JPH0225059A - Heat radiating device - Google Patents

Abstract

PURPOSE:To enhance the heat radiating efficiency by a method wherein a plate made of an good heat conductor and provided with a cylindrical protrusion formed at the middle is bonded to the surface of an electronic part package and the protrusion is fixed immovable into a beat radiating board. CONSTITUTION:At the middle of a metal piece 4 made of aluminum or the like and roughly equal in size to an IC package 2, a tapered hole is provided, a flat head bolt 5 is inserted into the hole, and bond is established with the surface of the package 2 using a silicone rubber adhesive 3 or the like which is relatively good in heat conduction. Next, the package 2 and the metal piece 4 are combined and then packaged onto a circuit substrate 1 by solder. A process follows wherein the flat head bolt 5 is inserted into a through-hole in a large-size heat radiating board 6 and the flat head bolt 5 is fastened using a nut 7. In this design, heat generated by the IC transmits to the metal piece 4 and then radiates from the heat radiating board 6, which enhances the heat radiating efficiency.

Description

DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to a heat dissipation device for electronic components used in electronic equipment and the like.

2. Description of the Related Art Conventionally, as a typical method for dissipating heat generated by an electronic component 1 such as an integrated circuit element (hereinafter referred to as an IC) mounted on a circuit board, as shown in FIG. There is one in which a heat dissipation plate 6 is attached on top of 2 with an adhesive 3. Here, 1 is a circuit board.

Problems that the invention aims to solve However, in the case of 1G, which has a relatively large calorific value.

The heat dissipation plate 6 to be bonded also becomes large, and the open heat plate 6 must be temporarily fixed on the surface of the mold package 2 until the adhesive is solidified. However, the temporary fixing method is difficult. That is, in order to bond the heat dissipation plate θ onto the IC package 2, it is desirable that the thickness of the adhesive 3 be as thin as possible and uniform. It must be kept horizontally still. However, when mounting printed circuit boards or solidifying adhesive, it is common to transport the boards on a production line for one production, and it is not always easy to keep the boards stationary horizontally. do not have. If tilting, vibration, etc. are applied during the assimilation process of the adhesive, the thickness of the adhesive will not be constant and air bubbles will easily enter. If the IC is bonded and fixed in such a state, the heat dissipation property will be extremely poor, and it will be difficult to dissipate heat corresponding to the heat generated by the IC, which is originally required. Also, when the size of the heat sink is much larger than the size of the IC package.

It is virtually impossible to attach a heat sink to an IC before mounting the IC on a board.

Means for Solving the Problems In the heat dissipation device of the present invention, a columnar protrusion is provided approximately in the center of a metal or a plate-like material with good thermal conductivity having a surface approximately equal to the surface of the package of an electronic component. A plate-like object is bonded to the surface of an electronic component package using silicone rubber adhesive or something that is generally said to have relatively good thermal conductivity, making it a single piece.

A heat dissipation plate having holes that fit the projections is fixed onto this plate-like object.

Effect As described above, by attaching a metal or a plate-like material with good thermal conductivity to the surface of the package of an electronic component, heat generated from the electronic component is conducted to this plate-like material. This heat is then radiated from a heat sink that is fitted and fixed to a protrusion provided on the plate-shaped object. This plate-like object and the heat sink can be attached by fitting the holes provided in the heat sink into the protrusions, and the shape is designed to improve workability and increase heat dissipation. It is also easy to replace the heat sink with a larger heat sink. Furthermore, since it is the same size as an IC package, even if the adhesive is slightly tilted or vibrates, there will be no unevenness in the thickness of the adhesive, making the bonding work extremely easy. Furthermore, as described above, the installation of a large heat sink is extremely easy and quick by fitting and fixing it with the protrusions.

EXAMPLE Hereinafter, a heat dissipation device according to a ninth embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows a sectional view of a heat dissipation device according to an embodiment of the present invention.

As shown in the figure, an aluminum piece 4 having approximately the same size as the rC package 2 is provided, a tapered hole is made in the center of the aluminum piece 4, and a countersunk screw 6 having a shape that fits the hole is inserted. A plate-like object is formed by fitting into this hole, and is previously adhered onto the IC package 2 with a silicone rubber adhesive 3 or the like.

Next, after the adhesive 3 is solidified, the IC package 2 and the plate-like object are integrated, and the KIC is soldered and mounted on the circuit board 1. Next, a countersunk screw 6 is fitted into a through hole provided approximately in the center of a separately prepared large heat sink 6, and a nut 7 is further tightened to complete the IC package 2. Metal piece (aluminum piece)4. The heat sink 6° circuit board 1 is completed as one piece.

By attaching the metal piece 4, which is approximately the same size as the IC package 2, to the IC surface as described above.

Heat generated from the IC is conducted to this metal piece 4 and then radiated from the heat sink 6. If the IC is large and generates a relatively large amount of heat, an even larger heat sink will be required. This makes it easy to change the heat sink. Also, since the metal piece 4 is approximately the same size as the IC package 2, the I
It is also possible to mount it after adhering it onto the package 2 of C. Also, since it is the same size as the re package, even if the adhesive is slightly tilted or vibrates, there will be no unevenness in the thickness of the adhesive, making the bonding work extremely easy. Furthermore, the installation of a large heat sink is extremely easy and quick by fitting and fixing it with the single flat head screw as described above.

Note that in this embodiment, the plate-like object is composed of a metal piece and a countersunk screw, but it is made of a material that can realize good thermal conductivity, and there is a protrusion on which the heat sink can be fitted and fixed. If the configuration is such that the same functions and effects as in this embodiment can be achieved.

Effects of the Invention As described above, according to the present invention, stable heat dissipation characteristics can be obtained extremely easily in the heat dissipation structure of electronic components, particularly surface-mounted components.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a heat dissipation device in an embodiment of the present invention,
FIG. 2 is a sectional view of a conventional example. 1... Circuit board, 2... IC package, 3... Adhesive, 4... Metal piece, 5...
...Protrusion (countersunk screw). 6... Heat sink with fins, 7... Nut.

Claims (1)

[Claims] A plate-like object made of a metal or a good thermal conductor having a columnar protrusion on one plane of a flat plate having an area approximately equal to the surface of the mold package is adhered to the surface of the mold package of the resin-molded electronic component. 1. A heat dissipation device comprising: a heat dissipation plate fixed onto the surface of the plate-like object so as to fit into the protrusion of the plate-like object.