JPH0225863B2 - - Google Patents
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- JPH0225863B2 JPH0225863B2 JP59166272A JP16627284A JPH0225863B2 JP H0225863 B2 JPH0225863 B2 JP H0225863B2 JP 59166272 A JP59166272 A JP 59166272A JP 16627284 A JP16627284 A JP 16627284A JP H0225863 B2 JPH0225863 B2 JP H0225863B2
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- Compositions Of Oxide Ceramics (AREA)
- Inorganic Insulating Materials (AREA)
Description
〔産業上の利用分野〕
本発明は、回路基板の材料となる磁器組成物、
特に多層路基板用の材料として最適な磁器組成物
に関する。
〔従来の技術〕
電気回路装置の小型化が要求される今日、回路
基板は、益々多層化、小型化、薄型化されて集積
密度を高くする傾向にある。こうした中で高い信
頼性を得るため、多層回路基板用の材料には、高
い絶縁性と高い抗折強度等の諸特性を具備した磁
器が使用されている。また、これまでは、多層回
路基板の製造コストを下げる目的で、配線用に比
較的安価な導電材料(例えばニツケル等の卑金
属)の使用が可能なよう、焼成温度を低く、かつ
非酸化雰囲気で焼成する方法が試みられていた。
さらに、基板が薄型化されると、内部回路の配
線パターンが外部から透けて見えやすくなるた
め、機密保持の観点から、遮光性の高い磁器材料
が要求される。
〔発明が解決しようとする問題点〕
しかし非酸化雰囲気中で焼成される磁器の多く
は、焼成した後の遮光性が低いという特質があ
る。遮光性を高める方法には、磁器基板材料に
CuO、Pb2O3、V2O5等の酸化物を加える方法が
ある。しかし、これらを加えた磁器を非酸化雰囲
気で焼成すると、磁器の絶縁抵抗値が低くなつて
しまうという欠点がある。
本発明は、従来の磁器材料における上記の問題
を解決すべくなされたものであつて、遮光性が高
く、かつ絶縁性の高い磁器組成物を提供すること
を目的とするものである。
〔問題を解決するための手段〕
本発明の磁器組成物は、Li2Oを0.5〜10モル%
と、CaO、SrO、BaO、ZnOの一種以上からなる
成分を5〜45モル%と、MgOを1〜40.7モル%
と、Al2O3を1〜40モル%と、ZrO2を1〜30.3モ
ル%と、SiO2を12.8〜65.6モル%と、Cr2O3を0.3
〜7モル%の比率で含有する混合物を非酸化雰囲
気中で焼成してなるものである。
〔実施例〕
以下に本発明の実施例として各成分の含有量の
異なる磁器組成物から試料を作製し、それぞれに
ついて実施した試験結果等について説明する。
まず試料1を例にとつて、別表に掲げる試料の
作製方法と条件について説明すると、最初に
SiO2粉末を50.3g、CaCO3粉末を24.5g、MgO粉
末を3.0g、ZrO2粉末を1.7g、Al2O3粉末を5.9
g、Li2CO3粉末を10.3g、Cr2O3粉末を4.3g宛秤
量する。なお、上記Ca、Liの炭酸塩粉末は、何
れも空気中で安定なものを用いた。
この秤量した各粉末をボールミルに入れ、約15
時間ボールミリングすることにより湿式混合し
た。
次ぎに同材料に対して、アクリル樹脂を12重量
%、アリルスルホン酸を0.5重量%、水を30重量
%加えて撹拌し、スラリーを作製した。次いでこ
のスラリーからドクターブレード法によつて長尺
な未焼結磁器シートを作り、これを10cm角に切断
した。
そしてこの切断された未焼結磁器シートから試
験の目的に従い、3種類の試料を作製した。即
ち、上記シートを6枚重ね、200Kg/cm2の圧力を
加えてラミネートした厚さ0.1cmの板から、直径
1.6cmで打ち抜いた円板形の試料と、上記シート
を12枚重ねて同様にラミネートした厚さ0.2cmの
板を長さ3.6cm、幅0.4cmの寸法に切断した角柱形
の試料と、上記シートを長さ5cm、幅3cmに切断
し、Niペーストでその片面のほゞ中央に長さ3
cm、幅0.03cmの直線を0.05cm間隔で平行に5本ス
クリーン印刷した角板形の試料をそれぞれ複数個
作製した。
次いでこれら試料を空気中において600℃まで
毎時100℃の割合で昇温し、アクリル樹脂等のバ
インダ成分を燃焼させた。しかる後、炉の中を
N2が97.0容積%、H2が3.0容積%の還元雰囲気に
変えて、1000℃の温度を3時間維持して焼成し、
試料1を得た。このときの上記焼成温度FTを別
表に示した。
そしてこの試料について、次の方法により試験
をおこなつた。先ず、電気的特性については、上
記円板形の試料を用い、この両面にインジウム−
ガリウム合金を塗布して、直径1.4cmの電極を設
け、比誘電率ε、クオリテイフアクターQ及び抵
抗率ρ(Ωcm)を測定した。比誘電率εは、25℃
の温度下で1MHzの周波数で測定した静電容量に
より算出し、Qは、上記静電容量と同様の条件で
測定した。また抵抗率ρは、500Vの直流電圧を
印加し、印加開始から60秒後の絶縁抵抗値から算
出した。
物理的、機械的特性については、厚さ0.2cmの
角柱形の試料を用い、熱膨張係数及び抗折強度τ
を測定し、これを別表に示した。熱膨張係数は、
20〜500℃の温度間における線膨張係数α(/℃)
を測定し、抗折強度τは、JIS−R1601の3点曲
げ強さに準じて測定した。
さらに遮光性については、予めNiで片面に5
本の線を引いた角板形の試料を用い、これらの線
が裏面から肉眼で透けて見えないものを遮光性良
好とし、透けて見えるものを遮光性不良とした。
以下、試料2〜78についても、磁器の組成が別
表の各欄に示すような含有比率となるよう各磁器
材料粉末を調合し、これから上記試料1と同様の
方法及び条件で作製した。但し、焼成温度FTは、
各々異なり、別表各欄に示す温度で実施した。ま
た、こうして作られた各試料について、試料1と
同じ方法、条件で上記の諸特性を測定し、この
内、各試料の線膨張係数α、抗折強度τ、抵抗率
ρ及び遮光性を別表の各欄に示した。なお、数値
は何れも複数個の試料について得られた測定値の
平均値を示した。
同表から明らかな通り、これら1〜78までの試
料は、何れも焼成温度FTが1250℃以下、線膨張
係数αが6.5×10-6/℃以下、抗折強度τが1500
Kg/cm2以上、抵抗率ρが1×1013Ωcm以上であ
り、また遮光性は何れも良好であつた。なお、こ
れらの試料は、何れも比誘電率εが9以下、Qが
500〜2000であり、回路基板材料として実用的な
数値を得ることができた。なお、これらの具体的
な数値の別表への掲載は省略した。
〔比較例〕
これに対し、上記の含有比率の要件を満たさな
い磁器材料を使用し、上記試料と同じ方法及び条
件で79〜91番まで13の試料を作製した。但し、焼
成温度FTは、各々異なり、それぞれ別表各欄に
示した温度で実施した。なお、一部に焼結できる
温度幅が狭いために、一般の工業用の焼成炉で
は、焼結ができないものがあり、これについては
その旨を別表に示した。
また、こうして作られた各試料について、上記
と同じ方法、条件で試験を行い、この内、線膨張
係数α、抗折強度τ、抵抗率ρ及び遮光性を別表
に示した。
〔作用〕
本発明による磁器組成物の成分を前述のように
限定した理由を、説明すると、概ね次の通りであ
る。
(1) SiO2の含有率が少な過ぎると焼成温度FTが
高くなり、逆に多過ぎると同温度FTが高くな
る。
例えば、試料1〜78の中でSiO2の含有量が
12.8モル%と最も少ないのは、試料70である
が、これが1250℃で焼結できたのに対し、これ
より少ない10.0モル%の含有率の試料79では、
焼結に1300℃の温度を要した。一方、試料1〜
78の中でSiO2の含有量が60.0〜65.6モル%と比
較的多いのは、試料1、5、13、16、32、44、
55、73、74であるが、これらが何れも1000〜
1200℃の温度で焼結できたのに対し、これより
多い68.0モル%のSiO2を含有する試料80では、
焼結に1300℃の温度を要した。
(2) CaO、SrO、BaO、ZnOの一種以上からなる
成分の含有量が少な過ぎると焼結温度が高くな
り、逆に多過ぎると焼結可能な温度の幅が狭く
なる。
例えば、試料1〜78の中でこれら酸化物の総
量が5.0モル%と最も少ないのは、試料12、14、
16〜20、22、44及び48であるが、これらが何れ
も1100〜1150℃の温度で焼結できたのに対し、
3.0モル%と上記酸化物の含有量が少ない試料
81では、焼結に1300℃の温度を要した。一方、
試料1〜78の中で41.1〜45.0モル%と上記酸化
物が比較的多い試料29、52、77、78が何れも
950〜1050℃の温度で焼結できたが、試料82の
ように、この含有量が50.0モル%とさらに多く
なると、焼結可能な温度の幅が狭く、一般の工
業用焼成炉では焼結させることができなかつ
た。
(3) MgOの含有量が少ないと焼結可能な温度の
幅が狭くなり、逆に多過ぎると焼成温度FTが
高くなり、しかも絶縁性が低下する。
例えば、試料1〜78の中でMgOが1.0モル%
と最も少ないのは、2、3、7〜10、13〜15、
19、21、26、28、30、32、34〜36、46、50、
55、57、59、73、77、78等の試料であるが、こ
れらが何れも950〜1200℃の温度で焼結できた
のに対し、これ以下の0.1モル%のMgOを含有
する試料83では、焼結可能な温度の幅が狭く、
一般の工業用焼成炉では焼結させることができ
なかつた。一方、試料1〜78の中で33.2〜40.7
モル%とこの含有量が比較的多いのは、試料
18、56、70であるが、これらが何れも1150〜
1250℃の温度で焼結できたのに対し、これ以上
の45.0モル%のMgOを含む試料84では、焼結
に1350℃の温度を要した。しかも前者は、抵抗
率ρが何れも1×1013Ωcm以上あつたが、後者
は、1×1011Ωcmと低かつた。
(4) Al2O3は機械的強度に優れ、この量が多いと
抗折強度が高くなるが、反面これが多過ぎると
焼成温度FTが高くなる。
例えば、試料1〜78の中でこの含有量が31.6
〜40.0と比較的多い試料19、23、49、57、70で
は、2400〜2600Kg/cm2という高い抗折強度が得
られ、しかも1150〜1250℃の温度で焼結させる
ことができた。しかし、45.0モル%とこれより
多いAl2O3を含む試料85では、抗折強度が2500
Kg/cm2と向上する傾向が見られないうえ、焼結
に1300℃の温度を要した。
(5) ZrO2の含有量が少ないと絶縁性が低下し、
これが多過ぎると焼成温度FTが高くなる。
例えば、試料1〜78の中でZrO2が1.0モル%
と最も少ないのは、1、2、4、6、7、9、
12、13、16、17、21、23、27、29、31〜33、36
〜38、49、52、56、57、60、61、65、70、74、
76等の試料であるが、これらの抵抗率ρが何れ
も1×1013Ωcm以上あつたのに対し、0.1モル
%とこれ以下の含有率の試料86では、抵抗率ρ
が1×1011Ωcmであつた。また、試料1〜78の
中で25.0〜30.3モル%とZrO2の含有量が比較的
多い試料20と58では、1150〜1200℃の温度で焼
結できたのに対し、これ以上の33.0モル%の含
有量を持つ試料87では、焼結に1300℃の温度を
要した。
(6) Li2Oが少な過ぎると熱膨張係数が大きくな
り、逆に多過ぎると絶縁性が低下する。
例えば、試料1〜78の中で0.5〜0.9モル%と
Li2Oの含有量が比較的少ないのは、53、58、
64、67、77といつた試料であるが、これらの線
膨張係数αが何れも5.8〜6.5×10-6/℃以下で
あるのに対し、これらより少ない0.2モル%の
含有量の試料88では、線膨張係数αが7.2×
10-6/℃と高くなつている。一方、試料1〜87
の中でLi2Oの含有量が比較的多い1、9、22、
24等の試料では、抵抗率ρが何れも1×1013Ω
cm以上であるのに対し、同含有率が12.0モル%
の試料89では、抵抗率ρが1×1011Ωcmと低か
つた。
(7) Cr2O3の含有量が少な過ぎると良好な遮光性
が得られず、逆に多過ぎると抵抗率が低下し、
抗折強度も低下する。
例えば、Cr2O3の含有量が0.3モル%と試料1
〜78の中で最も少ない14、15、44、56等の試料
では、焼結温度が1150〜1250℃、抗折強度が
1700〜1900Kg/cm2であり、遮光性も良好であつ
たが、これが0.1モル%と少ない試料90では、
遮光性が不良となつた。また、試料1〜78の中
でCr2O3の含有量が5〜7モル%と比較的多い
試料25、55、57、62、67では、抵抗率ρが何れ
も1×1013Ωcm以上、抗折強度が2300〜2600
Kg/cm2であつたが、これが12モル%の試料91で
は、抵抗率ρが1×1011Ωcmと低く、抗折強度
も1500Kg/cm2と低かつた。
〔発明の効果〕
以上説明した通り、本発明による磁器組成物
は、非酸化雰囲気中において1250℃以下の比較的
低い温度で焼結させることができると同時に、高
い遮光性が得られ、しかも実用上充分な絶縁抵抗
が得られる。従つて、低いコストでの基板の製造
が可能であると共に、薄型化に対応でき、かつ薄
型化された基板でも配線パターンの機密性を保持
することができる。
[Industrial Application Field] The present invention relates to a ceramic composition that is a material for a circuit board,
In particular, the present invention relates to a ceramic composition suitable as a material for multilayer circuit boards. [Prior Art] Today, there is a demand for miniaturization of electric circuit devices, and there is a tendency for circuit boards to become increasingly multi-layered, smaller, thinner, and have higher integration density. In order to obtain high reliability under these circumstances, porcelain, which has various properties such as high insulation and high bending strength, is used as a material for multilayer circuit boards. In addition, in order to reduce the manufacturing cost of multilayer circuit boards, it has been necessary to use a low firing temperature and a non-oxidizing atmosphere so that relatively inexpensive conductive materials (such as base metals such as nickel) can be used for wiring. A firing method was tried. Furthermore, as the substrate becomes thinner, the wiring pattern of the internal circuit becomes easier to see through from the outside, so a porcelain material with high light-shielding properties is required from the viewpoint of security. [Problems to be Solved by the Invention] However, many of the porcelains fired in a non-oxidizing atmosphere have a characteristic of having low light-shielding properties after firing. One way to improve light-shielding properties is to use ceramic substrate materials.
There is a method of adding oxides such as CuO, Pb 2 O 3 and V 2 O 5 . However, if porcelain to which these are added is fired in a non-oxidizing atmosphere, there is a drawback that the insulation resistance value of the porcelain becomes low. The present invention was made to solve the above-mentioned problems with conventional porcelain materials, and an object of the present invention is to provide a porcelain composition that has high light-shielding properties and high insulation properties. [Means for solving the problem] The ceramic composition of the present invention contains 0.5 to 10 mol% of Li2O .
5 to 45 mol% of components consisting of one or more of CaO, SrO, BaO, and ZnO, and 1 to 40.7 mol% of MgO.
and 1 to 40 mol% of Al2O3 , 1 to 30.3 mol% of ZrO2 , 12.8 to 65.6 mol% of SiO2 , and 0.3 mol % of Cr2O3 .
It is obtained by firing a mixture containing 7% by mole in a non-oxidizing atmosphere. [Example] Below, as an example of the present invention, samples were prepared from porcelain compositions having different contents of each component, and test results and the like conducted for each sample will be described. First, using Sample 1 as an example, we will explain the preparation method and conditions for the samples listed in the attached table.
50.3 g of SiO 2 powder, 24.5 g of CaCO 3 powder, 3.0 g of MgO powder, 1.7 g of ZrO 2 powder, 5.9 g of Al 2 O 3 powder
Weigh 10.3 g of Li 2 CO 3 powder and 4.3 g of Cr 2 O 3 powder. Note that the above Ca and Li carbonate powders were both stable in air. Place each weighed powder in a ball mill, approximately 15
Wet mixed by ball milling for an hour. Next, 12% by weight of acrylic resin, 0.5% by weight of allylsulfonic acid, and 30% by weight of water were added to the same material and stirred to prepare a slurry. Next, a long unsintered porcelain sheet was made from this slurry by a doctor blade method, and this was cut into 10 cm square pieces. Three types of samples were prepared from the cut unsintered porcelain sheets according to the purpose of the test. In other words, a diameter
A disk-shaped sample punched out with a 1.6 cm piece, a prismatic sample made by cutting a 0.2 cm thick plate made by laminating 12 of the above sheets into 3.6 cm length and 0.4 cm width, and the above. Cut the sheet into 5cm long and 3cm wide pieces, and apply Ni paste to the center of one side to a length of 3cm.
A plurality of rectangular plate-shaped samples were prepared by screen-printing five straight lines with a width of 0.03 cm and a width of 0.03 cm in parallel at intervals of 0.05 cm. These samples were then heated in air to 600°C at a rate of 100°C per hour to burn off the binder components such as acrylic resin. After that, inside the furnace
The atmosphere was changed to a reducing atmosphere containing 97.0% by volume of N 2 and 3.0% by volume of H 2 , and the temperature was maintained at 1000°C for 3 hours for firing.
Sample 1 was obtained. The above firing temperature FT at this time is shown in the separate table. This sample was then tested in the following manner. First, regarding the electrical characteristics, we used the disk-shaped sample mentioned above, and indium was coated on both sides of the sample.
A gallium alloy was applied, an electrode with a diameter of 1.4 cm was provided, and the dielectric constant ε, quality factor Q, and resistivity ρ (Ωcm) were measured. The relative permittivity ε is 25℃
Q was calculated from the capacitance measured at a frequency of 1 MHz at a temperature of Further, the resistivity ρ was calculated from the insulation resistance value 60 seconds after applying a DC voltage of 500V. Regarding the physical and mechanical properties, a prismatic sample with a thickness of 0.2 cm was used, and the coefficient of thermal expansion and bending strength τ
was measured and shown in the attached table. The coefficient of thermal expansion is
Linear expansion coefficient α (/℃) between 20 and 500℃
The bending strength τ was measured according to the three-point bending strength of JIS-R1601. Furthermore, for light shielding, we pre-coated one side with Ni.
A rectangular plate-shaped sample with lines drawn on it was used. If these lines were not visible to the naked eye from the back side, the light-shielding property was good, and if they were visible, the light-shielding property was poor. Hereinafter, for Samples 2 to 78, each porcelain material powder was prepared so that the composition of the porcelain would have the content ratio as shown in each column of the attached table, and was produced from this in the same manner and under the same conditions as Sample 1 above. However, the firing temperature FT is
Each test was conducted at a different temperature as shown in each column of the attached table. In addition, for each sample made in this way, the above-mentioned properties were measured using the same method and conditions as Sample 1, and the linear expansion coefficient α, bending strength τ, resistivity ρ, and light shielding properties of each sample were shown in the attached table. shown in each column. In addition, all the numerical values showed the average value of the measured value obtained about several samples. As is clear from the same table, all of these samples 1 to 78 have a firing temperature FT of 1250°C or lower, a linear expansion coefficient α of 6.5×10 -6 /°C or lower, and a bending strength τ of 1500°C.
Kg/cm 2 or more, the resistivity ρ was 1×10 13 Ωcm or more, and the light shielding properties were good in all cases. Note that these samples all have a relative dielectric constant ε of 9 or less and a Q of
500 to 2000, which is a practical value for circuit board materials. Please note that these specific figures have been omitted from being listed in the attached table. [Comparative Example] On the other hand, 13 samples No. 79 to No. 91 were prepared using a porcelain material that did not meet the above content ratio requirements and using the same method and conditions as the above sample. However, the firing temperature FT was different for each, and the firing was performed at the temperatures shown in each column of the separate table. Note that there are some products that cannot be sintered in a general industrial kiln because the temperature range for sintering is narrow, and these are shown in the attached table. In addition, each sample made in this way was tested in the same manner and under the same conditions as above, and the linear expansion coefficient α, bending strength τ, resistivity ρ, and light shielding properties are shown in the attached table. [Function] The reason why the components of the porcelain composition according to the present invention are limited as described above is generally as follows. (1) If the SiO 2 content is too low, the firing temperature FT will become high, and if it is too high, the same temperature FT will become high. For example, the content of SiO 2 in samples 1 to 78 is
Sample 70 had the lowest content of 12.8 mol%, but this could be sintered at 1250°C, while sample 79, which had a lower content of 10.0 mol%,
Sintering required a temperature of 1300℃. On the other hand, sample 1~
Samples 1, 5, 13, 16, 32, 44, and 78 have a relatively high SiO 2 content of 60.0 to 65.6 mol%.
55, 73, 74, but all of these are 1000~
Sample 80 containing a higher content of 68.0 mol% SiO2 could be sintered at a temperature of 1200℃.
Sintering required a temperature of 1300℃. (2) If the content of one or more of CaO, SrO, BaO, and ZnO is too small, the sintering temperature will be high, and if it is too large, the range of temperatures that can be sintered will be narrowed. For example, among samples 1 to 78, samples 12, 14,
16-20, 22, 44, and 48, but these could all be sintered at a temperature of 1100-1150℃,
Sample with low content of the above oxides at 3.0 mol%
81 required a temperature of 1300°C for sintering. on the other hand,
Among samples 1 to 78, samples 29, 52, 77, and 78 have a relatively large amount of the above oxides at 41.1 to 45.0 mol%.
Sintering was possible at a temperature of 950 to 1050°C, but when the content increases to 50.0 mol%, as in sample 82, the range of temperatures that can be sintered becomes narrower, and sintering cannot be performed in a general industrial sintering furnace. I couldn't let it go. (3) If the MgO content is too low, the range of temperatures that can be sintered will be narrowed, and if it is too high, the sintering temperature FT will increase and the insulation properties will decrease. For example, MgO is 1.0 mol% in samples 1 to 78.
The least common ones are 2, 3, 7-10, 13-15,
19, 21, 26, 28, 30, 32, 34-36, 46, 50,
Samples 55, 57, 59, 73, 77, and 78 were all able to be sintered at a temperature of 950 to 1200°C, whereas sample 83 containing 0.1 mol% MgO was lower than this temperature. In this case, the range of temperatures that can be sintered is narrow,
It was not possible to sinter it in a general industrial kiln. On the other hand, among samples 1 to 78, 33.2 to 40.7
The sample has a relatively high mole% content.
18, 56, 70, but all of these are 1150 ~
While sintering was possible at a temperature of 1250°C, sample 84 containing 45.0 mol% of MgO required a temperature of 1350°C for sintering. Moreover, the resistivity ρ of the former was 1×10 13 Ωcm or more, whereas the resistivity ρ of the latter was as low as 1×10 11 Ωcm. (4) Al 2 O 3 has excellent mechanical strength, and when the amount is large, the bending strength is high, but on the other hand, when it is too large, the firing temperature FT becomes high. For example, this content is 31.6 among samples 1 to 78.
Samples 19, 23, 49, 57, and 70, which had a relatively large amount of ~40.0, had a high bending strength of 2400 to 2600 Kg/cm 2 and could be sintered at a temperature of 1150 to 1250°C. However, in sample 85 containing more Al 2 O 3 (45.0 mol%), the bending strength was 2500.
Kg/cm 2 and there was no tendency to improve, and sintering required a temperature of 1300°C. (5) When the content of ZrO 2 is low, the insulation property decreases,
If this amount is too large, the firing temperature FT will become high. For example, ZrO2 is 1.0 mol% in samples 1 to 78.
and the least is 1, 2, 4, 6, 7, 9,
12, 13, 16, 17, 21, 23, 27, 29, 31-33, 36
~38, 49, 52, 56, 57, 60, 61, 65, 70, 74,
Samples such as No. 76 had a resistivity ρ of 1×10 13 Ωcm or more, whereas sample 86 with a content of 0.1 mol% or less had a resistivity ρ of 1×10 13 Ωcm or more.
was 1×10 11 Ωcm. In addition, among samples 1 to 78, samples 20 and 58, which have a relatively high ZrO2 content of 25.0 to 30.3 mol%, could be sintered at a temperature of 1150 to 1200°C, whereas 33.0 mol% of ZrO2 Sample 87 with a content of (6) Too little Li 2 O increases the coefficient of thermal expansion, while too much Li 2 O decreases the insulation properties. For example, in samples 1 to 78, 0.5 to 0.9 mol%
The relatively low content of Li 2 O is 53, 58,
Samples 64, 67, and 77 all have linear expansion coefficients α of 5.8 to 6.5×10 -6 /°C, whereas sample 88 has a content of 0.2 mol%, which is lower than these. Then, the linear expansion coefficient α is 7.2×
The temperature is rising to 10 -6 /℃. On the other hand, samples 1 to 87
1, 9, 22, which have relatively high Li 2 O content among
For samples such as No. 24, the resistivity ρ is 1×10 13 Ω.
cm or more, the same content is 12.0 mol%
Sample 89 had a low resistivity ρ of 1×10 11 Ωcm. (7) If the content of Cr 2 O 3 is too low, good light-shielding properties cannot be obtained, and on the other hand, if it is too high, the resistivity decreases,
The bending strength also decreases. For example, sample 1 has a Cr 2 O 3 content of 0.3 mol%.
For samples 14, 15, 44, 56 etc., which are the smallest among ~78, the sintering temperature is 1150~1250℃, and the bending strength is
It was 1700 to 1900 Kg/cm 2 and had good light shielding properties, but in sample 90, which had a small amount of 0.1 mol%,
The light shielding property became poor. In addition, among samples 1 to 78, samples 25, 55, 57, 62, and 67, which have a relatively high Cr 2 O 3 content of 5 to 7 mol%, all have resistivities ρ of 1 × 10 13 Ωcm or more. , bending strength is 2300~2600
Kg/cm 2 , but in sample 91 with 12 mol %, the resistivity ρ was as low as 1×10 11 Ωcm, and the bending strength was also as low as 1500 Kg/cm 2 . [Effects of the Invention] As explained above, the porcelain composition according to the present invention can be sintered at a relatively low temperature of 1250°C or less in a non-oxidizing atmosphere, and at the same time has high light-shielding properties, and is suitable for practical use. Moreover, sufficient insulation resistance can be obtained. Therefore, it is possible to manufacture the board at low cost, and it is also possible to respond to thinning of the board, and it is possible to maintain the confidentiality of the wiring pattern even in the thinned board.
【表】【table】
【表】【table】
【表】【table】
【表】【table】
Claims (1)
ZnOの一種以上からなる成分を5〜45モル%と、
MgOを1〜40.7モル%と、Al2O3を1〜40モル%
と、ZrO2を1〜30.3モル%と、SiO2を12.8〜65.6
モル%と、Cr2O3を0.3〜7モル%とからなること
を特徴とする磁器組成物。1 0.5 to 10 mol% of Li 2 O, CaO, SrO, BaO,
5 to 45 mol% of a component consisting of one or more types of ZnO,
1 to 40.7 mol% MgO and 1 to 40 mol% Al 2 O 3
, ZrO 2 from 1 to 30.3 mol%, and SiO 2 from 12.8 to 65.6 mol%.
A porcelain composition comprising 0.3 to 7 mol% of Cr2O3 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59166272A JPS6144760A (en) | 1984-08-08 | 1984-08-08 | Insulative ceramic composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59166272A JPS6144760A (en) | 1984-08-08 | 1984-08-08 | Insulative ceramic composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6144760A JPS6144760A (en) | 1986-03-04 |
| JPH0225863B2 true JPH0225863B2 (en) | 1990-06-06 |
Family
ID=15828303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59166272A Granted JPS6144760A (en) | 1984-08-08 | 1984-08-08 | Insulative ceramic composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144760A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS608229B2 (en) * | 1980-06-30 | 1985-03-01 | 日本電気株式会社 | multilayer ceramic substrate |
| JPS5945967A (en) * | 1982-09-03 | 1984-03-15 | 日立化成工業株式会社 | Color ceramics for electronic parts |
-
1984
- 1984-08-08 JP JP59166272A patent/JPS6144760A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6144760A (en) | 1986-03-04 |
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