JPH02254Y2 - - Google Patents
Info
- Publication number
- JPH02254Y2 JPH02254Y2 JP13708184U JP13708184U JPH02254Y2 JP H02254 Y2 JPH02254 Y2 JP H02254Y2 JP 13708184 U JP13708184 U JP 13708184U JP 13708184 U JP13708184 U JP 13708184U JP H02254 Y2 JPH02254 Y2 JP H02254Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- solder layer
- woven fabric
- conductive sheet
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004745 nonwoven fabric Substances 0.000 claims description 6
- 239000002759 woven fabric Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 6
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は電磁波をシールドするための導電性プ
ラスチツクに関する。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a conductive plastic for shielding electromagnetic waves.
従来の技術
近年、電磁波の障害を規制する法規が制定され
たことにより、電磁波シールド材の研究開発が推
進されている。本考案に関する先行技術として特
開昭54−60504号公報がある。この公報には母材
となる樹脂板上に導電性繊維の布帛状物を一体的
に結合した電磁波遮蔽材料が記載されている。BACKGROUND ART In recent years, with the enactment of laws regulating electromagnetic interference, research and development of electromagnetic shielding materials has been promoted. As a prior art related to the present invention, there is Japanese Patent Application Laid-Open No. 54-60504. This publication describes an electromagnetic wave shielding material in which a conductive fiber fabric is integrally bonded to a resin plate serving as a base material.
発明が解決しようとする問題点
導電性プラスチツクの用途には金属形成層を絶
縁樹脂で被覆した用い方がある。この場合アース
端子の取出し手段を考慮しなければならないが、
先行技術にはこの点の記載はなく、本考案はこの
端子取出しが確実に行える導電性プラスチツクを
提供する。Problems to be Solved by the Invention Among the uses of conductive plastics, there is a method in which a metal forming layer is coated with an insulating resin. In this case, the means for extracting the ground terminal must be considered,
The prior art does not mention this point, and the present invention provides a conductive plastic that can reliably take out the terminal.
問題点を解決するための手段
本考案は有機、無機又は植物繊維による織布又
は不織布を基材に、この基材の表面にに金属層を
形成した導電性シートを用い、この導電性シート
のリード端子部に半田層を形成する。この導電性
シートの両面全体にわたつて絶縁樹脂層を形成
し、半田層の部分に座繰り貫通孔を設け、ネジナ
ツトでアース端子の取出しが行える。Means for Solving the Problems The present invention uses a conductive sheet made of a woven or non-woven fabric made of organic, inorganic or vegetable fibers as a base material and a metal layer formed on the surface of this base material. A solder layer is formed on the lead terminal portion. An insulating resin layer is formed over both sides of the conductive sheet, and a counterbored through hole is provided in the solder layer so that the ground terminal can be taken out using a screw nut.
実施例
本考案の実施例を図面に基づいて説明すると、
1は基材となる織布又は不織布であり、帝人株式
会社製ポリエステル不織布140g/m2のものを用
い、この不織布1の表面に亜鉛250g/m2の量を
アーク溶射して金属層2を設け、アース端子を取
出そうとする箇所に半田層3(日本アルミツト株
式会社製KR−19を厚さ1mm、直径10mm)を形成
した導電性シート4を得る。Example An example of the present invention will be described based on the drawings.
Reference numeral 1 is a woven fabric or non-woven fabric serving as a base material, and a polyester non-woven fabric of 140 g/m 2 manufactured by Teijin Ltd. is used, and a metal layer 2 is formed by arc spraying zinc in an amount of 250 g/m 2 on the surface of the non-woven fabric 1. A conductive sheet 4 is obtained in which a solder layer 3 (KR-19 manufactured by Nippon Aluminum Co., Ltd., thickness 1 mm, diameter 10 mm) is formed at the location where the ground terminal is to be taken out.
この導電性シート4がサンドイツチ状になるよ
う両面に、ガラスクロス(富士フアイバーグラス
株式会社製FECR−2220)とガラスマツト(富士
フアイバーグラス株式会社製FEM−450)を交互
にポリエステル樹脂5にて積層し、厚さ2mmの導
電性プラスチツク6を得る。 Glass cloth (FECR-2220 manufactured by Fuji Fiber Glass Co., Ltd.) and glass mat (FEM-450 manufactured by Fuji Fiber Glass Co., Ltd.) are alternately laminated with polyester resin 5 on both sides of the conductive sheet 4 so as to form a sandwich pattern. , a conductive plastic 6 with a thickness of 2 mm is obtained.
この導電性プラスチツク6の半田層3の中央部
を6φキリで貫通孔7を設け、8φの座ぐり加工8
を施し、半田層3を露出させる。 A through hole 7 is formed in the center of the solder layer 3 of this conductive plastic 6 by drilling 6φ, and a counterbore 8 of 8φ is formed.
to expose the solder layer 3.
この座ぐり部にネジ10を挿入し、アース端子
11をナツト12で締結すれば、導電性プラスチ
ツク6の端子11取出しが行える。ネジナツトを
用いず端子を直接半田層に固着することも可能で
ある。 By inserting the screw 10 into this counterbore and fastening the ground terminal 11 with the nut 12, the terminal 11 of the conductive plastic 6 can be taken out. It is also possible to fix the terminal directly to the solder layer without using a screw nut.
考案の効果
導電性シートの両面を絶縁樹脂で被覆した導電
性プラスチツクのアース端子を取出す手段とし
て、金属層に予め半田層を形成しておくことによ
り、樹脂被覆した後、座ぐり加工を行えば端子の
取出しが簡単かつ確実に行える。Effects of the invention As a means of extracting the ground terminal of a conductive plastic with both sides of a conductive sheet coated with insulating resin, a solder layer is formed on the metal layer in advance, and after the resin coating, counterbore processing is performed. Terminals can be removed easily and reliably.
第1図は本考案の断面図、第2図は本考案の導
電性シートの断面図、第3図は本考案の座繰り加
工を施す前の断面図である。
図面において、1は織布又は不織布、2は金属
層、3は半田層、5は絶縁樹脂、11はリード端
子。
FIG. 1 is a cross-sectional view of the present invention, FIG. 2 is a cross-sectional view of the conductive sheet of the present invention, and FIG. 3 is a cross-sectional view of the present invention before being subjected to the counterbore process. In the drawings, 1 is a woven fabric or non-woven fabric, 2 is a metal layer, 3 is a solder layer, 5 is an insulating resin, and 11 is a lead terminal.
Claims (1)
性シートを用い、この金属層の所定部分に半田層
を形成し、この導電性シートの両面に樹脂層を形
成し、前記半田層の部分に座繰り貫通孔を設けた
ことを特徴とする導電性プラスチツク。 A conductive sheet with a metal layer formed on the surface of a woven or non-woven fabric is used, a solder layer is formed on a predetermined part of this metal layer, a resin layer is formed on both sides of this conductive sheet, and a resin layer is formed on the part of the solder layer. A conductive plastic characterized by having a counterbored through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13708184U JPH02254Y2 (en) | 1984-09-10 | 1984-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13708184U JPH02254Y2 (en) | 1984-09-10 | 1984-09-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6153132U JPS6153132U (en) | 1986-04-10 |
| JPH02254Y2 true JPH02254Y2 (en) | 1990-01-08 |
Family
ID=30695502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13708184U Expired JPH02254Y2 (en) | 1984-09-10 | 1984-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02254Y2 (en) |
-
1984
- 1984-09-10 JP JP13708184U patent/JPH02254Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6153132U (en) | 1986-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2138930C1 (en) | Method for manufacturing of conducting circuit on substrate, conducting circuit on substrate and device for manufacturing of flexible conducting circuit | |
| EP0531613B1 (en) | Electret condenser microphone unit | |
| KR950034304A (en) | Electromagnetic interference suppressor | |
| CA2283931A1 (en) | Non-aqueous battery of a thin configuration | |
| CA2057016A1 (en) | Heat barrier laminate | |
| CA1325468C (en) | Electroluminescent panel and method of manufacturing the same | |
| DE4029262C2 (en) | ||
| JPH02254Y2 (en) | ||
| AU6389894A (en) | An arrangement for establishing electrical contact in joints, and a method of producing the arrangement | |
| EP0291602B1 (en) | Contact elements for miniature inductor | |
| CA2163516A1 (en) | System for absorbing electromagnetic waves and method of manufacturing this system | |
| KR960701581A (en) | DRUM-SIDE TREATED METAL FOIL AND LAMINATE FOR USE IN PRINTED CIRCUIT BOARDS AND METHODS OF MANUFACTURE | |
| JP2889471B2 (en) | Flexible printed circuit board | |
| JPH08228052A (en) | Manufacturing method of metal fitting board | |
| JPH05315784A (en) | Manufacturing method of anti-electromagnetic wave shielding molded article | |
| JPH0150631B2 (en) | ||
| JPS6114102Y2 (en) | ||
| JPS5910098U (en) | radiation shielding sheet | |
| JPH0223039Y2 (en) | ||
| JPH0259764B2 (en) | ||
| JPS62163390A (en) | External work of printed board | |
| EP0924755A3 (en) | Method of fabricating a multilayer circuit board | |
| JPH0517234Y2 (en) | ||
| JPS6219447A (en) | Electric laminated board | |
| JPH0241147Y2 (en) |