JPH02258165A - Method for hermetic joining of beryllium foil - Google Patents
Method for hermetic joining of beryllium foilInfo
- Publication number
- JPH02258165A JPH02258165A JP6742389A JP6742389A JPH02258165A JP H02258165 A JPH02258165 A JP H02258165A JP 6742389 A JP6742389 A JP 6742389A JP 6742389 A JP6742389 A JP 6742389A JP H02258165 A JPH02258165 A JP H02258165A
- Authority
- JP
- Japan
- Prior art keywords
- foil
- beryllium
- layer
- nickel
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052790 beryllium Inorganic materials 0.000 title claims abstract description 55
- 239000011888 foil Substances 0.000 title claims abstract description 49
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 title claims description 50
- 238000000034 method Methods 0.000 title claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 23
- 238000005219 brazing Methods 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 64
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 5
- 239000000956 alloy Substances 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 229920000642 polymer Polymers 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- -1 2 is heliuriuno Substances 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 241001364889 Helius Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 241001282135 Poromitra oscitans Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 206010048232 Yawning Diseases 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野」
本発明は例えば軟Ｘ線の発生あるいは照射装置等におけ
るベリリウム窓の製作に用いることのできるベリリウム
箔気密接合法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a beryllium foil hermetic sealing method that can be used, for example, to manufacture beryllium windows in soft X-ray generation or irradiation equipment.
「従来の技術」
特に軟Ｘ線の発生あるいは照射装置における窓材として
は原子量の低いベリリウムの薄い箔が用いられる。この
窓材の周縁をステンレス鋼等の窓の縁にろう付する場合
に従来は、ろう材として純銅が用いられていた。しかし
ろう付温度ｌｌ００度付近では重量で２２％、容量では
１０５％にも達するベリリウムが銅に溶解するから、例
えば厚さ３０μの銅箔をろう材として、同様に３０μの
厚さのベリリウム箔のろう付を行うと、ベリリウム箔は
完全にろう材中に溶解して、ろう付を行うことが出来な
い。またベリリウムの溶損を１０％程度に押さえようと
すると、銅箔の厚さをメツキ層の厚さに相当する３μ程
度にしなければならないから、事実上ろう付けが不可能
である。かつベリリウム箔の表面は繊維状の凹凸面を形
成しているために機械的圧接によって気密を保持するこ
とができない。更に接着剤を用いると、導電性が無いた
めに窓材の帯電によって種々の弊害を生ずる。``Prior Art'' In particular, a thin foil of beryllium with a low atomic weight is used as a window material in a soft X-ray generation or irradiation device. Conventionally, pure copper has been used as a brazing material when brazing the peripheral edge of this window material to the edge of a window made of stainless steel or the like. However, at brazing temperatures around 1100 degrees, beryllium, which reaches 22% by weight and 105% by volume, dissolves in copper. When brazing is performed, the beryllium foil completely dissolves in the brazing material and cannot be brazed. Furthermore, in order to suppress the melting loss of beryllium to about 10%, the thickness of the copper foil must be about 3 μm, which corresponds to the thickness of the plating layer, so brazing is virtually impossible. Moreover, since the surface of the beryllium foil has a fibrous uneven surface, it is impossible to maintain airtightness by mechanical pressure bonding. Furthermore, when adhesives are used, various problems occur due to the charging of the window material due to the lack of electrical conductivity.
このためベリリウムを窓材とする場合に従来は、その厚
みを０．２ｍｍ程度以下にすることが不可能であった。For this reason, when beryllium is used as a window material, it has conventionally been impossible to reduce the thickness to about 0.2 mm or less.
［−発明が解決しようとする課題」
すなわち軟Ｘ線の透過窓は、これを極めて−（１いベリ
リウム箔で形成しなければならないが、その〕こめには
ａ）ベリリウムの溶損量か小さいろう材の選定ｂ）へリ
リウムに対する“ぬれ”の良好なろう材の選定
Ｃ）ろう材による接合条件の選定
ｄ）ベリリウムと被接舎利との熱膨張の差の吸収等を必
要とする。[-Problem to be solved by the invention] In other words, the soft X-ray transmission window must be formed of very small beryllium foil; Selection of brazing filler metal b) Selection of a brazing filler metal that has good "wetting" to helillium C) Selection of bonding conditions using the brazing filler metal d) It is necessary to absorb the difference in thermal expansion between beryllium and the relic to be welded.
１課題を解決するだめの手段」
本発明は、被接合体におけるベリリウム箔接合部の表面
をニッケルまたはヘリ９９１２層となして、これに接合
しようとするベリリウム箔と上記ニッケルまたはベリリ
ウム層との間にろう祠のアルミニウムまたはアルミニウ
ム合金等の層を介挿し、真空または不活性雰囲気中てこ
れらを摂氏６／１０度から８００度の温度に加熱すると
共に毎平方糎あたり０．５から］ ＯＫｇの圧力をｆｌ
ｉｉ記被接合体とベリリウム箔との間に加えるものであ
る。The present invention provides a method for forming a surface of a beryllium foil bonding portion of an object to be bonded with a nickel or heli9912 layer, and forming a layer between the beryllium foil to be bonded thereto and the nickel or beryllium layer. A layer of aluminum or aluminum alloy, etc., is inserted and heated in a vacuum or in an inert atmosphere to a temperature of 6/10 degrees Celsius to 800 degrees Celsius, and a pressure of 0.5 to 0.5 kg per square meter] fl
This is added between the object to be joined and the beryllium foil described in ii.
［作用」
すなわちろう材のアルミニウムは延性の大きい金属であ
るから、これを容易に薄い箔とすることができると共に
蒸着イオンブレーティング等の方法で被接４′？部に必
要な厚さだけ容易に付着さＵることも可能である。また
溶融アルミニ・クムのベリリウムの溶解量は融点の近傍
に於いて重量比約１％、容積比的１．５％であり、８０
０℃においても重量比約３％、容積比で４３％に過ぎな
い。[Function] In other words, since the aluminum used as the brazing material is a metal with high ductility, it can be easily made into a thin foil, and it can also be bonded using a method such as vapor deposition ion blating. It is also possible to easily apply the required thickness to the part. In addition, the amount of beryllium dissolved in molten aluminum cum is approximately 1% by weight and 1.5% by volume near the melting point, which is 80% by weight and 1.5% by volume.
Even at 0°C, the weight ratio is only about 3% and the volume ratio is only 43%.
このため前記ａ）に記載したベリリウムの溶損を極めて
小さくすることができると同時にろう材としての性質を
向上するためにシリコン等を添加し、あるいは比重を更
に小さくするためにリチウム等を添加することによりア
ルミニウム合金として用いるごともできる。かつ接合時
に於いてはＩＦｊ平方糎当たりて０５〜］ ＯＫｇの圧
力を加えるから、熔融アルミニウムの凝集を防止して、
ヘリリウ１３の表面に対する“なじみ”を良好にするこ
とか可能で、ｂ）の条件もｌｉＪ冒こされる。なおその
加圧ト：（
段としては、例えば重錘、やとい棒等による外部からの
加圧、その他ガス圧、熱膨張の利用等適゛１°Ｌの手段
によることができる。よだろう祠のアルミニラ１２とベ
リリウムとの合金にお１）る最低液相／１１１Ｎ度は６
４０度であるから、接合に際してはこの温度以上に加熱
する必要のあることは勿論である。。For this reason, it is possible to extremely reduce the melting loss of beryllium described in a) above, and at the same time, add silicon or the like to improve the properties as a brazing material, or add lithium or the like to further reduce the specific gravity. Therefore, it can also be used as an aluminum alloy. In addition, during bonding, a pressure of 05~] OKg is applied to the IFj square glue, so that the agglomeration of molten aluminum is prevented.
It is possible to improve the "conformity" of heliliu 13 to the surface, and the condition b) is also violated. The pressure can be applied by applying pressure from the outside using a weight, a yawning rod, etc., or by using other appropriate means such as gas pressure or thermal expansion. 1) The lowest liquid phase/111N degree in the alloy of Aluminum 12 and beryllium of the shrine is 6
Since the temperature is 40 degrees, it goes without saying that it is necessary to heat above this temperature when bonding. .
更に著しく高温度に加熱するとスパッタその他の悪影響
を伴うから、このような難点を防止するためにＣ）の条
（’ｌとして６４０〜８００℃の範囲を保持する必要が
ある。なお加熱時間は要求される接合強度に応じて任意
に選定されるか、通常は５分から３０分の間で充分であ
る。同時に本発明は被接合体の表面をニッケルまたはヘ
リリウ１、の層となし、この層にろう材のアルミニウム
、箔を介してベリリウム箔を重合するがら、−」二記ニ
ッケルまたはベリリウムの層によって被接合体きベリリ
ウム箔との間の熱膨張の差が吸収されて、１）ｊｊ記ｄ
）の条件が満たされる。なおニッケルおよびベリリウ１
１の熱膨張係数は各々１３．３Ｘ１０’および＋２．４
Ｘ１０”であって、これらは極めて近い値であるから、
ベリリウム箔をこれと熱膨張係数の著しく異なる物体に
接合する場合は、その物体にニッケル板を接合して、こ
のニッケル板にベリリウム箔を接合する。またそのニッ
ケル板の厚さは、熱膨張の差を吸収し得るように通常は
０３ｍｍ程度以上とするが、その形状の選定によっては
これより薄いものを用いることもできる。更にＭｉｊ記
温度６４０〜８００℃において、アルミニウムは６〜２
０％のニッケルを溶解するから、ニッケルとベリリウム
とはアルミニウムによって良好な接合状態となる。なお
ニッケル自体にベリリウム箔を接合する場合はニッケル
層を形成する必要のないことは勿論である。Furthermore, heating to an extremely high temperature will cause spatter and other adverse effects, so in order to prevent such problems, it is necessary to maintain the temperature in the range of 640 to 800 °C as specified in C). The bonding strength can be selected arbitrarily depending on the bonding strength to be bonded, and usually 5 minutes to 30 minutes is sufficient.At the same time, the present invention forms a layer of nickel or helium 1 on the surface of the objects to be bonded, and coats this layer with nickel or helium. While polymerizing the beryllium foil through the aluminum brazing material and the foil, the difference in thermal expansion between the beryllium foil and the workpiece is absorbed by the nickel or beryllium layer, resulting in 1) jj and d.
) is satisfied. In addition, nickel and beryllium 1
The coefficient of thermal expansion of 1 is 13.3X10' and +2.4 respectively.
X10” and these are extremely close values, so
When bonding beryllium foil to an object having a significantly different coefficient of thermal expansion, a nickel plate is bonded to the object, and the beryllium foil is bonded to the nickel plate. The thickness of the nickel plate is usually about 0.3 mm or more so as to absorb the difference in thermal expansion, but it may be thinner than this depending on the shape of the nickel plate. Furthermore, at the Mij temperature of 640 to 800°C, aluminum has a temperature of 6 to 2
Since 0% nickel is dissolved, nickel and beryllium are bonded well by aluminum. Note that, of course, when the beryllium foil is bonded to nickel itself, it is not necessary to form a nickel layer.
またアルミニ・ンム箔の変わり１こアルミニ・ンム合金
を用いるときは、これを微粉末としてあらかじめベリリ
ウム箔の接合部に溶着しておくこと等らできる。In addition, when using an aluminum alloy instead of an aluminum aluminum foil, it is possible to weld this as a fine powder to the joint of the beryllium foil in advance.
第１図は本発明の方法による接合部分の断面図で、ベリ
タウ１１箔１の表面は前述のように凹凸面を形成し、ま
た被接合材にろう付されたニソケル板２の表面は平滑で
あるか、ごれらの間隙はその間に介挿したろう材のアル
ミニ・りＪ−ｙ ７’ｌ ３て１１ｈ′ｄたされて良好
な耐真空性をイ］゛する。このアルミニラｌ、箔３にお
けるベリリウム箔１に近い部分４はへリリウＪえとの合
金を形成ｊ７、ニッケル板２に近し冒事分５はニッケル
との合金を形成して更にベリリウムＩとニッケル２とが
特に接近した部分６はへリリウムとニッケルおよびアル
ミニラ１３の三元合金を形成する。更にベリリウム１お
よびニッケル２の表面に近い部分には少量のアルミニウ
ムが溶は込んでいると共にベリリウ１＼１とニッケル２
とが直接対向した部分７はアルミニウノ・の拡散に上り
液相拡散接合が１ｊわれで一体化する。FIG. 1 is a cross-sectional view of a joint part made by the method of the present invention, in which the surface of the Veritau 11 foil 1 is uneven as described above, and the surface of the Nisokel board 2 brazed to the materials to be joined is smooth. In other words, the gaps between the two are filled with aluminum filler material inserted between them to provide good vacuum resistance. The portion 4 of the aluminum foil 3 that is close to the beryllium foil 1 forms an alloy with helium J7, and the portion 5 that is close to the nickel plate 2 forms an alloy with nickel, and further forms an alloy with beryllium I and nickel 2. The portion 6 where the two are particularly close together forms a ternary alloy of helium, nickel and aluminium 13. Furthermore, a small amount of aluminum is melted into the parts near the surfaces of beryllium 1 and nickel 2, and beryllium 1\1 and nickel 2
The portion 7 where the two directly opposed each other is integrated by liquid phase diffusion bonding due to the diffusion of the aluminum UNO.
「実施例 １−１
第２図は本発明の実施例に用いられる各部分の斜視図で
、外径２５ｍｍ、内径１０ｍｍ、厚さ６ｍｍのステンレ
ス鋼リング８に銀ろうのリング９を介して外径１６ｍｍ
、内径１０ｍｍ、また厚さ０．３ｍｍのニッケル板１０
をろう付１ノし、その−Ｌに外径１５ｍｍ、内径１１ｍ
ｍ、厚さ００１ｍｍのアルミニウノ、箔１１Ｊ：りなる
ろう材を介して径１６ｍｍ、厚さ０．０２ｍｍのベリリ
ウム箔１２を重合する。このような重合体にＩ ＯＫｇ
の重錘を乗せた状態で］０３Ｐａの真空炉に収容し６６
０〜７００℃で３０分間加熱する。このようにしてベリ
リウム箔Ｉ２を窓材とする軟Ｘ線透過窓を形成すると、
その耐真空性はｌＯ°Ｐａ以−ヒであり、また導電抵抗
は０．０２Ωであるから、軟Ｘ線の透過窓として極めて
充分な性能を得ることができる。Example 1-1 Figure 2 is a perspective view of each part used in an example of the present invention. Diameter 16mm
, a nickel plate 10 with an inner diameter of 10 mm and a thickness of 0.3 mm.
Braze it once, and the -L has an outer diameter of 15 mm and an inner diameter of 11 mm.
m, aluminum foil 11J with a thickness of 001 mm: A beryllium foil 12 with a diameter of 16 mm and a thickness of 0.02 mm is polymerized through a brazing filler metal. I OKg for such polymers
] with a weight on it] and placed in a vacuum furnace at 66 Pa.
Heat at 0-700°C for 30 minutes. When a soft X-ray transmission window is formed using beryllium foil I2 as the window material in this way,
Since its vacuum resistance is less than 10° Pa and its conductive resistance is 0.02Ω, it can provide extremely sufficient performance as a soft X-ray transmission window.
なお被接合材がオーステナイト系ステンレス鋼の場合は
、通常のＸ線透過窓を製作する場合のように０２〜０．
３ｍｍの厚さを有するベリリウム板を純銅のろう材で接
合し、その上にアルミニウム７１をろう材として本発明
の方法でベリリウム箔の接合を行うことができる。すな
わち銅がベリリウノ、を溶解してヘリリウノ、銅となり
、これがオーステナイト系ステンレス鋼と類似の総合熱
膨張係数を持ら、ろう自体が熱膨張の差に対する吸収体
となるものでおる。If the material to be welded is austenitic stainless steel, 02~0.
Beryllium plates having a thickness of 3 mm can be bonded using pure copper brazing material, and beryllium foil can be bonded thereon by the method of the present invention using aluminum 71 as the brazing material. In other words, copper dissolves beryllium to form copper, which has an overall coefficient of thermal expansion similar to that of austenitic stainless steel, and the wax itself acts as an absorber for the difference in thermal expansion.
［実施例 ２」
上記実施例におけるアルミ−１ウノ、箔の代わりに、ヘ
リリウＪ−，，７＋の接合部に／１００メノノ：Ｊ以下
のアルミンリコンろうの粉末を配置し、６２０度の温度
における真空中で溶解して付着させる。ずなイつら他の
点は前記実施例１と同様の処理によって良好なＸ線窓を
得ることができるもので、この方法は処理が簡単である
。[Example 2] Instead of the aluminum foil in the above example, aluminum recon solder powder of /100 min/J or less was placed at the joint of Heliu J-, 7+, and the powder was heated at a temperature of 620 degrees. Dissolve and adhere in vacuum. In other respects, a good X-ray window can be obtained by the same processing as in Example 1, and this method is simple.
「発明の効果」
−１−述のように本発明の方法は、アルミニウド箔をろ
う材とするために、ベリリウム箔の溶損が少なく、しか
も加圧によってベリリウムとニッケル等の間がアルミニ
ウムで満たされて気密の保持が行われると共１こアフレ
ミニーｒンノ、とベリリウノ、ま）こはニッケルの間の
合金化によって強力な接合が得られる。またへリリウｌ
えの凸部とニッケルとの間は拡散接合が行われる。更に
真空、水素または不活性雰囲気中で接合されるからベリ
リウム、アルミニウム等が酸化ｄ′るごとかなく、ニッ
ケル板またはベリリウム薄板を介在させることによって
、ベリリウム箔の損傷も容易に防止される。"Effects of the Invention" -1- As mentioned above, the method of the present invention uses aluminum foil as the brazing material, so there is little melting loss of the beryllium foil, and moreover, the space between beryllium and nickel is filled with aluminum by pressurization. In addition to maintaining airtightness, a strong bond is obtained by alloying between nickel, beryllium, and nickel. Mataheliu l
Diffusion bonding is performed between the convex portion of the plate and the nickel. Furthermore, since the bonding is carried out in a vacuum, hydrogen or inert atmosphere, there is no risk of oxidation of beryllium, aluminum, etc., and by interposing a nickel plate or beryllium thin plate, damage to the beryllium foil can be easily prevented.
なお液相拡散接合においては、接合部の各面を（１・滑
にして低融点金属のろう材を介挿し、加圧、加熱により
これを拡散させるために、その接合部にろ−）祠か残留
づるわそれかムい。また本発明の方法においては、接合
しようとするベリリウム箔の表面に凹凸がある状態でア
ルミ工コウノ、箔を挾んで加熱並びに加圧を行うから、
第１図のようにろう付の状態の部分と拡散接合の様相を
呈する部分とが接合面に混在する。更に第１図にお１ノ
るニッケル板２をヘリリウノ・板に置換した場合は、そ
の表面に凹凸が存在し、アルミニラｌ−，７１３にお（
）る下部５はベリリウムとアルミニウムとの合金となる
が、その作用はニッケル板の場合と同様である。In liquid phase diffusion bonding, each surface of the joint is smoothed (1), a low melting point metal brazing material is inserted, and the solder material is poured into the joint in order to diffuse it by applying pressure and heating. Or I'll stay. Or I won't. In addition, in the method of the present invention, the beryllium foil to be bonded is heated and pressurized while the foil is sandwiched between aluminum foils with uneven surfaces.
As shown in FIG. 1, the joint surface contains a portion in a brazed state and a portion exhibiting the appearance of diffusion bonding. Furthermore, when the nickel plate 2 shown in FIG.
) is made of an alloy of beryllium and aluminum, but its function is similar to that of the nickel plate.
第１図は本発明の方法による接合部の断面図、第２図は
本発明実施例の所用部品を分解した斜視図である。
なお図において、１はベリリウム箔、２はニッケル板、
３はアルミニウム箔、６は箔３の薄い部分、
材、
７は７ｉ３の欠除部、
０はニッケル板、
８は鋼リンク、
（９はろ−）
１はアルミニウノ、箔、
２はへリリウノ、箔である。。FIG. 1 is a sectional view of a joint made by the method of the present invention, and FIG. 2 is an exploded perspective view of necessary parts in an embodiment of the present invention. In the figure, 1 is beryllium foil, 2 is nickel plate,
3 is aluminum foil, 6 is a thin part of foil 3, material, 7 is a missing part of 7i3, 0 is a nickel plate, 8 is a steel link, (9 is RO-) 1 is aluminum foil, foil, 2 is heliuriuno, foil It is. .
Claims (1)
ルまたはベリリウム層となして、これに接合しようとす
るベリリウム箔と上記ニッケルまたはベリリウム層との
間にアルミニウムを含む金属の層をろう材として配置し
、真空または不活性雰囲気中でこれらを摂氏６４０度か
ら８００度の間の温度に加熱すると共に毎平方糎当たり
０．５から１０Ｋｇの圧力を前記被接合体とベリリウム
箔との間に加えることを特徴とするベリリウム箔気密接
合法A nickel or beryllium layer is formed on the surface of the beryllium foil joint part of the object to be joined, and a metal layer containing aluminum is arranged as a brazing material between the beryllium foil to be joined to this and the nickel or beryllium layer, It is characterized by heating these to a temperature between 640 degrees Celsius and 800 degrees Celsius in a vacuum or an inert atmosphere, and applying a pressure of 0.5 to 10 kg per square glue between the objects to be joined and the beryllium foil. Beryllium foil hermetic method
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6742389A JPH02258165A (en) | 1988-12-15 | 1989-03-22 | Method for hermetic joining of beryllium foil |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63-314889 | 1988-12-15 | ||
| JP31488988 | 1988-12-15 | ||
| JP6742389A JPH02258165A (en) | 1988-12-15 | 1989-03-22 | Method for hermetic joining of beryllium foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02258165A true JPH02258165A (en) | 1990-10-18 |
Family
ID=26408632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6742389A Pending JPH02258165A (en) | 1988-12-15 | 1989-03-22 | Method for hermetic joining of beryllium foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02258165A (en) |
-
1989
- 1989-03-22 JP JP6742389A patent/JPH02258165A/en active Pending
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