JPH0225567A - Device for uniformly heating long-sized substrate - Google Patents

Abstract

PURPOSE:To uniformly heat a long-sized substrate by traveling the substrate on a concave bent roller having a radius of curvature equal to the distance between a beam oscillating point and the substrate. CONSTITUTION:An electron beam gun 2 for heating a substrate is arranged above the long-sized substrate 1. The gun 2 is oscillated on a circular arc with the beam oscillating point O as the center. The substrate 1 is traveled at a constant speed on the concave bent roller 3 having a radius of curvature equal to the distance between the point O and the substrate. Consequently, the substrate 1 is bent with a radius of curvature equal to that of the roller 3, the distance WD between the point O and the substrate is constant at any point on the width of the substrate 1, and the incident angle of the beam is at right angles to the substrate at any point on the width of the substrate 1. Accordingly, the dimensions and shape of the beam spot and reflectivity of the beam are always the same on the width of the substrate 1, and the substrate 1 can be uniformly heated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an apparatus for uniformly heating a long substrate, and particularly to an apparatus for uniformly heating a long substrate using an electron beam gun.

This type of heating device is used for pre-treatment, post-treatment, etc. in a steel plate winding vapor deposition device, for example, and is used for preheating gas before vapor deposition,
This process involves making the deposited film amorphous and micromelting the surface layer of the substrate and the deposited film.

[Prior Art] A long substrate heating device using an electron beam gun (E/B gun) or the like conventionally applies an electron beam to the width of the long substrate around a beam swing point, as shown in FIG. swing in the direction,
It irradiated a flat substrate with an electron beam.

[Problems to be Solved by the Invention] However, since the substrate is flat, the incident angle θ differs at each point on the Because of the difference, it was not possible to uniformly heat the substrate.

In addition, the distance (work distance) from the beam oscillation point to the substrate is different at each oscillation point on the substrate X axis,
There is a problem in that the substrate cannot be heated uniformly because the dimensions of the beam spot are not the same on the X-axis.

The present invention aims to overcome these problems and provide an apparatus capable of uniformly heating a substrate.

[Means for Solving the Problems] In order to solve such problems, the present invention bends the substrate in an arc shape centered on the beam swing point, and the distance from the beam swing point to the substrate, and The incident angle is made equal at every point on the substrate, so that the substrate is heated uniformly.

Thus, according to the present invention, the substrate is deflected in the width direction by running on a curved roller having a radius of curvature equal to the distance from the beam swing point to the substrate, and the distance from the beam swing point to the substrate is , there is provided an apparatus for uniformly heating a long substrate, characterized in that heating is uniform at every point on the horizontal axis of the substrate.

[Operation] The device of the present invention causes a long substrate to run on a curved roller having a radius of curvature equal to the distance from the beam swing point to the substrate, bends the substrate in the width direction, and moves the substrate from the beam swing point to the substrate. The distance to the board was made to be the same at any point on the horizontal axis of the board.

For this purpose, the angle of incidence of the beam is perpendicular at any point on the horizontal axis of the substrate, so that the beam spot size, spot shape and beam reflectance are equal on the horizontal axis of the substrate, heating the substrate uniformly. I can do it.

[Example] One embodiment of the present invention will be described in detail below with reference to the drawings.

As shown in FIG. 1, an electron beam M2 for heating the substrate is arranged above the long substrate 1. As shown in FIG. The long substrate 1 is, for example, a steel plate strip in a steel plate winding vapor deposition apparatus, and may also be a copper plate or an iron alloy plate.

It can be a metal strip such as a stainless steel plate. It can also be applied to amorphousization of a vapor deposited film and micromelting of the surface layer of a substrate or a vapor deposited film.

This long substrate 1 has a width of, for example, 200 to 1500 m1,
The thickness is 0.05 to 2.5 nm, and the conveyance speed is 1 to 50 nm.
It is desirable to set it to n/min.

The electron beam gun 2 swings in an arc around a beam swing point O. In this case, for example, the beam voltage may be set to 10 to 10
0, the beam current is 10 to 200 mA, the beam diameter is 0.1 to 10011 m, and the oscillation frequency is O to 10.
The electron beam is preferably oscillated in an arc shape as 011z, and the substrate is irradiated with the electron beam at a constant oscillation frequency.

As shown in FIG. 3, the long substrate 1 is run at a constant conveyance speed on a concave curved roller 3 having a radius of curvature equal to the distance WD from the beam point 0 to the substrate. In this way, the substrate is bent in the width direction with the same curvature as the curved roller 3, and therefore, ■ the distance WD from the beam point 0 to the substrate
is the same at any point on the horizontal axis of the substrate, and the incident angle of the main beam is perpendicular at any point on the horizontal axis of the substrate.

Therefore, the size, spot shape, and beam reflectance of the beam spot are always equal on the horizontal axis of the substrate due to the above-mentioned (1) and (2), and the substrate can be heated uniformly.

When the thickness of the long substrate 1 is large, as shown in FIG.
It is desirable to run the substrate while holding it between a concave curved roller 3 and a convex curved roller 4 and bend the substrate.

[Effects of the Invention] In the present invention, a long substrate is run on a concave curved roller having a radius of curvature equal to the distance from the beam swing point to the substrate, so the substrate has the same curvature as the curved roller. It is deflected in the width direction, so that the distance from the beam swing point to the substrate is the same at any point on the horizontal axis of the substrate, and the incident angle of the beam is perpendicular at any point on the horizontal axis of the substrate. This makes it possible to uniformly heat the substrate.The present invention is thus extremely simple! This makes it possible to uniformly heat a substrate efficiently and at low cost.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of the device of the present invention, FIG. 2 is a schematic diagram of a conventional device, FIG. 3 is a front view of the device shown in FIG. 1, and FIG. 4 is a schematic diagram of the device of the invention. 3 is a diagram similar to FIG. 3 according to another embodiment of the invention; FIG. In the figure, 1...Long substrate,...Electron beam gun for substrate heating, 3...Concave curved roller, 4...Convex curved roller Fig. 1, Fig. 2

Claims (1)

[Claims] An electron beam gun for heating the substrate is placed on top of the long substrate.
In a uniform heating device for a long substrate in which the electron beam gun is oscillated in the width direction of the substrate to irradiate the substrate with an electron beam, the distance from the beam oscillation point to the substrate is defined as the radius. A long substrate, characterized in that the substrate is deflected in the width direction by running on a curved roller having a curvature of Uniform heating device.