JPH02256208A - Laminated chip coil - Google Patents
Laminated chip coilInfo
- Publication number
- JPH02256208A JPH02256208A JP31972688A JP31972688A JPH02256208A JP H02256208 A JPH02256208 A JP H02256208A JP 31972688 A JP31972688 A JP 31972688A JP 31972688 A JP31972688 A JP 31972688A JP H02256208 A JPH02256208 A JP H02256208A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- conductor
- laminated
- chip coil
- magnetic sheets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 50
- 238000000605 extraction Methods 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、複数枚の磁性体シートを積層し、かつ、各磁
性体シートに形成された導体パターンを互いに接続して
コイル状の導体路を構成してなる積層チップコイルに関
する。[Detailed Description of the Invention] <Industrial Application Field> The present invention provides a coil-shaped conductor path by laminating a plurality of magnetic sheets and connecting conductor patterns formed on each magnetic sheet to each other. The present invention relates to a multilayer chip coil comprising:
〈従来の技術〉
従来から、この種の積層チップコイルの一例としては、
第3閏の要部分解斜視図で示すように構成されたものが
知られている。この積層チンプコイル20は、複数枚の
磁性体シート21.・・・を交互に180°ずつ回転さ
せながら積層して圧着した積層体を焼成してなるもので
あって、各磁性体シート21の上面には平面視U字状の
導体パターン22が形成されている。そして、この導体
パターン22の一端部には、各磁性体シート21をその
厚み方向に沿って貫通する単一のスルーホール23がそ
れぞれ形成されている。そこで、この積層チップコイル
20においては、各磁性体シート21を交互に積層する
ことにより、積層された各磁性体シート21を挟んで対
向する導体パターン22それぞれの一端部と他端部とが
スルーホール23を介して互いに接続されることになる
結果、連続したコイル状の導体路が構成されることにな
る。<Conventional technology> Conventionally, as an example of this type of laminated chip coil,
A device configured as shown in the exploded perspective view of the main part of the third leapfrog is known. This laminated chimp coil 20 includes a plurality of magnetic sheets 21. ... are laminated and pressed while being alternately rotated by 180° and then fired, and on the upper surface of each magnetic sheet 21, a U-shaped conductor pattern 22 is formed in a plan view. ing. A single through hole 23 is formed at one end of the conductor pattern 22, passing through each magnetic sheet 21 along its thickness direction. Therefore, in this laminated chip coil 20, the magnetic sheets 21 are alternately laminated, so that one end and the other end of each of the conductor patterns 22 facing each other with the laminated magnetic sheets 21 in between are through-holes. As a result of being connected to each other via the holes 23, a continuous coil-shaped conductor path is constructed.
また、積層チップコイルの他の例としては、第4図の要
部分解斜視図で示すような積層チップコイル30がある
。この積層チップコイル30は、複数枚の磁性体シート
31.・・・を交互に180゜ずつ回転させながら積層
して圧着した積層体を焼成してなるものであり、各磁性
体シート31の上下面それぞれには単一のスルーホール
32を介して一端部と他端部とが互いに接続された平面
視5字状の導体パターン33a、33bが形成されてい
る。Further, as another example of the laminated chip coil, there is a laminated chip coil 30 as shown in an exploded perspective view of a main part in FIG. This laminated chip coil 30 includes a plurality of magnetic sheets 31. ... are laminated and pressed while being alternately rotated by 180 degrees and then fired, and one end is formed through a single through hole 32 on each of the upper and lower surfaces of each magnetic sheet 31. Conductor patterns 33a and 33b are formed in a 5-shape in plan view, with the conductor patterns 33a and 33b connected to each other at the other end.
〈発明が解決しようとする課題〉
ところで、前記従来の積層チップコイル20゜30にお
いては、つぎのような互いに共通する課題があった。す
なわち、第5図で示すように、各磁性体シート21(3
1)を貫通して形成されたスルーホール23(32)そ
れぞれの内周面に固着された導体層24の厚みが薄いと
、積層体を焼成する際に起こる導体の蒸発拡散によって
導体層24が途切れることになってしまい、断線という
ような不都合を招いてしまう。<Problems to be Solved by the Invention> By the way, the conventional laminated chip coils 20 and 30 have the following common problems. That is, as shown in FIG. 5, each magnetic sheet 21 (3
1), if the conductor layer 24 fixed to the inner peripheral surface of each of the through holes 23 (32) is thin, the conductor layer 24 will be damaged due to evaporation and diffusion of the conductor that occurs when firing the laminate. This results in an interruption, leading to inconveniences such as disconnections.
本発明はかかる従来の課題に鑑みて創案されたものであ
って、断線というような不都合の発生を確実に防止する
ことができる積層チップコイルの提供を目的としている
。The present invention was devised in view of such conventional problems, and an object of the present invention is to provide a laminated chip coil that can reliably prevent the occurrence of inconveniences such as wire breakage.
く課題を解決するための手段〉
本発明は、このような目的を達成するために、所定形状
の導体パターンが形成された複数枚の磁性体シートを積
層し、かつ、各磁性体ソートを挟んで対向する導体パタ
ーンそれぞれの一端部と他端部とを互いに複数個のスル
ーホールを介して接続した構成を採用したものである。Means for Solving the Problems> In order to achieve the above object, the present invention stacks a plurality of magnetic sheets each having a conductor pattern of a predetermined shape, and sandwiching each sort of magnetic material. This configuration employs a configuration in which one end and the other end of each of the opposing conductor patterns are connected to each other via a plurality of through holes.
く作用〉
上記構成によれば、各磁性体シートを挟んで対向する導
体パターンそれぞれの一端部と他端部とが互いに複数個
のスルーホールを介して接続されているので、磁性体シ
ートからなる積層体の焼成時にいくつかのスルーホール
の内周面に形成された導体層が蒸発拡散によって途切れ
ることがあっても、スルーホールの全てが途切れてしま
うことはなく、その接続が確実なものとなる。Effect> According to the above configuration, one end and the other end of each of the conductor patterns facing each other with each magnetic sheet sandwiched therebetween are connected to each other via a plurality of through holes. Even if the conductor layer formed on the inner peripheral surface of some through holes is interrupted due to evaporation and diffusion during firing of the laminate, all of the through holes will not be interrupted and the connection will be reliable. Become.
〈実施例〉 以下、本発明の実施例を図面に基づいて説明する。<Example> Embodiments of the present invention will be described below based on the drawings.
第1図は本発明にかかる積層チンプコイルの一実施例を
示す分解斜視図であり、この図における符号■は積層チ
ップコイルである。なお、この第1図における積層チッ
プコイル1の要部構成は、第3図に基づいて説明した従
来例と対応している。FIG. 1 is an exploded perspective view showing an embodiment of the multilayer chip coil according to the present invention, and the reference symbol ■ in this figure indicates the multilayer chip coil. Note that the main structure of the laminated chip coil 1 in FIG. 1 corresponds to the conventional example explained based on FIG. 3.
本実施例における積層チップコイル1は、矩形状に形成
された複数枚の磁性体シート2.・・・を交互にI80
゛ずつ回転させながら構成した積層体を一体的に焼成し
てなるものであり、磁性体シート2それぞれの上面には
平面視U字状の導体パターン3が形成されている。そし
て、各導体パターン3の一端部には、磁性体シート2を
その厚み方向に沿って貫通する複数個(図では、3個)
ずつのスルーホール4.・・・がそれぞれ形成されてお
り、各スルーホール4の内周面には導体層が固着されて
いる。なお、各磁性体シート2の下面には、何らの導体
パターンも形成されていない、また、このとき、磁性体
シート2の材料としては、Ni −Znフェライト、N
i−Cr−Znフェライト、Mg Znフェライトお
よびCu−Znフェライトなどが用いられ、導体パター
ン3および導体層を形成するための導体材料としては銀
や銀−パラジウムなどを用いるのが一最的である。The laminated chip coil 1 in this embodiment includes a plurality of rectangular magnetic sheets 2. ...alternately I80
The magnetic sheet 2 is formed by integrally firing a laminated body formed while rotating the magnetic sheet 2, and a conductor pattern 3 having a U-shape in plan view is formed on the upper surface of each magnetic sheet 2. At one end of each conductor pattern 3, a plurality of (three in the figure) penetrating the magnetic sheet 2 along its thickness direction are provided.
Through holes 4. ... are formed, and a conductor layer is fixed to the inner peripheral surface of each through hole 4. Note that no conductor pattern is formed on the lower surface of each magnetic sheet 2, and at this time, the material of the magnetic sheet 2 is Ni-Zn ferrite, N
i-Cr-Zn ferrite, Mg-Zn ferrite, Cu-Zn ferrite, etc. are used, and it is best to use silver, silver-palladium, etc. as the conductor material for forming the conductor pattern 3 and the conductor layer. .
そして、この積層体の下側および上側のそれぞれには、
上面に外部取出用の導体パターン5が形成されてなる磁
性体シート6が積層されている。And, on each of the lower and upper sides of this laminate,
A magnetic sheet 6 having a conductor pattern 5 for external extraction formed on the upper surface is laminated.
この磁性体シート6を積層した積層体の下側および上側
には、さらに、上下面に何らの導体パターンも形成され
ていない磁性体シートをそれぞれ所望の枚数積層するよ
うにしてもよい。A desired number of magnetic sheets having no conductor pattern formed on the upper and lower surfaces may be further laminated on the lower side and the upper side of the laminate in which the magnetic sheets 6 are laminated.
上記のような構成とした結果、この積層チップコイル1
においては、互いに積層された各磁性体シート2を挟ん
で対向する導体パターン3それぞれの一端部と他端部と
が互いに複数個のスルーホール4.・・・を介して接続
されることにより、その上下方向に沿うコイル状の導体
路が連続して構成されることになる。なお、図示してい
ないが、積層子ノブコイル1の両端には、外部取出用の
導体パターン5とそれぞれ接続される一対の外部電極が
形成される。As a result of the above configuration, this multilayer chip coil 1
, one end and the other end of each of the conductor patterns 3 facing each other with the magnetic sheets 2 stacked on each other sandwiched therebetween have a plurality of through holes 4. . . , a coil-shaped conductor path along the vertical direction is formed continuously. Although not shown, a pair of external electrodes are formed at both ends of the laminated knob coil 1 to be respectively connected to the conductor pattern 5 for external extraction.
つぎに、第2図は本発明にかかる積層チップコイルの他
の実施例を示す分解斜視図であり、この図における符号
10は積層チップコイルである。Next, FIG. 2 is an exploded perspective view showing another embodiment of the laminated chip coil according to the present invention, and reference numeral 10 in this figure indicates the laminated chip coil.
なお、この第2図における積層チップコイル10の要部
構成は、第4図に基づいて説明した従来例と対応してい
る。Note that the main structure of the laminated chip coil 10 in FIG. 2 corresponds to the conventional example explained based on FIG. 4.
この実施例における積層チップコイル10は、複数枚の
磁性体シート11.・・・を交互に180゜ずつ回転さ
せながら積層して圧着した積層体を一体的に焼成してな
るものであり、各磁性体シート11の上下面それぞれに
は平面視5字状の導体パターン12a、12bが形成さ
れている。そして、磁性体シート11を挟んで互いに対
向する導体パターン12aの一端部と導体パターン12
bの他端部とは、磁性体シート11をその厚み方向に沿
って貫通する複数個く図では、3個)ずつのスルーホー
ル13.・・・によって互いに接続されている。The laminated chip coil 10 in this embodiment includes a plurality of magnetic sheets 11. ... are laminated and pressed together while being alternately rotated by 180 degrees, and are integrally fired.The upper and lower surfaces of each magnetic sheet 11 are provided with a conductor pattern that has a five-figure shape in plan view. 12a and 12b are formed. One end of the conductor pattern 12a and the conductor pattern 12 are opposite to each other with the magnetic sheet 11 in between.
The other end of b refers to a plurality of through holes 13. are connected to each other by...
また、このとき、各磁性体シート11に形成された導体
パターン12a、12bのそれぞれは、互いに隣接して
対向配置された他の磁性体シート11の導体パターン1
2a、12bのそれぞれと直接的に接触して電気的に接
続されることになる。Further, at this time, each of the conductor patterns 12a and 12b formed on each magnetic sheet 11 is different from the conductor pattern 1 of the other magnetic sheet 11 which is arranged adjacent to and facing each other.
2a and 12b, and are electrically connected to each other.
そして、この積層体の下側には上面に外部取出用の導体
パターン14が形成されてなる磁性体シート15が積層
される一方、その上側には上面に外部取出用の導体バク
ーン14が形成されてなる磁性体シート15が積層され
ている。この磁性体シート15を積層した積層体の下側
および上側には、さらに、上下面に何らの導体パターン
も形成されていない磁性体シートをそれぞれ所望の枚数
積層するようにしてもよい。Then, on the lower side of this laminate, a magnetic sheet 15 having a conductive pattern 14 for external extraction formed on the upper surface is laminated, and on the upper side, a conductive backing 14 for external extraction is formed on the upper surface. Magnetic sheets 15 are laminated. A desired number of magnetic sheets having no conductor pattern formed on the upper and lower surfaces may be further laminated on the lower side and the upper side of the laminate in which the magnetic sheets 15 are laminated.
上記のような構成とした結果、この積層チップコイル1
0においては、各磁性体シー)11の上下面それぞれに
形成された導体パターンl1112bが互いにスルーホ
ール13を介して接続されるとともに、互いに積層され
た各磁性体シート11の対向する導体パターン12a、
12bが互いに接触して接続されることによってコイル
状の導体路が構成されることになる。なお、図示してい
ないが、積層チップコイルIOの両端には、外部取出用
の導体パターン14とそれぞれ接続される一対の外部電
極が形成される。As a result of the above configuration, this multilayer chip coil 1
0, the conductor patterns 1112b formed on the upper and lower surfaces of each magnetic sheet 11 are connected to each other via the through hole 13, and the opposing conductor patterns 12a of the magnetic sheets 11 stacked on each other,
12b are connected in contact with each other to form a coiled conductor path. Although not shown, a pair of external electrodes are formed at both ends of the laminated chip coil IO to be respectively connected to the conductor pattern 14 for external extraction.
以上は本発明の実施例であり、発明の趣旨を損なわない
範囲内で設計変更をなしうろことはいうまでもない。す
なわち、例えば、導体パターンの形状やスルーホールの
個数および形成位置などは任意であり、上記実施例の内
容に限定されるものではない。The above are examples of the present invention, and it goes without saying that design changes may be made within the scope of the invention. That is, for example, the shape of the conductor pattern, the number and formation position of the through holes, etc. are arbitrary, and are not limited to the contents of the above embodiments.
〈発明の効果〉
以上説明したように、本発明によれば、磁性体シートを
挟んで対向する導体パターンそれぞれの一端部と他端部
とを互いに複数個のスルーホールを介して接続している
ので、複数枚の磁性体シートからなる積層体の焼成にあ
たっていくつかのスルーホールの内周面に形成された導
体層が途切れたとしても、スルーホールの全てが途切れ
て断線することはなく、導体パターンの一端部と他端部
とを確実に接続することができ、コイル状の導体路を確
保することができるという効果がある。<Effects of the Invention> As explained above, according to the present invention, one end and the other end of each of the conductor patterns facing each other with a magnetic sheet in between are connected to each other via a plurality of through holes. Therefore, even if the conductor layer formed on the inner circumferential surface of some through holes is interrupted during firing of a laminate consisting of multiple magnetic sheets, all of the through holes will not be interrupted and the conductor will be disconnected. This has the effect that one end and the other end of the pattern can be reliably connected and a coiled conductor path can be secured.
第1図および第2図は本発明にかかり、第1図は積層チ
ップコイルの一実施例を示す分解斜視図であり、第2図
は積層チップコイルの他の実施例を示す分解斜視図であ
る。また、第3図ないし第6図は従来例にかかり、第3
図は積層子ノブコイルの一例を示す要部分解斜視図、第
4図はその他の例を示す要部分解斜視図であり、第5図
は従来例における課題を説明するための要部断面図であ
る。
図における符号1,10は積層チップコイル、2.11
は磁性体シート、3,128,12bは導体パターン、
4,13はスルーホールである。1 and 2 are related to the present invention, FIG. 1 is an exploded perspective view showing one embodiment of the multilayer chip coil, and FIG. 2 is an exploded perspective view showing another embodiment of the multilayer chip coil. be. Moreover, FIGS. 3 to 6 relate to the conventional example, and the third
The figure is an exploded perspective view of the main part showing an example of a laminated knob coil, FIG. 4 is an exploded perspective view of the main part showing another example, and FIG. 5 is a sectional view of the main part to explain the problems in the conventional example. be. Reference numbers 1 and 10 in the figure are laminated chip coils, 2.11
is a magnetic sheet, 3, 128, 12b is a conductor pattern,
4 and 13 are through holes.
Claims (1)
性体シートを積層し、かつ、各磁性体シートを挟んで対
向する導体パターンそれぞれの一端部と他端部とを互い
に複数個のスルーホールを介して接続したことを特徴と
する積層チップコイル。(1) A plurality of magnetic sheets on which conductor patterns of a predetermined shape are formed are laminated, and one end and the other end of each of the conductor patterns facing each other with each magnetic sheet in between are connected to each other through a plurality of through-holes. A multilayer chip coil characterized by being connected through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63319726A JPH0744114B2 (en) | 1988-12-16 | 1988-12-16 | Multilayer chip coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63319726A JPH0744114B2 (en) | 1988-12-16 | 1988-12-16 | Multilayer chip coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02256208A true JPH02256208A (en) | 1990-10-17 |
| JPH0744114B2 JPH0744114B2 (en) | 1995-05-15 |
Family
ID=18113486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63319726A Expired - Lifetime JPH0744114B2 (en) | 1988-12-16 | 1988-12-16 | Multilayer chip coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744114B2 (en) |
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|---|---|---|---|---|
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| JPS59189212U (en) * | 1983-05-18 | 1984-12-15 | 株式会社村田製作所 | chip type inductor |
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| JPS59189212U (en) * | 1983-05-18 | 1984-12-15 | 株式会社村田製作所 | chip type inductor |
| JPS6261305A (en) * | 1985-09-11 | 1987-03-18 | Murata Mfg Co Ltd | Laminated chip coil |
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| JPH0496814U (en) * | 1991-01-30 | 1992-08-21 | ||
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Also Published As
| Publication number | Publication date |
|---|---|
| JPH0744114B2 (en) | 1995-05-15 |
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