No. 4,634,742 discloses a polymer in which vinyl groups are introduced into the chains of polyphenylene ether through the following reaction. First, polyphenylene ether is reacted with bromine to bromate the methyl group at the 2.6-position, or 1-chloromethoxy-
Either a Friedel-Crach reaction is carried out with 4-rorobutane and tin tetrachloride to introduce a roromethyl group into the 3.5-position of the phenyl group. Subsequently, the halomethyl group thus obtained is reacted with triphenylphosphine to form a phosphonium salt. Finally, it is converted into a vinyl group by carrying out a Witsch reaction using formaldehyde and sodium hydroxide. That is, this method requires three steps to introduce the vinyl group and requires the use of a special reactant, which is extremely disadvantageous for industrial use. In addition, the vinyl group introduced in this way is directly bonded to the aromatic ring of polyphenylene ether without going through a flexible carbon chain or ether bond, so after crosslinking, it lacks flexibility and becomes an extremely brittle material. Not practical.

Furthermore, as a method of curing polyphenylene ether other than introducing a crosslinkable functional group, US Pat. No. 3,455,736
The patent specification discloses a method of heat treating polyphenylene ether in the presence of oxygen.

The polyphenylene ether used here is only an unsubstituted phenol polymer, and no examples are given for 2,6-dimethyl substituted polyphenylene ether, which is widely known today.

Furthermore, since contact with oxygen is required, its use is limited to films or coatings on metals, glass, etc. Moreover, this product has insufficient improvement in chemical resistance.

[Problems to be Solved by the Present Invention] In view of the above circumstances, the present invention aims to solve the problems of polyphenylene ether resin. The purpose of the present invention is to provide a novel functionalized polyphenylene ether resin composition that has new curability and film-forming properties while retaining the same mechanical properties and has chemical resistance after curing. be.

[Means for Solving the Problems] As a result of intensive studies to solve the above problems, the present inventors came to invent a functionalized polyphenylene ether resin composition with a novel structure that meets the purpose of the present invention. . That is, the present invention provides a functionalized polyphenylene ether comprising a reaction product of (a) a polyphenylene ether resin and (b) an epoxy compound represented by the general formula CH3CH2, which may be the same or different from each other. The present invention provides a novel functionalized polyphenylene ether resin composition characterized in that the amount of reacted epoxy compound in the composition is from 0.1 to 50% by weight.

The polyphenylene ether resin used in the present invention is represented by the following general formula.

Q f J-H), (I) where m is 1
or an integer of 2, J is a polyphenylene ether chain substantially composed of units represented by the following general formula, Q represents a hydrogen atom when m is 1, and a hydrogen atom when m is 2. It represents the residue of a bifunctional phenol compound that has two phenolic hydroxyl groups in its molecule and has polymerization-inactive substituents at the ortho and para positions of the phenolic hydroxyl group.

Representative examples of Q include compounds represented by the following two general formulas.

[In the formula, A1 and A2 represent the same or different linear alkyl groups having 1 to 4 carbon atoms, and X is an aliphatic hydrocarbon residue and substituted derivatives thereof, an aromatic hydrocarbon residue and substituted derivatives thereof , aralkyl group and substituted derivatives thereof, oxygen, sulfur, sulfonyl group, carbonyl group, etc., and two phenyl groups directly bonded to A2, A2 and X
The bonding positions of are all at the or-l position and the para-position of the phenolic hydroxyl group. ] As a specific example, a copolymer obtained from copolymerization of phenol is also a preferred example.

The molecular weight of the polyphenylene ether resin of general formula (I) is not particularly limited, and ranges from low molecular weight to high molecular weight ones can be used. /C is 0.2~
Those within the range of 1.0 can be used satisfactorily.

The epoxy compound used in the present invention is represented by the following general formula.

etc.

A particularly preferred example of the polyphenylene ether resin of general formula (I) is poly(2,6-dimethyl-1,4-phenylene ether) obtained by oxidative polymerization of 2,6-dimethylphenol alone. . In addition, 2.6-dimethylphenol and 2.3.6-}rimethyl, where Rt,
R2. As R3 and R4, CH=CH2 or CH2-0 C〇1 CH3 Examples of combinations include those shown in Table 1 below.

(Left below) As an example of the method for producing the functionalized polyphenylene ether resin composition of the present invention, the polyphenylene ether resin of general formula (I) is metalized with an organic metal, and then the epoxy compound of general formula (IV) is added. Examples include a method comprising a step of reacting. Examples of organic metals include methyllithium, n
-butyllithium, See-butyllithium, tert
-butyllithium, phenyllithium, etc., and n-butyllithium can be used particularly well.

This reaction uses tetrahydrofuran (hereinafter abbreviated as THF).

), 1,4-dioxane, dimethoxyethane, and other ether solvents; N. It can also be carried out using a hydrocarbon solvent such as cyclohexane, benzene, toluene, xylene, etc. in the coexistence of N',N'-tetramethylethylenediamine. In the actual reaction, it is preferable to use these solvents after pretreatment such as purification and dehydration.Also, even if they are mixed in an appropriate proportion, one or more solvents other than those mentioned above will not inhibit the reaction. A solvent may also be present. This reaction is particularly preferably carried out under an inert gas atmosphere such as nitrogen or argon.

The reaction temperature and reaction time for carrying out this reaction are not particularly limited, but for metallization reactions, the temperature is between -78°C (the freezing point of the system for those that solidify) to the boiling point of the system; More preferably, the time is 1 between -78°C (the freezing point of the system for those that solidify) and 50°C.
It is carried out for between seconds and 5 hours, more preferably between 1 minute and 3 hours. Also, for the addition reaction of epoxy compounds, the temperature is -78℃ (for those that solidify, the freezing point of the system)
Between the boiling point of the system, more preferably between -78°C (for those that solidify, the freezing point of the system) and 50°C, for a time of 1 second to 5
It is carried out for a period of time, more preferably between 1 minute and 3 hours.

Another method for producing a functionalized polyphenylene ether resin composition is to react the terminal hydroxyl group of the polyphenylene ether with a polyphenylene ether resin of general formula (I) and an epoxy compound of general formula (IV), such as A method using a phase transfer catalyst as disclosed in JP-A No. 54-33593 can be effectively used.

That is, the polyphenylene ether resin of general formula (1) and the epoxy compound of general formula (II) are brought into contact in the presence of a water-soluble base and a phase transfer catalyst, and a reactant of the epoxy compound is deposited on the terminal hydroxyl group of the polyphenylene ether resin. This is a method of introducing

The water-soluble base used in this method may be any water-soluble base that can convert the terminal hydroxyl group of polyphenylene ether into a phenoxide ion. Specific examples of bases that can be used in this method include alkali metal or alkaline earth metal hydroxides and carbonates, such as potassium hydroxide, sodium hydroxide, sodium carbonate, barium carbonate, and the like. There is no particular restriction on the amount used, but it is 0.1 to 1000 mol, more preferably 1 to 10 mol per mol of hydroxyl group of the polyphenylene ether resin.
0 mol, more preferably 5 to 50 mol of base is used. The water-soluble base is suitably used as an aqueous solution, in which case the concentration is 10-50% by weight, preferably 25-50% by weight.
The content is preferably 50% by weight.

The phase transfer catalyst used in this method is not particularly limited, but includes, for example, quaternary ammonium compounds, quaternary phosphonium compounds, tertiary sulfonium compounds, and mixtures thereof. A preferred interphase transfer element is represented by the following equation.

In the formula, R5 to R8 have 1 to 30 carbon atoms, preferably 1 to 2 carbon atoms.
0 represents an aliphatic hydrocarbon group, aromatic hydrocarbon group, or aralkyl group, Y1 is F-, Cρ- is SO , CO
, C204.

Specific examples of particularly preferred phase transfer catalysts include tetramethylammonium chloride, tetraethylammonium chloride, tetra-n-butylammonium chloride,
Tetra n-butylammonium bromide, Tetra n-butylammonium hydrogen sulfate, penzyltriethylammonium chloride, tricaprylmethylammonium chloride, n-hexadecyltrimethylammonium chloride, n-hexadecyltrimethylammonium bromide, methyltrioctylammonium chloride, These include tetra-n-butylphosphonium bromide, pendyltriphenylphosphonium chloride, n-hexadecyltri-n-butylphosphonium bromide, and the like. There is no particular restriction on the amount used, but it is 0.001 to 10 mol, more preferably 0.0 mol per mol of hydroxyl group of the polyphenylene ether resin.
1 to 1.0 mol, more preferably 0.05 to 0.5 mol of phase transfer catalyst is used.

The preferred amount of the epoxy compound used in this reaction is 0.1 per mole of hydroxyl group of the polyphenylene ether resin.
~100 mol, more preferably 1.0 to 10 mol.

The reaction time of this reaction is arbitrary, and can be carried out in the range of 1 minute to 30 hours, more preferably 1 hour to 20 hours. There is also no limit to the reaction temperature; it can range from 0 to 150°C.
, more preferably at a temperature of 10 to 100°C.

When carrying out this reaction, it is preferable to use the polyphenylene ether resin of general formula (T) after dissolving it in a solvent. For example, benzene,
Aromatic hydrocarbon solvents such as toluene and xylene can be used favorably. The reaction is also preferably carried out under mixing conditions such that the reaction mixture is subjected to high shear stress.

The structure and composition of the functionalized polyphenylene ether resin composition of the present invention obtained by the above method is currently not precisely known. However, from measurements such as nuclear magnetic resonance (hereinafter abbreviated as NMR) spectra and infrared absorption spectra, the functionalized polyphenylene ether resin composition of the present invention has a structure of general formula (II) attributed to the raw material polyphenylene ether resin. It has been found that in addition to the units represented by the formula, it contains at least one type of units from the following three types of units represented by the structural formulas.

Here, n in formulas (V) to (■) is an arbitrary integer. That is, general formulas (V) to (■) (hydroxyl group-containing compounds produced by the reaction of moss polyphenylene ether and an epoxy compound).

Note that proof that the functionalized polyphenylene ether resin composition of the present invention is a reaction product of polyphenylene ether and an epoxy compound includes the results of purification by Soxhlet extraction and reprecipitation. That is, even if Soxhlet extraction is performed with a solvent that does not dissolve the functionalized polyphenylene ether resin composition of the present invention and that dissolves the epoxy compound or the polymer of the epoxy compound, the NMR spectrum of the functionalized polyphenylene ether resin composition changes. was not recognized. Further, the resin composition was dissolved in a solvent such as chloroform and then poured into a poor solvent such as water to cause reprecipitation, but similarly no change was observed in the NMR spectrum.

The content of the reacted epoxy compound in the functionalized polyphenylene ether resin composition of the present invention ranges from 0.1 to 50% by weight, more preferably from 1 to 30% by weight based on the resin composition. . If the content of the reacted epoxy compound is less than 1%, not only the chemical resistance after curing will be insufficient, but also the film forming properties of the resin composition will be unsatisfactory, which is not preferable.

Moreover, if it exceeds 50% by weight, it becomes extremely brittle after curing, which is not preferable.

As a method for determining the content of the reacted epoxy compound in the functionalized polyphenylene ether resin composition of the present invention,
An example of this method is to determine the amount by increasing the amount of polyphenylene ether resin used as a raw material.

The molecular weight of the functionalized polyphenylene ether resin composition of the present invention is not particularly limited, and ranges from low molecular weight to high molecular weight can be used, but in particular at 30°C, 0.5 g/
Those having a viscosity number η8,/C in the range of 0.2 to 1.0 as measured with a chloroform solution of di can be used satisfactorily.

The functionalized polyphenylene ether resin composition of the present invention can be cured by any method, and a curing agent may or may not be used. The curing temperature range is room temperature to 300°C, and the curing time is 30 seconds to 5 hours.

As an example of the curing agent, any bifunctional compound that reacts with a hydroxyl group can be used. Examples include dimethylol urea, trimethylol melamine, glyoxal, glutaraldehyde, oxalic acid, diepoxide, polyacolein, dialdehyde starch, divinyl sulfone, diisocyanate, dihydroxydiphenyl sulfone, and square metal compounds such as titanium and zirconium. . Furthermore, even monofunctional compounds such as aldehydes and ketones can be crosslinked.

Depending on the intended use, the functionalized polyphenylene ether resin composition of the present invention can be used by adding fillers and additives within a range that does not impair its original properties, in order to impart desired performance. The filler may be in fibrous or powdered form, and may include glass fiber, aramid fiber, carbon fiber,
Examples include boron fibers, ceramic fibers, asbestos woven fibers, carbon black, silica, alumina, talc, mica, glass beads, and glass hollow spheres. Examples of additives include antioxidants, heat stabilizers, antistatic agents, plasticizers, pigments, flame retardants, dyes, and colorants. Furthermore, it is also possible to blend one or more crosslinking monomers and other thermoplastic and thermosetting resins.

Examples of methods for shaping the functionalized polyphenylene ether resin composition of the present invention, either alone or in combination with the above-mentioned components, include a solvent casting method and a heating melting method. Examples of the solvent used for casting include single or mixed solvents selected from halogen-substituted hydrocarbons such as dichloromethane, chloroform, and trichloroethylene, and aromatic hydrocarbons such as benzene, toluene, and xylene. In addition, methods such as injection molding, transfer molding, extrusion molding, press molding, etc. can be used as methods using heating and melting. The temperature during heating and melting is selected within the range from the glass transition temperature to the curing start temperature of the resin composition. In the case of the functionalized polyphenylene ether resin composition of the present invention, due to the effect of the hydroxy group-containing compound produced by the reaction of the polyphenylene ether introduced into the chain with the epoxy compound, it has a higher resistance compared to polyphenylene ether that does not have these functional groups. It has a relatively low glass transition temperature of about 100 to 200°C, which is advantageous for thermoforming.

The first feature of the present invention explained above is that it has excellent film forming properties using the solvent casting method. While ordinary polyphenylene ether resins have almost no solvent film formability, the resin composition of the present invention provides a smooth film with sufficient strength and is easy to handle, so it can be used for various purposes.

The second feature is that it has a lower glass transition temperature than ordinary polyphenylene ether resins and is easier to thermoform.

That is, by reacting an epoxy compound,
As the content increased, the glass transition temperature decreased.

The third feature is that it has excellent storage stability, and can be stored for a long period of time without gelation in the form of a solution, film, or molded product.

The fourth feature is that since the resin composition contains hydroxyl groups, it can be made into a hardened product by various means and can be imparted with chemical resistance. That is, the resistance to halogen-substituted hydrocarbon solvents and aromatic hydrocarbon solvents is significantly increased.

The fifth feature is that since the resin composition contains hydroxyl groups, the compatibility with resins having hydroxyl groups such as phenol resins, cresol novolak resins, and epoxy resins is significantly improved.

[Examples] Hereinafter, the present invention will be explained using examples to further clarify the present invention, but the scope of the present invention is not limited to the scope of these examples.

Example 1 10 g of poly(2.6-dimethyl-1.4-phenylene ether) having a viscosity number ηsp/C of 0.56 measured with 0.5 g/old chloroform solution at 30°C was injected into a tetrahydride solution. Dissolve in 200ml of furan and add n-butyllithium (
1.5 mol/Ω, hexane solution) 11.1 ml was added thereto and reacted at 40° C. for 1 hour under a nitrogen atmosphere. Subsequently, 1.2 ml of propylene oxide was added, and the reaction was continued at 40° C. for an additional 30 minutes. Finally, 200 ml of methanol was added to precipitate the polymer. 'a. After repeating filtration and washing with methanol three times, vacuum drying was performed at 80°C for 14 hours to obtain a white powdery polymer.

When the 'H-NMR spectrum of this polymer was measured, peaks characteristic of the above-mentioned structural formula (II) and structural formula (V) were confirmed. The assignments of the main peaks are as follows.

l, 9 to 2.4 ppm (8.3 to 8.7 ppm of methyl chloride bonded to the phenyl groups of (II) and (V)) (
The viscosity number of this polymer (hydrogen bonded to the phenyl groups of (II) and (V)) is 0.55 (30°C, 0.
The amount of the reacted epoxy compound was 6.3% by weight (m%).

Next, this polymer was dissolved in trichlorethylene, and a film was formed by a casting method. The thickness of the obtained film was approximately 100 μm, the surface was excellent in smoothness, and the strength was sufficient. Using this film, the glass transition temperature is set to fl
vJ was determined to be 185°C, which is about 25°C higher than the glass transition temperature of the raw material polyphenylene ether resin, 210°C.
It was a polymer with a low temperature. Further, this film did not gel even after being left at room temperature for 3 months, and had excellent long-term storage stability. The tensile strength was 700 kg/cJ, which was sufficient for practical use.

10 g of the functionalized polyphenylene ether resin composition and 2 g of bisphenol A diglycidyl ether type bifunctional epoxy resin (AE R 332, manufactured by Asahi Kasei Industries, Ltd.) were dissolved in 100 ml of chloroform, and a film with a thickness of about 100 μm was formed by a casting method. It was filmed. A predetermined number of sheets of this film are stacked together, and a vacuum press is used to heat the film from room temperature to
The mixture was heated and compressed to 00°C, held at 200°C for 30 minutes, and then cooled to obtain a cured sheet with a thickness of about 1 mm. This sheet-shaped cured product was insoluble in chloroform, trichloroethylene, toluene, xylene, etc., and exhibited excellent chemical resistance.

Example 2 A functionalized polyphenylene ether resin composition was synthesized in the same manner as in Example 1 except that 0.4 ml of propylene oxide was used. The viscosity number of the obtained polymer was 0.
56, and the amount of reacted epoxy compound was 2% by weight. In addition, this polymer solution has excellent film-forming properties,
The obtained film also had excellent long-term storage stability. The glass transition temperature was 205°C.

Furthermore, when it was cured in the same manner as in Example 1, it became insoluble in chloroform, trichloroethylene, and toluene, which dissolve the functionalized polyphenylene ether resin composition, and exhibited excellent chemical resistance.

Comparative Example Poly(2,6-dimethyl-1.4phenylene ether) used in Example 1 was dissolved in trichlorethylene, and film formation by solvent casting was attempted. However, during the drying process of the solvent, numerous cracks occurred within the film, making it impossible to form a film. Further, an attempt was made to harden the resin using the same treatment method as in Example 1, but the resin was dissolved or swelled significantly in chloroform, trichloroethylene, and toluene, resulting in insufficient chemical resistance.

Example 3 10 g of poly(2,6-dimethyl-1.4-phenylene ether) having a viscosity number η8,/C of 0.81 measured in a chloroform solution of 0.5 g/di at 30°C was dissolved in tetrahydride. The mixture was dissolved in 200 ml of oral furan, 34 ml of n-butyllithium (1.5 mol/D. in hexane) was added, and the mixture was reacted at 40° C. for 1 hour under a nitrogen atmosphere. Subsequently, 7.5 g of phenyl glycidyl ether was added, and the reaction was further carried out at 40°C for 2 hours. Finally methanol 500
ml was added to precipitate the polymer. After repeating filtration and washing with methanol five times, vacuum drying was performed at 80° C. for 14 hours to obtain a powdery polymer.

When the 'H-NMR spectrum of this HoIJ7- was measured, chemical shifts characteristic of the above-mentioned structural formula (II) and structural formula (V) were confirmed in the same manner as in Example 1.

The viscosity number of this polymer was 0.75, and the amount of reacted epoxy compound was 41% by weight. Next, this polymer was dissolved in chloroform, and a film was formed by a casting method. The thickness of the obtained film was about 100 μm,
It had excellent surface smoothness and sufficient strength. Moreover, this film did not gel even after being left at room temperature for 3 months and had excellent long-term storage stability.

Furthermore, when it was cured in the same manner as in Example 1, it became insoluble in chloroform, trichloroethylene, and xylene, which dissolve the functionalized polyphenylene ether resin composition, and exhibited excellent chemical resistance.

Example 4 A product obtained by oxidative polymerization of 2,6-dimethylphenol in the presence of 2,2-bis(3.5-dimethyl-4-hydroxyphenyl)propane with hydroxyl groups at both ends and a viscosity number of 0. 40 polyphenylene ether resin LOg was dissolved in 200 nol of tetrahydrofuran, 17 ml of n-butyllithium (1.5 mol/Ω, hexane solution) was added, and the mixture was reacted at 40° C. for 1 hour under a nitrogen atmosphere. Subsequently, 2.5 g of allyl glycidyl ether was added, and the reaction was further carried out at 40°C for 1 hour. After repeating filtration and washing with methanol five times, vacuum drying was performed at 80° C. for 14 hours to obtain a powdery polymer.

When the 'H-NMR spectrum of this polymer was measured, chemical shifts characteristic of Structural Formula (II) and Structural Formula (V) were confirmed in the same manner as in Example 1.

The viscosity number of this polymer was 0.38, and the reacted Epoquin compound m was 19% by weight. Next, this polymer was dissolved in trichlorethylene, and a film was formed by a casting method. The thickness of the obtained film was approximately 100 μm, the surface was excellent in smoothness, and the strength was sufficient. Also,
This film exhibited excellent long-term storage stability without causing any keling even after being left at room temperature for 3 months.

Furthermore, this film was heated in a vacuum press at 280°C for 3
When heat-treated for 0 minutes, it became insoluble in chloroform, trichloroethylene, toluene, and quinoa, which dissolve the functionalized polyphenylene ether resin composition, and exhibited excellent chemical resistance.

[Operations and Effects of the Invention] The first feature of the functionalized polyphenylene ether resin composition of the present invention is that it has excellent film formability by solvent casting. be. While ordinary polyphenylene ether resins have almost no solvent film formability, the resin composition of the present invention provides a smooth film with sufficient strength and is easy to handle, so it can be used for various purposes. The second feature is the normal polyphenylene ether NJ
It has a lower glass transition temperature than fat, making it easier to thermoform. That is, by reacting the epoxy compound, the glass transition temperature decreased as the content of the epoxy compound increased. The third feature is that it has excellent storage stability, and can be stored for a long period of time without gelling in the form of a solution, film, or molded product. This property means the so-called pot life of a thermosetting resin, is extremely important in practice, and is significant in industrial applications. Fourth
The feature of the resin composition is that it contains hydroxyl groups, so it can be cured by various means to provide chemical resistance. That is, the resistance to halogen-substituted hydrocarbon solvents and aromatic hydrocarbon solvents, which are good solvents for polyphenylene ether resins, is significantly increased. Fifth
The feature is that since the resin composition contains hydroxyl, the compatibility with resins having hydroxyl groups such as phenol resins, Talesol novolak resins, and epoxy resins is significantly improved.

The features of the present invention described above are effectively exhibited when used as a material for copper-clad laminates, prepregs for multilayer boards, flexible boards, three-dimensional printed boards made by injection molding, and the like. In addition to these applications, it can also be usefully used in films, semiconductor sealing materials, heat-resistant insulating films, heat-resistant adhesives, structural materials, and materials for devices that use high frequencies such as microwave ovens.

Claims (1)

[Claims] 1. (a) Polyphenylene ether resin and (b) general formula ▲ Numerical formula, chemical formula, table, etc. ▼ (In the formula, R_1 to R_4 are -H, -CH_3, -CH=
CH_2, -C_2H_5, -C_3H_7, ▲ Formula,
There are chemical formulas, tables, etc.▼, ▲There are mathematical formulas, chemical formulas, tables, etc.▼, -CH_2-O-CH_2- CH=CH_2, or ▲There are mathematical formulas, chemical formulas, tables, etc.▼ CH_2, and they may be the same or different. A functionalized polyphenylene ether resin composition comprising a reaction product of an epoxy compound represented by A novel functionalized polyphenylene ether resin composition.