JPH02239691A - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JPH02239691A JPH02239691A JP6145089A JP6145089A JPH02239691A JP H02239691 A JPH02239691 A JP H02239691A JP 6145089 A JP6145089 A JP 6145089A JP 6145089 A JP6145089 A JP 6145089A JP H02239691 A JPH02239691 A JP H02239691A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- wiring board
- resin layer
- synthetic resin
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 30
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 19
- 239000000057 synthetic resin Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 229920002635 polyurethane Polymers 0.000 claims description 14
- 239000004814 polyurethane Substances 0.000 claims description 14
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 9
- 238000010030 laminating Methods 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 3
- 230000000873 masking effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- XFNGYPLLARFULH-UHFFFAOYSA-N 1,2,4-oxadiazetidin-3-one Chemical compound O=C1NON1 XFNGYPLLARFULH-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- DLMVDBDHOIWEJZ-UHFFFAOYSA-N isocyanatooxyimino(oxo)methane Chemical compound O=C=NON=C=O DLMVDBDHOIWEJZ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本発明は、各種の電子機器等に使用する回路を作成する
ため、又はカーペット等に内蔵して使用する面状発熱体
を作成するためのフレキシブルプリント配線基板に関す
るものである。TECHNICAL FIELD The present invention relates to a flexible printed wiring board for creating circuits for use in various electronic devices, or for creating a planar heating element built into a carpet or the like.
従■来、フレキシブルプリント配線基板としては、ポリ
エステルフィルムやポリイミドフィルム等の耐熱性合成
樹脂製フィルムと、アルミニウム箔や銅箔等の金属箔と
、をポリウレタン系接着剤で貼合したものが用いられて
いる。このフレキシブルプリント配線基板を用いて配線
板を得る方法は、金属箔上に所定のマスキングを施した
後、エッチング溶液に浸漬して非マスキング部分の金属
箔を溶解除去するというものである。
しかるに、ポリウレタン系接着剤はエッチング後、マス
キングを除去する際、若しくは脱脂処理する際、その有
機溶剤（トリクロルエタンやジクロルエタン等）に侵さ
れやすく、金属箔即ち配線部分が剥がれるということが
あった。配線部分が剥がれると、結局導体部分が浮き上
がった状態になり、短絡しやすいという欠点を惹起する
に到る。
また、非マスキング部分即ち非配線部分においてはポリ
ウレタン系接着剤が露出することになるが、ポリウレタ
ン系接着剤にはタッキネスがある。
従って、この配線板を積み重ねて保存又は輸送すると、
配線板同士がくっつきやすく、配線板の使用時において
、配線板を一枚ずつ剥がすことが困難になるという欠点
があった。また、これを無理矢理剥がすと、配線部分が
損傷したり、配線板自体が破れるという欠点が生じる。
更に、ポリウレタン系接着剤は耐熱性が充分でな《、配
線部分に導線等をハンダ付けする際、露出しているポリ
ウレタン系接着剤が、燃えたり或いは焦げたりするとい
うことがあった。従って、ハンダ付けの際に作業者が火
傷をするという欠点があった。また、配線板中にゴミが
残り、このゴミが配線板に故障を惹起させるという欠点
もあった。Traditionally, flexible printed circuit boards have been made by laminating heat-resistant synthetic resin films such as polyester films or polyimide films with metal foils such as aluminum foil or copper foil using a polyurethane adhesive. ing. A method for obtaining a wiring board using this flexible printed wiring board is to apply a predetermined masking on the metal foil and then immerse it in an etching solution to dissolve and remove the metal foil in the non-masked areas. However, polyurethane adhesives are easily attacked by organic solvents (trichloroethane, dichloroethane, etc.) when removing masking or degreasing after etching, resulting in peeling of the metal foil, that is, wiring parts. When the wiring portion is peeled off, the conductor portion ends up being lifted up, leading to the disadvantage of being susceptible to short circuits. Further, the polyurethane adhesive is exposed in the non-masking portions, that is, the non-wiring portions, but the polyurethane adhesive has tackiness. Therefore, if these wiring boards are stacked and stored or transported,
The disadvantage is that the wiring boards tend to stick together, making it difficult to peel off the wiring boards one by one when the wiring boards are in use. Further, if this is forcibly removed, the wiring portion may be damaged or the wiring board itself may be torn. Furthermore, polyurethane adhesives do not have sufficient heat resistance, and when soldering conductive wires to wiring sections, the exposed polyurethane adhesive may burn or become scorched. Therefore, there is a drawback that workers may get burnt during soldering. Another disadvantage is that dust remains in the wiring board and this dust causes the wiring board to malfunction.
このため、本発明者はポリウレタン系接着剤に代えて、
耐溶剤性や耐熱性等に優れた接着剤で、合成樹脂製フィ
ルムと金属箔とを貼合することを試みた。しかし、この
ような接着剤は、一般的に高温で貼合しなければならず
、高温貼合の際、合成樹脂製フィルムが収縮を起こし、
得られたフレキシブルプリント配線基板にはシワが生じ
るという新たな欠点を生じるに到った。
そこで、本発明は耐溶剤性や耐熱性等に優れた接着剤を
接着剤として用いるのではなく、上記した各種の欠点を
回避するためのものとして用い、また接着剤としては従
来と同様のポリウレタン系接着剤を用いることにより、
上記の各種の欠点及び新たに生起する欠点が生じないよ
うにしたものである。For this reason, the present inventors replaced polyurethane adhesives with
An attempt was made to bond a synthetic resin film and metal foil using an adhesive with excellent solvent resistance and heat resistance. However, such adhesives generally have to be laminated at high temperatures, and the synthetic resin film shrinks during high temperature lamination.
The resulting flexible printed wiring board had a new drawback of wrinkles. Therefore, the present invention does not use an adhesive with excellent solvent resistance and heat resistance as an adhesive, but uses it as an adhesive to avoid the various drawbacks described above, and uses polyurethane as an adhesive, which is similar to the conventional adhesive. By using adhesives,
This is to prevent the above-mentioned various defects and new defects from occurring.
即ち、本発明は、合成樹脂製フィルムと金属箔とをポリ
ウレタン系接着剤で貼合したフレキシブルプリント配線
基板において、該金属箔とポリウレタン系接着剤との間
にエポキシ系樹脂層が介在されてなることを特徴とする
フレキシブルプリント配線基板に関するものである。
本発明において、合成樹脂製フィルムとしては、耐熱性
に優れ且つ柔軟性の良好なものが主として用いられ、例
えばポリエチレンテレフタレートやポリブチレンテレフ
タレート等のポリエステルフィルム，ポリフエニレンサ
ルファイドフイルム，ポリカーボネート系フィルム．芳
香族系ボリアミドフィルム，ポリイミド系フィルム．フ
ッ素樹脂系フィルム等が用いられる。また、合成樹脂製
フィルムの厚さは、２５〜２００μ程度である。
金属箔としては、一般的にアルミニウム箔又は銅箔が用
いられる。この金属箔の厚さは、５〜１００μ程度であ
る。
合成樹脂製フィルムと金属箔とは、従来公知のポリウレ
タン系接着剤で貼．合されるわけであるが、本発明にお
いて重要な点は、この際金属箔とポリウレタン系接着剤
との間にエポキシ系樹脂層が介在することである。エポ
キシ系樹脂としては、エポキシーフェノール樹脂，エポ
キシーユリア樹脂，エポキシーイソシアネート樹脂，エ
ポキシーメラミン樹脂．エポキシアミノーアクリル変性
樹脂等とその硬化剤とを組み合わせたものが用いられる
。
なお、ポリウレタン系樹脂としては、従来公知のものが
用いられる。
本発明に係るフレキシブルプリント配線基板の製造方法
は以下のとおりである。
まず、金属箔にエポキシ系樹脂溶液を所望の厚さに塗布
する。エポキシ系樹脂溶液は、各種のエポキシ樹脂とそ
の硬化剤とよりなるものである。
また、塗布方法としては、ロールコーターによる方法，
グラビアコーターによる方法等が用いられる。塗布した
後、例えば１００〜２００゜Ｃ程度の温度範囲内で、且
つ１０〜１２０秒程度の時間で、エポキシ系樹脂を硬化
する。このようにして得られたエポキシ系樹脂層を具え
た金属箔を得る。
次いで、このエポキシ系樹脂層にウレタン系接着剤を塗
布し、直ちに合成樹脂製フィルムをウレタン系接着剤に
当接して、金属箔と合成樹脂製フィルムとを貼合する。
なお、合成樹脂製フィルムとウレタン系接着剤を当接す
る場合、温度６０〜１００゜Ｃ程度で一対の加圧ロール
間を通せばよい。
以上、合成樹脂製フィルムの片面に金属箔が貼合される
場合を、主にして説明したが、本発明において合成樹脂
製フィルムの両面に金属箔を貼合してもよいことは勿論
である。That is, the present invention provides a flexible printed wiring board in which a synthetic resin film and a metal foil are bonded together with a polyurethane adhesive, in which an epoxy resin layer is interposed between the metal foil and the polyurethane adhesive. The present invention relates to a flexible printed wiring board characterized by the following. In the present invention, synthetic resin films that are excellent in heat resistance and have good flexibility are mainly used, such as polyester films such as polyethylene terephthalate and polybutylene terephthalate, polyphenylene sulfide films, and polycarbonate films. Aromatic polyamide film, polyimide film. A fluororesin film or the like is used. Moreover, the thickness of the synthetic resin film is about 25 to 200 μm. As the metal foil, aluminum foil or copper foil is generally used. The thickness of this metal foil is about 5 to 100 microns. The synthetic resin film and metal foil are attached using a conventionally known polyurethane adhesive. However, an important point in the present invention is that an epoxy resin layer is interposed between the metal foil and the polyurethane adhesive. Epoxy resins include epoxy phenol resin, epoxy urea resin, epoxy isocyanate resin, and epoxy melamine resin. A combination of an epoxyamino-acrylic modified resin or the like and its curing agent is used. Note that as the polyurethane resin, conventionally known ones are used. The method for manufacturing a flexible printed wiring board according to the present invention is as follows. First, an epoxy resin solution is applied to a metal foil to a desired thickness. The epoxy resin solution consists of various epoxy resins and their curing agents. In addition, the coating method includes a method using a roll coater,
A method using a gravure coater or the like is used. After coating, the epoxy resin is cured within a temperature range of, for example, about 100 to 200°C and for about 10 to 120 seconds. A metal foil provided with the epoxy resin layer thus obtained is obtained. Next, a urethane adhesive is applied to this epoxy resin layer, and the synthetic resin film is immediately brought into contact with the urethane adhesive to bond the metal foil and the synthetic resin film. When the synthetic resin film and the urethane adhesive are brought into contact with each other, they may be passed between a pair of pressure rolls at a temperature of about 60 to 100°C. The above description has mainly focused on the case where metal foil is bonded to one side of a synthetic resin film, but it goes without saying that metal foil may be bonded to both sides of a synthetic resin film in the present invention. .
厚さ９μのアルミニウム箔の片面にエポキシ系樹脂溶液
（田中インキ■製； ＡＶＯＮ）をグラビアコーター法
で塗布し、厚さ３μのエポキシ系樹脂層をアルミニウム
箔の片面に設けた。
このエポキシ系樹脂層上にウレタン系接着剤（東洋モー
トン■製；アドコート）を、厚さ５μになるように、グ
ラビアコーター法で塗布した。
その後、厚さ３８μのポリエチレンテレフタレートフィ
ルム（東レ■製；ルミラー）をウレタン系接着剤上に重
ね、直ちにこの積層物を温度７０゜Ｃに加熱された一対
の加熱ロール間に通して、アルミニウム箔とポリエチレ
ンテレフタレートフィルムとを貼合して、フレキシブル
プリント配線基板を得た。
このフレキシブルプリント配線基板のアルミニウム箔上
に、所定の図柄で光硬化型惑光性樹脂を塗布し、紫外線
を照射してこの怒光性樹脂を硬化させてマスキングを施
した。これを、エッチング溶液（４０％の塩化第二銖溶
液）中に浸漬し、４０゛Ｃで１分間処理し、非マスキン
グ部分のアルミニウム箔部分（非配線部分）を溶解除去
して、更にマスキング除去処理及び脱脂処理としてジク
ロルエタンとトリクロルエタンとの混合溶液にディッピ
ングし、乾燥してフレキシブルプリント配線板を得た。
このようにして得られた配線板は、配線部分のアルミニ
ウム箔には浮き上がりが見られず、非配線部分に露出し
ているエポキシ系樹脂層はタッキネスも殆ど無く、更に
配線部分にハンダ付けを行ってもエポキシ系樹脂層が燃
えたり或いは焦げたりすることは無かった。An epoxy resin solution (manufactured by Tanaka Ink ■; AVON) was coated on one side of a 9 μm thick aluminum foil using a gravure coater method, and an epoxy resin layer with a 3 μm thickness was provided on one side of the aluminum foil. On this epoxy resin layer, a urethane adhesive (manufactured by Toyo Morton ■; Adcoat) was applied to a thickness of 5 μm using a gravure coater method. Thereafter, a polyethylene terephthalate film (manufactured by Toray ■; Lumirror) with a thickness of 38 μm was layered on the urethane adhesive, and the laminate was immediately passed between a pair of heated rolls heated to a temperature of 70°C to coat aluminum foil. A flexible printed wiring board was obtained by laminating a polyethylene terephthalate film. A photocurable photoresist resin was applied in a predetermined pattern onto the aluminum foil of this flexible printed wiring board, and the photoresist resin was cured by irradiation with ultraviolet rays to perform masking. This was immersed in an etching solution (40% chloride solution) and treated at 40°C for 1 minute to dissolve and remove the non-masking aluminum foil portion (non-wiring portion) and further remove the masking. As a treatment and degreasing treatment, it was dipped in a mixed solution of dichloroethane and trichloroethane, and dried to obtain a flexible printed wiring board. In the wiring board thus obtained, no lifting was observed in the aluminum foil in the wiring area, there was almost no tackiness in the epoxy resin layer exposed in the non-wiring area, and the wiring area was soldered. However, the epoxy resin layer did not burn or become scorched.
以上説明したように、本発明に係るフレキシブルプリン
ト配線基板は、金属箔一エポキシ系樹脂層一ウレタン系
接着剤一合成樹脂製フィルムの順に積層されてなるもの
であるため、配線板としたときに非配線部分にはエポキ
シ系樹脂層が露出している。
エポキシ系樹脂層は耐溶剤性に優れているため、配線板
作成の際のマスキング除去処理時及び脱脂処理時におい
て、それらの有機溶剤でエポキシ系樹脂が侵されること
が少ない。従って、配線部分における金属箔が浮き上が
ることを防止でき、配線板を電子機器等に組み込んだと
き、短絡を防止しうるという効果を奏する。
また、エポキシ系樹脂層は高温で硬化するため、活性基
の残留が少なく、タッキネスが殆ど無い。
従って、得られた配線板の非配線部分にエポキシ系樹脂
層が露出していても、その部分にタッキネスが殆ど無《
、配線板を積み重ねて保存又は輸送しても、配線板同士
が相互にくっつきにくい。依って、積み重ねた配線板を
使用時において、一枚ずつ良好に剥離でき、剥離時に配
線部分が損傷したり、配線板自体が破れるのを防止しう
るという効果を奏する。
更に、エポキシ系樹脂層は耐熱性に優れているため、配
線部分に導線等をハンダ付けする際にも、非配線部分に
露出しているエポキシ系樹脂層が燃えたりあるいは焦げ
たりすることが少ない。従って、ハンダ付けの際に作業
者を火傷の危険から回避し、また配線板中にゴミが残留
しにくいので配線板に故障を惹起″させにくいてという
効果を奏する。
なお、本発明に係るフレキシブルプリント配線基板は、
ウレタン系接着剤を用い、且つ比較的低温で処理して、
金属箔と合成樹脂製フィルムとを貼合することができる
ので、合成樹脂製フィルムが収縮しにくく、従って金属
箔にシワが生じにく《、均一な品質を維持しうるという
効果を奏する。As explained above, the flexible printed wiring board according to the present invention is formed by laminating metal foil, epoxy resin layer, urethane adhesive, and synthetic resin film in this order. The epoxy resin layer is exposed in non-wiring areas. Since the epoxy resin layer has excellent solvent resistance, the epoxy resin is less likely to be attacked by these organic solvents during masking removal treatment and degreasing treatment during wiring board production. Therefore, it is possible to prevent the metal foil in the wiring portion from lifting up, and when the wiring board is incorporated into an electronic device, it is possible to prevent short circuits. Furthermore, since the epoxy resin layer is cured at high temperatures, there are few active groups remaining and almost no tackiness. Therefore, even if the epoxy resin layer is exposed in the non-wiring area of the resulting wiring board, there is almost no tackiness in that area.
Even when the wiring boards are stacked and stored or transported, the wiring boards are unlikely to stick to each other. Therefore, when stacked wiring boards are used, they can be easily peeled off one by one, and the wiring parts are prevented from being damaged or the wiring boards themselves are prevented from being torn during peeling. Furthermore, since the epoxy resin layer has excellent heat resistance, the epoxy resin layer exposed in non-wiring areas is unlikely to burn or burn when soldering conductors, etc. to wiring areas. . Therefore, it is possible to avoid the danger of burns to the worker during soldering, and since dust is less likely to remain in the wiring board, it is less likely to cause a failure in the wiring board. The printed wiring board is
Using urethane adhesive and processing at relatively low temperature,
Since the metal foil and the synthetic resin film can be laminated together, the synthetic resin film is less likely to shrink, and therefore the metal foil is less likely to be wrinkled, resulting in the effect that uniform quality can be maintained.
Claims (1)
で貼合したフレキシブルプリント配線基板において、該
金属箔とポリウレタン系接着剤との間にエポキシ系樹脂
層が介在されてなることを特徴とするフレキシブルプリ
ント配線基板。A flexible printed wiring board in which a synthetic resin film and a metal foil are laminated with a polyurethane adhesive, characterized in that an epoxy resin layer is interposed between the metal foil and the polyurethane adhesive. printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6145089A JPH02239691A (en) | 1989-03-13 | 1989-03-13 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6145089A JPH02239691A (en) | 1989-03-13 | 1989-03-13 | Flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02239691A true JPH02239691A (en) | 1990-09-21 |
| JPH0561794B2 JPH0561794B2 (en) | 1993-09-07 |
Family
ID=13171401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6145089A Granted JPH02239691A (en) | 1989-03-13 | 1989-03-13 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02239691A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007048800A (en) * | 2005-08-08 | 2007-02-22 | Nippon Foil Mfg Co Ltd | Antenna coil for ic card and manufacturing method therefor |
-
1989
- 1989-03-13 JP JP6145089A patent/JPH02239691A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0561794B2 (en) | 1993-09-07 |
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