JPH0223606U - - Google Patents
Info
- Publication number
- JPH0223606U JPH0223606U JP10251888U JP10251888U JPH0223606U JP H0223606 U JPH0223606 U JP H0223606U JP 10251888 U JP10251888 U JP 10251888U JP 10251888 U JP10251888 U JP 10251888U JP H0223606 U JPH0223606 U JP H0223606U
- Authority
- JP
- Japan
- Prior art keywords
- column
- beams
- columns
- foundation member
- building
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Load-Bearing And Curtain Walls (AREA)
- Joining Of Building Structures In Genera (AREA)
Description
第１図はこの考案に係る建築物の骨組構造の実
施例の縦断面図、第２図は第１図に相当する従来
例の図である。
１…基礎壁（基礎部材）、２…基礎梁（基礎部
材）、３…柱、４…梁、５…筋交、Ｂ…建築物、
Ｈ…梁背。
FIG. 1 is a vertical cross-sectional view of an embodiment of the frame structure of a building according to this invention, and FIG. 2 is a diagram of a conventional example corresponding to FIG. 1. 1... Foundation wall (foundation member), 2... Foundation beam (foundation member), 3... Column, 4... Beam, 5... Bracing, B... Building,
H...Beam back.
Claims (1)
頂部に各々梁を架け渡し、前記一の柱の頂部と前
記梁との連設部と前記一の柱に隣り合う柱と前記
基礎部材との連設部との間に筋交を設置した建築
物の骨組構造において、 前記複数の梁の梁背を全て一定にしたことを特
徴とする建築物の骨組構造。[Claims for Utility Model Registration] A required number of columns are erected on the foundation member, beams are placed on top of each of these columns, and the connecting portion between the top of the first column and the beam is connected to the top of the first column. A frame structure of a building in which a brace is installed between a column adjacent to a column and a connecting part of the foundation member, characterized in that the beam backs of the plurality of beams are all constant. Skeleton structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10251888U JPH0223606U (en) | 1988-08-01 | 1988-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10251888U JPH0223606U (en) | 1988-08-01 | 1988-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0223606U true JPH0223606U (en) | 1990-02-16 |
Family
ID=31332498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10251888U Pending JPH0223606U (en) | 1988-08-01 | 1988-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0223606U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS548968A (en) * | 1977-06-23 | 1979-01-23 | Toshiba Corp | Heat-treating method of semiconductor |
-
1988
- 1988-08-01 JP JP10251888U patent/JPH0223606U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS548968A (en) * | 1977-06-23 | 1979-01-23 | Toshiba Corp | Heat-treating method of semiconductor |
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