JPH0225576Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a stirring device for stirring molten solder inside a vertically moving solder bath.

[Conventional technology]

Conventionally, as shown in Japanese Patent Publication No. 58-23829,
For example, when soldering the lead wire of a Zener diode as an object to be soldered, multiple rows of holders that magnetically attract a large number of diodes are installed in an endless conveying chain, and these multiple rows of holders are used to vertically The flux tank and the solder tank are moved up and down relative to the diode being held and being transported, so that the lead wires of the diode are fluxed and soldered. This lead wire soldering is performed to prevent oxidation of the lead wire.

[Problem that the invention attempts to solve]

In this way, when soldering the lead wires of Zener diodes held in multiple rows, a flat solder bath with a wide soldering surface is suitable, but such a solder bath has uneven temperature distribution over the entire surface. is large, and even if a temperature sensor detects the melted solder temperature in one part, the solder temperature in other parts is often different. This makes it difficult to properly control the temperature of the entire solder bath, and There was a possibility that the variation would have a negative effect on the soldering characteristics.

An object of the present invention is to provide a simple stirring device that makes the temperature distribution of the melted solder in the solder bath uniform throughout the solder bath.

[Means for solving problems]

The present invention provides a connecting shaft 4 that is movable in the axial direction along the side plate 3 of the solder bath 2 inside a vertically movable solder bath 2 that has a built-in heater 1.
In this stirring device, stirring plates 5 are connected to a plurality of locations on the connecting shaft 4 from one side to the other side of the solder bath 2, and fins 11 are attached to a plurality of locations on each stirring plate 5. . The stirring plate 5 is arranged on the heater 1, and the connecting shaft 4 is connected to a drive mechanism 7 provided at one end of the connecting shaft 4.
reciprocates in the axial direction.

[Effect]

The present invention provides the connection shaft 4 by the drive mechanism 7.
reciprocates, and a plurality of stirring plates 5 provided from this connecting shaft 4 over the entire solder tank 2 are swung in the molten solder in the solder tank 2. This results in
Each stirring plate 5 and each fin 11 thoroughly and evenly stirs the melted solder in the solder bath 2, thereby making the solder temperature uniform throughout the solder bath 2.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.

As shown in FIG. 1, a plurality of straight rod-shaped heaters 1
Inside the vertically movable solder bath 2, which has a built-in solder bath 2, the connecting shaft 4 can be freely moved back and forth in the axial direction along the side plate 3 on one side of the solder bath 2, over almost the entire length of the solder bath 2. Provided for. Furthermore, solder baths 2 are provided at multiple locations throughout the connection shaft 4.
A stirring plate 5 disposed on the heater 1 from one side to the other is connected at right angles via a mounting plate 6. A drive mechanism 7 for driving the connecting shaft 4 in the axial direction is provided at one end of the connecting shaft 4.

The stirring plate 5 is made of punched stainless steel metal, and a large number of fins 11 are provided on both sides of the stirring plate 5 at predetermined intervals.

The drive mechanism 7 is provided on the left side of the solder bath 2, and is provided with a motor 13 with a speed reduction mechanism on the lower side of the mounting plate 12, with the rotating shaft 14 of this motor 13 protruding above the mounting plate 12, and A disk 15 is integrally provided on the rotating shaft 14, a pin 16 is provided protrudingly on the eccentric position of this disk 15, and a link 1 is attached to this pin 16.
7 is rotatably fitted, and this link 17
The shaft end of a slide shaft 20 held on the upper plate 18 of the solder bath 2 via a pair of slide bearings 19 is rotatably connected to the other end by a pin 21 .

Further, as shown in FIG. 2, the upper part of the vertical shaft 25 is fitted into the vertical hole 24 in the center of the slide shaft 20 and fixed with a pin 26, and one end of the connecting shaft 4 is attached to the lower part of the vertical shaft 25. Fix the parts.

As shown in FIGS. 2 and 3, the connection shaft 4 is attached to the bottom plate of the solder bath 2 via the mounting portion 31.
Install a guide shaft 32 parallel to the
The grooves 33 provided at the lower part of the mounting plate 6 of the stirring plate 5 are fitted into the grooves 33 of the plurality of guide plates 34 protruding from the side plate 3 on one side of the solder bath 2.
5 is fitted onto the connecting shaft 4 from above, thereby guiding the linear movement of the connecting shaft 4 in the axial direction and preventing the stirring plate 5 and the like from floating up.

Further, the solder tank 2 is provided with a large number of recesses 42 in the upper part into which the soldering object conveying section 41 is fitted, and a concave ripple prevention plate 43 is disposed in the opening between each recess 42. A large number of soldering openings 44 are provided between the recess 42 and the ripple prevention plate 43. Moreover, this solder bath 2 is provided with an air tank 51 with an opening at the bottom, and by controlling the amount of air in this tank 51, the surface of the melted solder in the solder bath 2 is maintained at a constant level. .
Furthermore, this solder bath 2 has a built-in thermocouple 52 for detecting the solder temperature.

Further, the soldering object conveying section 41 transfers the mounting member 5 to the conveying substrate 54 corresponding to the entire surface of the solder bath 2.
5, a pair of holders 56 facing oppositely to each other.
Zener diodes 6 as objects to be soldered are attached to the many vertical grooves of this holder 56.
One lead wire 62 of the holder 56 is attracted and held by the magnetic force of the holder 56. The other lead wire 63 of the diode 61 is connected to the soldering opening 44.
It is inserted into the molten solder surface in the solder bath 2 from above.

Then, when the diode 61 transported by the tact movement temporarily stops at the upper part of the solder bath 2, the solder bath 2 is raised by a hydraulic cylinder (not shown) installed at the bottom of the solder bath 2, and Lead wire 63 of the diode 61
is inserted into the molten solder in the solder bath 2 through the opening 44.

When the solder tank is raised, the rotating shaft 14 of the motor 13 is controlled not to rotate, and the stirring plate 5 is not driven. This is because the molten solder surface is required to remain stationary during soldering.

Therefore, while the solder bath 2 is descending,
The disc 15 is rotated at a slow speed by the motor 13, and the connection shaft 4 is connected to the guide shaft 32 via the link 17, the slide shaft 20, and the vertical shaft 25.
Each stirring plate 5 provided on the connecting shaft 4 is slowly reciprocated along the heater 1 so that the melted solder does not ripple.

The stirring plates 5 are provided at a plurality of locations over the entire connecting shaft 4 and are arranged from one side of the solder bath 2 to the other side.
This allows the entire inside of the solder bath 2 to be evenly and effectively stirred. At this time, the fins 11 can finely stir the molten solder, and in particular, since they are oblique to the moving direction, vortices are likely to be generated from the fins 11, and the stirring effect of the stirring plate 5 can be further enhanced. can.

In the above embodiment, the drive mechanism 7 is a reciprocating slider crank mechanism using the motor 13 as a power source, but the drive mechanism 7 is not limited to this, and may be a pneumatic or hydraulic cylinder, for example. The connecting shaft 4 may be driven reciprocatingly.

Furthermore, it goes without saying that the present invention is not limited to the solder bath 2 used for soldering the lead wire 63 of the diode 61 as in the embodiment, but can also be applied to other vertically moving solder baths.

[Effect of idea]

According to the present invention, a connecting shaft is provided along the side plate of the solder bath so as to be able to move forward and backward in the axial direction, and the heaters are disposed at multiple locations throughout the connecting shaft from one side of the solder bath to the other. Connect the stirring plate
Fins are attached to multiple locations throughout each stirring plate, and the connecting shaft is reciprocated by a drive mechanism, so that the stirring plates and fins placed over the entire surface of the solder bath can effectively control the melting in the solder bath. The solder can be evenly and finely stirred throughout the solder bath, and the temperature distribution of the melted solder can be made uniform throughout the solder bath. Therefore, good soldering characteristics can be obtained from soldering on the entire surface of the solder bath. Also,
Since the entire surface of the solder bath can be easily stirred by the stirring plate and fins, it is possible to suppress ripples on the surface of the molten solder, which hinder the soldering work and cause an increase in the amount of oxidation of the molten solder. Furthermore, since the stirring plate is placed on the heater, uneven heating of the heater can be effectively leveled out. Furthermore, since variations in temperature distribution within the solder bath are eliminated in this way, by detecting the melted solder temperature in one part of the solder bath, the solder temperature in other parts can be determined in the same way. The overall temperature can be controlled appropriately. Further, this stirring device can be easily formed by using a connecting shaft that is reciprocated by a drive mechanism, stirring plates provided at a plurality of locations on the connecting shaft, and fins attached to each stirring plate.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of the stirring device of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a sectional view of the main parts thereof. 1... Heater, 2... Solder bath, 3... Side plate,
4... Connection shaft, 5... Stirring plate, 7... Drive mechanism,
11...Fin.

Claims (1)

[Scope of utility model registration request] Inside a vertically movable solder bath with a built-in heater, a connecting shaft is provided along the side plate of the solder bath so that it can move forward and backward in the axial direction, and a connection shaft is provided at multiple locations throughout the entirety of the solder bath from one side of the solder bath. Connect the stirring plate placed on the above heater across the other side,
A stirring device for a solder bath, characterized in that fins are attached to a plurality of locations throughout each stirring plate, and a drive mechanism for reciprocating the connecting shaft in the axial direction is provided at one end of the connecting shaft.