JPH02260687A - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPH02260687A
JPH02260687A JP8228789A JP8228789A JPH02260687A JP H02260687 A JPH02260687 A JP H02260687A JP 8228789 A JP8228789 A JP 8228789A JP 8228789 A JP8228789 A JP 8228789A JP H02260687 A JPH02260687 A JP H02260687A
Authority
JP
Japan
Prior art keywords
cut
copper foil
predetermined line
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8228789A
Other languages
Japanese (ja)
Inventor
Haruo Seki
関 春男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP8228789A priority Critical patent/JPH02260687A/en
Publication of JPH02260687A publication Critical patent/JPH02260687A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To enable the visual confirmation of the width and positional deviation of a V-groove by a method wherein a copper foil pattern whose width varies in stages in bilateral symmetry about a predetermined line is formed on it through etching, where the V-groove is provided to the predetermined line. CONSTITUTION:An electric conductor pattern is formed on the surface of an insulator 2, and a copper foil pattern 3 used for the check of the V-cut groove is formed at a prescribed position on the insulator 2 of a printed wiring board 1 with the electric conductor pattern. The copper foil pattern 3 is provided onto a predetermined line 3' onto which a V-cut processing is carried out and formed into such a shape that its width varies in states in bilateral symmetry about the predetermined line 3'. The peripheral side of the insulator 2 which the predetermined line 3' intersects is cut out into a V shape to form a cutout 5 whose apex is coincident with the predetermined line 3'. By this setup, a formed V-cut can be visually checked in width and positional deviation by the residual shape of the copper foil pattern 3 subjected to a V-cut processing.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、プリント配線基板に施したVカットの溝幅及
び位置ずれを目視によって容易に検査できるようにした
プリント配線基板に関するものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a printed wiring board in which the width and positional deviation of a V-cut groove formed on the printed wiring board can be easily inspected visually.

〈従来の技術〉 第4図(、)は、■カット加工を施したプリント配線基
板の要部平面図、第4図(b)は、その側面図を示して
おり、図中符号2はプリント配線基板1のベースとなる
絶縁体、4は該絶縁体2の表面に形成された■カット溝
、5は■カット加工が施される箇所の絶縁体2側面を山
形に切り欠いた切欠部である。従来は、このように必要
に応じてプリント配線基板の所望位置にVカット加工を
施していた。
<Prior art> Figure 4 (,) is a plan view of the main part of a printed wiring board that has been cut, and Figure 4 (b) is a side view thereof. An insulator that serves as the base of the wiring board 1; 4 is a cut groove formed on the surface of the insulator 2; 5 is a chevron-shaped notch cut out on the side of the insulator 2 where the cutting process is to be performed; be. Conventionally, V-cutting has been performed at desired positions on printed wiring boards as necessary.

〈発明が解決しようとする課題〉 上述した従来のVカット加工が施されたプリント配線基
板では、■カット加工そのものの位置ずれは、切欠部と
Vカット溝の谷が連続しないので、目視により容易に検
出できるが、形成された■カットの溝の深さや幅は目視
による確認では誤差が大きく、器具を用いて検査しなく
てはならないという問題点を有していた。
<Problems to be Solved by the Invention> In the printed wiring board that has been subjected to the conventional V-cut process described above, ■ Misalignment of the cut process itself can be easily detected by visual inspection because the notch and the valley of the V-cut groove are not continuous. However, there was a problem in that the depth and width of the grooves formed by the cut had large errors when visually confirmed, and inspection had to be performed using an instrument.

〈課題を解決する為の手段〉 本発明は、絶縁体上の■カット加工を施す部位に左右対
称で段階的に幅を変化させた銅箔パターンをエツチング
形成することにより、上記従来の問題点を解決した。
<Means for Solving the Problems> The present invention solves the above-mentioned conventional problems by etching a symmetrical copper foil pattern with a stepwise change in width on the part to be cut on the insulator. solved.

く作用〉 銅箔パターンは、溝加工後の残存形状により、■カット
溝の形成位置及び溝幅を視覚的に感知し得るよう作用す
るものである。
Function> The copper foil pattern functions so that the formation position and groove width of the cut groove can be visually sensed by the shape remaining after the groove processing.

〈実施例〉 以下、図面に示す実施例に基づき本発明の詳細な説明す
る。
<Example> Hereinafter, the present invention will be described in detail based on the example shown in the drawings.

第1図は、本発明プリント配線基板の要部平面図であり
、表面に電気導体パターン(図示せず)が形成され、プ
リント配線基板1を構成する絶縁体2の所定位置には、
本発明が要部とするVカット渭検査用の銅箔パターン3
が、前述の電気導体パターンと共にエツチング形成され
ている。該銅箔パターン3は■カット加工が施される予
定線3゜上に設けられており、該予定線3°に対し左右
対称形で、その幅を例えば、0.5+n、097輪輪、
1論輸というように段階的に変更した形状を呈している
FIG. 1 is a plan view of the main parts of the printed wiring board of the present invention, in which an electrical conductor pattern (not shown) is formed on the surface, and at a predetermined position of an insulator 2 constituting the printed wiring board 1.
Copper foil pattern 3 for V-cut edge inspection, which is the main part of the present invention
is etched together with the electrical conductor pattern described above. The copper foil pattern 3 is provided on the planned line 3° on which the cutting process will be performed, is symmetrical with respect to the planned line 3°, and has a width of, for example, 0.5+n, 097 rings,
It has a shape that has been changed in stages, such as 1.

また該予定線3°が交差する絶縁体2の周縁は山形に切
り欠かれており、その頂点が前記予定線3′と一致する
切欠部5が形成されている。
Further, the peripheral edge of the insulator 2 where the planned line 3° intersects is cut out in the shape of a chevron, forming a notch 5 whose apex coincides with the planned line 3'.

第2図(a)、第2図(b)は、夫々前記予定線に沿っ
て正しい位置に■カット加工が施された例を示すプリン
ト配線基板の要部平面図とその側面図であり、図示した
ようにVカット加工により形成された■カット溝4の左
右には、対称に銅箔パターン3.3が残存している。こ
のことから■カット溝4は銅箔パターン3の中央部を通
り、正確に予定線上に形成されたことが確認できる。又
、階段状の銅箔パターン3の何段陰口までが切除されて
いるかを確認することにより、形成された■カット溝4
の幅がほぼ正確に分かり、このことがら該■カット溝4
の深さも容易に推測し得る。
FIG. 2(a) and FIG. 2(b) are a plan view and a side view of a main part of a printed wiring board showing an example in which the cutting process is performed at the correct position along the planned line, respectively; As shown in the figure, copper foil patterns 3.3 remain symmetrically on the left and right sides of the (1) cut groove 4 formed by V-cutting. From this, it can be confirmed that (1) the cut groove 4 passed through the center of the copper foil pattern 3 and was formed accurately on the planned line. Also, by checking how many steps of the stepped copper foil pattern 3 have been cut out, the cut groove 4 formed
The width of the cut groove 4 can be determined almost accurately.
The depth can also be easily estimated.

第3図(a)(b)は、何等かの要因によりVカットの
位置ずれが生じた場合を示しており、この場合には■カ
ット渭4中心の谷4゛は銅箔パターン3の中心である予
定線3゛上を通過しないので、■カット加工により■カ
ット?lI4の左右に残る銅箔パターン3の大きさ並び
に形状は明らかに相違することとなり、−瞥したのみで
位置ずれが生じたことが認識できるものである。
Figures 3(a) and 3(b) show a case where the position of the V-cut has shifted due to some reason. Since it does not pass above the planned line 3゛, ■Cut by ■Cut processing? The sizes and shapes of the copper foil patterns 3 remaining on the left and right sides of II4 are clearly different, and it is possible to recognize that a positional shift has occurred just by looking at them.

〈発明の効果〉 以上の通り、本発明のプリント配線基板では、電気導体
パターンと共に検査用の銅箔パターンを絶縁体上に形成
し、該銅箔パターンの残り形状を目視することにより、
何ら測定器具等を用いることなく、容易にプリント配線
基板に形成された■カット溝の幅及び位置ずれを確認す
ることができるので、不適格品の検出が容易になり、検
査作業能率が向上し、しかも殆どコストの上昇を招くこ
とがないという優れた効果を奏する。
<Effects of the Invention> As described above, in the printed wiring board of the present invention, a copper foil pattern for inspection is formed on an insulator together with an electrical conductor pattern, and by visually observing the remaining shape of the copper foil pattern,
It is possible to easily check the width and positional deviation of cut grooves formed on printed wiring boards without using any measuring instruments, making it easier to detect non-conforming products and improving inspection work efficiency. Moreover, it has an excellent effect of hardly causing an increase in cost.

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第3図(a)(b)は、本発明の実施例を示
しており、 第1図は、プリント配線基板の要部平面図、第2図(a
)は、同上、■カット加工が施された状態を示す、 第2図(b)は、第2図(Jl)の側面図、第3図(a
)は、■カット溝が位置ずれを起こした状態を示すプリ
ント配線基板の要部平面図、第3図(b)は、第3図(
a)の側面図、第4図(a)(b)は、従来例を示して
おり、第4図(a)は、■カット加工が施されたプリン
ト配線基板の要部平面図、 第4図(b)は、第4図(a)の側面図である。 l・−・プリント配線基板、 2・・・絶縁体3・・・
銅箔パターン  、 3°・・・予定線4・・・■カッ
ト溝   、4′・・・谷5・・・切欠部
1 to 3(a) and 3(b) show embodiments of the present invention, FIG. 1 is a plan view of the main parts of a printed wiring board, and FIG.
) is the same as above, ■ shows the state where the cutting process has been applied, Figure 2 (b) is a side view of Figure 2 (Jl), Figure 3 (a
) is a plan view of the main part of the printed wiring board showing a state in which the cut grooves are misaligned, and FIG.
4(a) and 4(b) show a conventional example, and FIG. 4(a) is a plan view of main parts of a cut printed wiring board; FIG. 4(b) is a side view of FIG. 4(a). l...Printed wiring board, 2...Insulator 3...
Copper foil pattern, 3°...Planned line 4...■Cut groove, 4'...Trough 5...Notch

Claims (1)

【特許請求の範囲】[Claims] 1.所定位置にVカット加工を施すプリント配線基板に
おいて、Vカットを施す部位の予定線上に、該予定線に
対して左右対称形で段階的に幅を変更した銅箔パターン
をエッチング形成し、該銅箔パターンの残存形状により
施されたVカットの溝巾と位置ずれの確認を行うように
したことを特徴とするプリント配線基板。
1. In a printed wiring board on which V-cut processing is to be performed at a predetermined position, a copper foil pattern is etched on the planned line of the part where the V-cut is to be made, and the width is changed in stages in a symmetrical manner with respect to the planned line. A printed wiring board characterized in that the groove width and positional deviation of a V cut made by the remaining shape of a foil pattern can be confirmed.
JP8228789A 1989-03-31 1989-03-31 printed wiring board Pending JPH02260687A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8228789A JPH02260687A (en) 1989-03-31 1989-03-31 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8228789A JPH02260687A (en) 1989-03-31 1989-03-31 printed wiring board

Publications (1)

Publication Number Publication Date
JPH02260687A true JPH02260687A (en) 1990-10-23

Family

ID=13770313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8228789A Pending JPH02260687A (en) 1989-03-31 1989-03-31 printed wiring board

Country Status (1)

Country Link
JP (1) JPH02260687A (en)

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