JPH02237193A - Printed board circuit device - Google Patents
Printed board circuit deviceInfo
- Publication number
- JPH02237193A JPH02237193A JP1058343A JP5834389A JPH02237193A JP H02237193 A JPH02237193 A JP H02237193A JP 1058343 A JP1058343 A JP 1058343A JP 5834389 A JP5834389 A JP 5834389A JP H02237193 A JPH02237193 A JP H02237193A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- circuit device
- printed board
- board circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Landscapes
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、機能付加に好適なプリント基板回路装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a printed circuit board device suitable for adding functions.
従来の技術
従来、機能を付加するためには別のプリント基板を増設
し、それをコネクタにより接続することにより構成して
いた。第３図（イ），（口）に従来例を示す。第３図（
イ）は従来の機能が少ない場合のプリント基板回路であ
る。プリント基板１８に半導体集積回路装Ｗ（以下ＩＣ
という）２，コンデンサ３，４、抵抗器５，６．７を搭
載して構成している。BACKGROUND OF THE INVENTION Conventionally, in order to add functions, a separate printed circuit board was added and connected by a connector. A conventional example is shown in Fig. 3 (a) and (mouth). Figure 3 (
A) is a printed circuit board circuit with few conventional functions. A semiconductor integrated circuit device W (hereinafter referred to as IC) is mounted on the printed circuit board 18.
) 2, capacitors 3, 4, and resistors 5, 6.7.
第３図（ロ）は機能を付加するためにコネクタ２０．２
１とリード線２２によシ別のプリント基板１９を増設し
、１０１７、コンデンサ１４．１５を投載して構成して
いる。Figure 3 (b) shows the connector 20.2 for adding functionality.
A separate printed circuit board 19 is added to 1 and the lead wire 22, and 1017 and capacitors 14 and 15 are mounted thereon.
発明が解決しようとする課題
ところが、従来のプリント基板回路装置では増設プリン
ト基板１９を接続するためにプリント基板１８にコネク
タ２１のスペースが必要であり、電子部品の実装密度を
上げてプリント基板サイズを小さくするには不利であっ
た。Problems to be Solved by the Invention However, in the conventional printed circuit board circuit device, a space is required for the connector 21 on the printed circuit board 18 in order to connect the additional printed circuit board 19, and it is necessary to increase the mounting density of electronic components and reduce the printed circuit board size. It was disadvantageous to make it smaller.
本発明は上記の問題を解決するもので、プリント基板ノ
スペースを有効に利用できるプリント基板回路装置を提
供することを目的とするものである。The present invention solves the above-mentioned problems, and aims to provide a printed circuit board device that can effectively utilize printed board space.
課題を解決するための手段
上記の目的を達成するために本発明のプリント基板回路
装置は、プリント基板のＩＣ挿入孔に増設プリント基板
を接続するためのコネクタを設けるように構成したもの
である。Means for Solving the Problems In order to achieve the above object, the printed circuit board circuit device of the present invention is configured such that a connector for connecting an additional printed circuit board is provided in an IC insertion hole of the printed circuit board.
作用
本発明は、上記した構成により、プリント基板の電子部
品の実装密度を低下させずに、増設プリント基板を接続
する。Effect of the Invention With the above-described configuration, the present invention connects an additional printed circuit board without reducing the mounting density of electronic components on the printed circuit board.
実施例
第１図（イ），幹）、第２図（ｆ），（口）は本発明の
一実施例におけるプリント基板回路装置の構成図である
。Embodiment FIGS. 1(a) and 2(f) are block diagrams of a printed circuit board device according to an embodiment of the present invention.
第１図（口）において、第３図（ロ）の従来例と異なる
ところは、増設プリント基板１６を接統するためにプリ
ント基板１のＩＣ２を挿入していた孔にコネクタ８，９
を挿入することによシ構成している。In FIG. 1 (opening), the difference from the conventional example shown in FIG.
It is configured by inserting .
第２図（イ）は第１図（イ）の側面図で、第２図（ロ）
は第１図（燭の側面図で、第２図（イ）のＩＣ２の位置
にコネクタ８，９を挿入し構成している。Figure 2 (a) is a side view of Figure 1 (a), and Figure 2 (b) is a side view of Figure 1 (a).
FIG. 1 (a side view of the candle) is constructed by inserting connectors 8 and 9 into the IC 2 position shown in FIG. 2 (A).
発明の効果
以上のように本発明によれば，プリント基板上のＩＣの
挿入孔を利用して、コネクタを挿入して増設プリント基
板を接続するように構成したため，プリント基板のスペ
ースを有効に利用でき、電子部品の実装密度を上げるこ
とによシプリント基板サイズが小さくでき、経済的であ
シ実用上も有利である。Effects of the Invention As described above, according to the present invention, since the IC insertion hole on the printed circuit board is used to insert a connector and connect an additional printed circuit board, the space of the printed circuit board can be effectively utilized. By increasing the mounting density of electronic components, the size of the printed circuit board can be reduced, which is both economical and practically advantageous.
第１図（イ）は本発明による通常機能のプリント基板回
路装置の平面図、第１図（ロ）は付加プリント基板接続
時の基板回路装置の平面図、第２図（イ），（ロ）は第
１図（イ），（口）に対応した本発明によるプリント基
板回路装置の側面図、第３図（イ），（ロ）は従来のプ
リント基板回路装置の平面図である。
１．１６・・・・・・プリント基板，２．１７・・・・
・・ＩＣ３，４，１４．１５・・・・・・コンデンサ、
５，６．７・・・・・・抵抗器、８，９，１０．１１・
・・・・・コネクタ、１２．１３・・・・・・リード線
。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名（，
ＩＥ−−−ゲリン卜ＪＥη反
２−）イ幻Ｊダクシコン用工ｃFIG. 1(a) is a plan view of the printed circuit board circuit device with normal function according to the present invention, FIG. 1(b) is a plan view of the printed circuit board device when an additional printed board is connected, and FIGS. ) is a side view of the printed circuit board circuit device according to the present invention corresponding to FIGS. 1.16...Printed circuit board, 2.17...
・・IC3, 4, 14.15・・・・Capacitor,
5, 6.7...Resistor, 8, 9, 10.11.
...Connector, 12.13...Lead wire. Name of agent: Patent attorney Shigetaka Awano and one other person (,
IE--Gerin Boku JE η anti-2-) Igen J Dakushikon construction c
Claims (1)
基板回路装置であって、上記プリント基板の半導体集積
回路装置の取付部分に増設用の他のプリント基板と接続
されるコネクタを設けるようにしたことを特徴とするプ
リント基板回路装置。A printed circuit board circuit device in which a semiconductor integrated circuit device is mounted on a printed circuit board, characterized in that a connector for connecting to another printed circuit board for expansion is provided at a mounting portion of the printed circuit board for the semiconductor integrated circuit device. Printed circuit board circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1058343A JPH02237193A (en) | 1989-03-10 | 1989-03-10 | Printed board circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1058343A JPH02237193A (en) | 1989-03-10 | 1989-03-10 | Printed board circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02237193A true JPH02237193A (en) | 1990-09-19 |
Family
ID=13081676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1058343A Pending JPH02237193A (en) | 1989-03-10 | 1989-03-10 | Printed board circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02237193A (en) |
-
1989
- 1989-03-10 JP JP1058343A patent/JPH02237193A/en active Pending
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