JPH0226092A - Multi-layer film for additive layer wiring board - Google Patents
Multi-layer film for additive layer wiring boardInfo
- Publication number
- JPH0226092A JPH0226092A JP63175132A JP17513288A JPH0226092A JP H0226092 A JPH0226092 A JP H0226092A JP 63175132 A JP63175132 A JP 63175132A JP 17513288 A JP17513288 A JP 17513288A JP H0226092 A JPH0226092 A JP H0226092A
- Authority
- JP
- Japan
- Prior art keywords
- additive
- layer
- film
- multilayer film
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000654 additive Substances 0.000 title claims abstract description 61
- 230000000996 additive effect Effects 0.000 title claims abstract description 56
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 229920003051 synthetic elastomer Polymers 0.000 claims abstract 3
- 239000005061 synthetic rubber Substances 0.000 claims abstract 3
- 239000010410 layer Substances 0.000 claims description 81
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 5
- 229920000459 Nitrile rubber Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000000203 mixture Substances 0.000 abstract description 11
- 238000009413 insulation Methods 0.000 abstract description 6
- 229920001971 elastomer Polymers 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 239000005060 rubber Substances 0.000 abstract description 2
- 239000004615 ingredient Substances 0.000 abstract 2
- 238000002156 mixing Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 75
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
- 239000010949 copper Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 13
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 10
- 238000003475 lamination Methods 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 244000126211 Hericium coralloides Species 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 238000007772 electroless plating Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 5
- 230000004913 activation Effects 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 description 5
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 5
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- ZRALSGWEFCBTJO-UHFFFAOYSA-N anhydrous guanidine Natural products NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、アディティブ法によって配線板を製造する際
に使用される複層フィルｌ、に関し、具体的には、無電
解メツキにより回路が形成される有機層（以下、アディ
ティブ層という）と内層回路に対し絶縁機能を有する有
機層（以下、絶縁層という）から構成される複層フィル
ムに関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a multilayer film used when manufacturing a wiring board by an additive method, and specifically relates to a multilayer film l used in manufacturing wiring boards by an additive method, and specifically, a multilayer film l used in manufacturing wiring boards by an additive method. The present invention relates to a multilayer film composed of an organic layer (hereinafter referred to as an additive layer) and an organic layer having an insulating function for inner layer circuits (hereinafter referred to as an insulating layer).
従来、アディティブ法によって得られる配線板は、複数
層の導電回路を絶縁層を介して積層させたもので、電気
製品等の部品として種々利用されている。この配線板の
製造は、れ込みが不十分となる。Conventionally, wiring boards obtained by the additive method are made by laminating multiple layers of conductive circuits with insulating layers interposed therebetween, and are used in various ways as parts of electrical products and the like. The manufacturing of this wiring board results in insufficient penetration.
アディティブ層５が未硬化の場合の複層フィルムＭを作
製するには、離型フィルムの表面に８１！！縁層４を塗
布すると共に他の離型フィルムの表面にアディティブ層
５を塗布し、ついで絶縁層４の表面とアディティブ層５
の表面とを合わせればよい。この場合に用いる離型フィ
ルムとしては、例えば、ポリエチレンテレフタレートフ
ィルム（ＰＥＴ）、シリコン処理したポリエステルフィ
ルム、離型紙、アルミ箔などの金属箔にワックス等で離
型処理したものなど離型性のあるものであればよい。To produce a multilayer film M in which the additive layer 5 is uncured, 81! is applied to the surface of the release film. ! At the same time as coating the edge layer 4, an additive layer 5 is coated on the surface of the other release film, and then the surface of the insulating layer 4 and the additive layer 5 are coated.
All you have to do is match the surface of The release film used in this case is, for example, a polyethylene terephthalate film (PET), a silicone-treated polyester film, a release paper, a metal foil such as aluminum foil that has release properties, such as a metal foil treated with wax or the like. That's fine.
アディティブ層５が硬化している場合の複層フィルムＭ
を作製するには、予め硬化させたアディティブ層に絶縁
層４を塗布すればよい。アディティブＮ５が硬化してい
る場合には、未硬化の場合に比して絶縁層４の成分がア
ディティブ層５に拡散するのが防止されるため、無電解
メッキに際してのアディティブ層５の粗化が容易となる
。Multilayer film M when additive layer 5 is cured
In order to manufacture the insulating layer 4, the insulating layer 4 may be applied to a pre-cured additive layer. When the additive N5 is cured, the components of the insulating layer 4 are prevented from diffusing into the additive layer 5 compared to when it is not cured, so that the additive layer 5 is prevented from becoming rough during electroless plating. It becomes easier.
また、内層回路基板との接着性をさらに高めるために、
第２図に示すように、絶縁層４に接着剤層６を積層させ
てもよい。接着剤層６の積層は、絶縁Ｎ４に接着剤を塗
布することにより行われる。この接着剤層６の表面は、
前述した離型フィルムを被せて保護すればよい。接着剤
としては、例えば、エポキシ系等のものが挙げられる。In addition, in order to further improve the adhesion with the inner layer circuit board,
As shown in FIG. 2, an adhesive layer 6 may be laminated on the insulating layer 4. Lamination of the adhesive layer 6 is performed by applying adhesive to the insulation N4. The surface of this adhesive layer 6 is
What is necessary is just to cover and protect with the above-mentioned release film. Examples of the adhesive include epoxy adhesives.
接着剤層６の積層時（１２０℃ｍａｘ）の粘度もまた、
絶縁層４と同様に１０３〜１０’ボイズの範囲にあるこ
とが好ましい。The viscosity of the adhesive layer 6 during lamination (120°C max) is also:
Like the insulating layer 4, the voids are preferably in the range of 10<3> to 10' voids.
絶縁層４の成分がアディティブ層５に拡散するのを防止
するために、第３図に示すように、絶縁層４とアディテ
ィブ層５との間にバリャー層７を介在させてもよい。バ
リャー層７は、例えば、ポリエチレンテレフタレートフ
ィルム（ＰＥＴ） 、ポリイミドフィルムなどの薄膜フ
ィルムである。In order to prevent the components of the insulating layer 4 from diffusing into the additive layer 5, a barrier layer 7 may be interposed between the insulating layer 4 and the additive layer 5, as shown in FIG. The barrier layer 7 is, for example, a thin film such as polyethylene terephthalate film (PET) or polyimide film.
さらに、絶縁Ｎ４の成分がアディティブ層５に拡散する
のを防止するために、第４図に示すように、絶縁層のア
ディティブ層と接する部分８を硬化させてもよい。この
場合、予め硬化させた部分８の一方の面に部分８と同一
｝Ｊｌ成の絶縁層４を配置すると共に他方の面にアディ
ティブ層５を配置すればよい。Furthermore, in order to prevent the components of the insulation N4 from diffusing into the additive layer 5, the portion 8 of the insulation layer in contact with the additive layer may be hardened, as shown in FIG. In this case, the insulating layer 4 having the same composition as that of the portion 8 may be disposed on one surface of the pre-cured portion 8, and the additive layer 5 may be disposed on the other surface.
このようにして得られる本発明の複層フィルムは、第５
図（Ａ）に示されるようなプリント回路基板などに積層
させ、アディティブ層５の表面を常法により活性化処理
（触媒入りの場合には活性化処理は省略）し、無電解メ
ノキを行うことができる。The multilayer film of the present invention obtained in this way has a fifth
It is laminated on a printed circuit board, etc. as shown in Figure (A), and the surface of the additive layer 5 is activated by a conventional method (if a catalyst is included, the activation treatment is omitted), and electroless agate is performed. I can do it.
以下に実施例および比較例を示す。Examples and comparative examples are shown below.
実施例１
ヱ尤並孟エズ居
Ｎ Ｂ Ｒ ６０ 重量部（ニ
トリル含量４１％）
フェノール樹脂 ３５ 重量部（レゾール
タイプ）
エポキシ樹脂 ５ 重量部（ビスフェノー
ル・エビ
クロルヒドリンクイプ、
エボキシ当量５００）
炭酸カルシウム １５ 重量部バーオキシ
ド ６ 重量部添加剤
０．１重量部上記配合の２５％ＭＥＫ溶液（メチルエ
チルケトン溶液）をつくり、離型フィルム（ＰＥＴ）へ
乾燥膜厚３５μとなるようにコートし、未硬化フィルム
を作製した（アディティブ層フィルム）。Example 1 60 parts by weight (nitrile content 41%) Phenol resin 35 parts by weight (resol type) Epoxy resin 5 parts by weight (bisphenol/ebichlorohydrin type, eboxy equivalent 500) Calcium carbonate 15 parts by weight peroxide 6 parts by weight additives
A 25% MEK solution (methyl ethyl ketone solution) containing 0.1 parts by weight as described above was prepared and coated onto a release film (PET) to a dry film thickness of 35 μm to produce an uncured film (additive layer film).
箱ＩＬ
エポキシ樹脂
（ビスフェノール・エビ
クロルヒドリンクイプ、
エポキシ当ｉ１５００）
ＮＢＲ
（ニトリル含量３３％）
１００重量部
４０ 重量部
炭酸カルシウム ２０ 重量部イミダゾー
ル化合物 ５ 重量部パーオキシド
１ 重量部添加剤 ０．１重量部
添加剤合の４５％ＭＢＫ溶液をつくり、離型フィルム（
ＰＥＴ）へ乾燥膜厚１００μとなるようにコートし、未
硬化フィルムを作製した（絶縁層フィルム）。得られた
フィルムについて、Ｄ Ｍ Ａ （Ｄｙｎａｍｉｃ Ｍ
ｅｃｈａｎｉｃａｌ八ｎａ Ｉ ｙｓ へＳ）により粘
度を測定したところ、１２０℃で１１００ポイズ、１０
０℃で９０００ポイズ、８０℃で４５０００ボイズ、７
０°Ｃで８５０００ポイズであった。Box IL Epoxy resin (bisphenol/ebichlorohydrin type, epoxy per i1500) NBR (nitrile content 33%) 100 parts by weight 40 parts by weight Calcium carbonate 20 parts by weight Imidazole compound 5 parts by weight Peroxide
1 parts by weight of additives Make a 45% MBK solution containing 0.1 parts by weight of additives, and apply a release film (
PET) to a dry film thickness of 100 μm to produce an uncured film (insulating layer film). Regarding the obtained film, DMA (Dynamic M
When the viscosity was measured using an electronic method, it was found to be 1100 poise and 10 at 120°C.
9000 poise at 0℃, 45000 poise at 80℃, 7
It was 85,000 poise at 0°C.
これらアディティブ層フィルムおよび絶縁層フィルムを
ロールラミネータにより８０℃で貼り合わせ、複層フィ
ルムを得た。These additive layer film and insulating layer film were laminated together at 80° C. using a roll laminator to obtain a multilayer film.
この複層フィルムをラインアンドスペース（Ｌ ／ Ｓ
） ０．５ｍｍの櫛歯回路（１オンス電解銅）を有す
る回路基板へ絶縁層が該回路基板に接するように真空ラ
ミネーションしく１００℃）、回路間への流れ込み性を
確認したところ、ボイドレスで良好なものが得られた。This multilayer film is line and space (L/S)
) Vacuum lamination was performed on a circuit board with a 0.5 mm comb-tooth circuit (1 oz electrolytic copper) so that the insulating layer was in contact with the circuit board (at 100°C), and the flowability between the circuits was confirmed, and it was found to be void-free and good. I got something.
さらに、この複層フィルム−ラミネーション基板を電気
オーブン中で１５０℃×２時間加熱して硬化させ、アデ
ィティブ法の常法に従ってクロム酸混液により粗化処理
を行い、触媒付加、活性処理を行った後、無電解メツキ
により所定の厚みまで銅を析出させ、アニール処理を行
い、特性評価を行ったところ、無電解メッキ銅の密着性
、２６０°Ｃにおけるはんだ耐熱性は共に良好な結果で
あった。Furthermore, this multilayer film-laminated substrate was cured by heating it in an electric oven at 150°C for 2 hours, roughened with a chromic acid mixture according to the conventional additive method, and subjected to catalyst addition and activation treatment. Copper was deposited to a predetermined thickness by electroless plating, annealed, and characterized. As a result, both the adhesion of electroless plated copper and the soldering heat resistance at 260°C were good.
実施例２
実施例１におけるアディティブ層フィルム（３５μ厚）
を予め１５０℃×１時間硬化させたものと、実施例１に
おける絶縁層フィルム（１００μ）とをロールラミネー
タにより１００℃で貼り合わせ、複層フィルムを得た。Example 2 Additive layer film in Example 1 (35μ thickness)
was previously cured at 150° C. for 1 hour and the insulating layer film (100 μm) in Example 1 was laminated together at 100° C. using a roll laminator to obtain a multilayer film.
この複層フィルムをラインアンドスペース（Ｌ ／ Ｓ
） ０．５ｍｍの櫛歯回路（１オンス電解銅）を有す
る回路基板へ絶縁層が該回路基板に接するように真空ラ
ミネーションしく１００℃）、回路間への流れ込み性を
確認したところ、ボイドレスで良好なものが得られた。This multilayer film is line and space (L/S)
) Vacuum lamination was performed on a circuit board with a 0.5 mm comb-tooth circuit (1 oz electrolytic copper) so that the insulating layer was in contact with the circuit board (at 100°C), and the flowability between the circuits was confirmed, and it was found to be void-free and good. I got something.
さらに、この複層フィルム−ラミネーション基板を電気
オーブン中で１５０℃×１時間加熱して硬化させ、アデ
ィティブ法の常法に従ってクロム酸混液により粗化処理
を行い、触媒付加、活性処理を行った後、無電解メツキ
により所定の厚みまで銅を析出させ、アニール処理を行
い、特性評価を行ったところ、無電解メッキ銅の密着性
、２６０℃におけるはんだ耐熱性は共に良好な結果であ
った。Furthermore, this multilayer film-laminated substrate was heated in an electric oven at 150°C for 1 hour to cure it, roughened with a chromic acid mixture according to the conventional additive method, and subjected to catalyst addition and activation treatment. When copper was deposited to a predetermined thickness by electroless plating, annealing was performed, and characteristics were evaluated, both the adhesion of electroless plated copper and the soldering heat resistance at 260° C. were good.
実施例３
接ＪＪ［Ｌ
エポキシ樹脂 １００重量部（ビスフェノ
ール・エビ
クロルヒトリンクイブ、
エポキシ当量５００）
ＮＢＩＲ４０重量部
（アクリロニトリル・
ブタジェン・イソプレン
三元共重合体ゴム、ニト
リル含量３３％）
炭酸カルシウム ２０ 重量部グアニジン
系化合物 ６ 重量部尿素化合物
１ 重量部チウラム系化合物 ２ 重量部上
記配合の４８％ＭＢＫ溶液をつくり、離型フィルム（Ｐ
ＥＴ）へ乾燥膜厚３０μとなるようにコートし、未硬化
フィルムを作製した（接着剤層フィルム）。得られたフ
ィルムにつし）で、ＤＭＡ （Ｄｙｎａｍｉｃ Ｍｅｃ
ｈａｎｉｃａｌ ＡｎａｌｙｓｉＳ）により粘度を測定
したところ、１００℃で３０００ポイズ、８０℃で１５
０００ポイズであった。Example 3 Contact JJ[L Epoxy resin 100 parts by weight (bisphenol/ebichlorohydrinolinib, epoxy equivalent 500) NBIR 40 parts by weight (acrylonitrile/butadiene/isoprene terpolymer rubber, nitrile content 33%) Calcium carbonate 20 parts by weight Part guanidine compound 6 Part by weight Urea compound
1 parts by weight Thiuram compound 2 parts by weight A 48% MBK solution with the above composition was prepared, and a release film (P
ET) to a dry film thickness of 30 μm to produce an uncured film (adhesive layer film). The obtained film was subjected to DMA (Dynamic Mec
When the viscosity was measured using Hanical Analysis S), it was 3000 poise at 100°C and 15 poise at 80°C.
It was 000 poise.
ついで、アディティブ層／絶縁層／接着層の構成となる
ように、実施例１におけるアディティブ層フィルム（３
５μ厚）と実施例１における絶縁層フィルム（ただし、
乾燥膜厚７０μの未硬化フィルム）と上記接着剤層フィ
ルムとをロールラミネータにより８０℃で貼り合わせ、
複層フィルムを得た。Next, the additive layer film (3
5μ thickness) and the insulating layer film in Example 1 (however,
An uncured film with a dry thickness of 70 μm) and the above adhesive layer film were laminated together at 80° C. using a roll laminator.
A multilayer film was obtained.
この複層フィルムをラインアンドスペース（Ｌ ／ Ｓ
） ０．５ｍｍの櫛歯回路（１オンス電解銅）を有す
る回路基板へ絶縁層が回路基板に接するように真空ラミ
ネーションしく８０℃）、回路間への流れ込み性を確認
したところ、ボイドレスで良好なものが得られた。This multilayer film is line and space (L/S)
) Vacuum lamination was performed on a circuit board with a 0.5 mm comb-tooth circuit (1 oz electrolytic copper) so that the insulating layer was in contact with the circuit board (at 80°C), and the flowability between the circuits was confirmed. I got something.
さらに、この複層フィルム−ラミネーション基板をオー
トクレーブ中で１５０℃×２時間加熱して硬化させ、ア
ディティブ法の常法に従ってクロム酸混液により粗化処
理を行い、触媒付加、活性処理を行った後、無電解メツ
キにより所定の厚みまで銅を析出させ、アニール処理を
行い、特性評価を行ったところ、無電解メッキ銅の密着
性、２６０℃におけるはんだ耐熱性は共に良好な結果で
あった。Furthermore, this multilayer film-laminated substrate was cured by heating at 150°C for 2 hours in an autoclave, roughened with a chromic acid mixture according to the conventional additive method, and subjected to catalyst addition and activation treatment. Copper was deposited to a predetermined thickness by electroless plating, annealed, and characterized. As a result, both the adhesion of electroless plated copper and the soldering heat resistance at 260° C. were good.
実施例４
実施例１におけるアディティブ層フィルム（３５μ厚：
メソキ触媒０．０３重量部含有）と絶縁層フィルム（実
施例１における４５％ＭＥＫ溶液（ただし、メツキ触媒
（塩化パラジウム）０．０３重量部含有）を離型フィル
ム（ＰＥＴ）へ乾燥膜厚５０μとなるようにコートし、
未硬化フィルムを作製し、このフィルムの一部を１５０
℃×１時間加熱して硬化させたもの）とについて、アデ
ィティブＭ／絶縁層（既硬化）／絶縁層（未硬化）の構
成となるように、ロールラミネータにより１２０℃で貼
り合わせ、複層フィルムを得た。Example 4 Additive layer film in Example 1 (35μ thickness:
(Contains 0.03 parts by weight of Mesoki catalyst) and insulating layer film (45% MEK solution in Example 1 (contains 0.03 parts by weight Mesoki catalyst (palladium chloride)) to a release film (PET) with a dry film thickness of 50μ Coat so that
An uncured film was prepared, and a portion of this film was heated to 150
℃ x 1 hour) and laminated with a roll laminator at 120℃ so that the composition of Additive M/Insulating layer (cured)/Insulating layer (uncured) becomes a multilayer film. I got it.
この複層フィルムをラインアンドスペース（Ｌ ／ Ｓ
） ０．５ｍｍの櫛歯回路（１オンス電解銅）を有す
る回路基板へ絶縁層が該回路基板に接するように真空ラ
ミネーションしく１００℃）、回路間への流れ込み性を
確認したところ、ボイドレスで良好なものが得られた。This multilayer film is line and space (L/S)
) Vacuum lamination was performed on a circuit board with a 0.5 mm comb-tooth circuit (1 oz electrolytic copper) so that the insulating layer was in contact with the circuit board (at 100°C), and the flowability between the circuits was confirmed, and it was found to be void-free and good. I got something.
さらに、この複層フィルム−ラミネーション基板を電気
オーブン中で１５０℃×２時間加熱して硬化させ、アデ
ィティブ法の常法に従ってクロム酸混液により粗化処理
を行い、無電解メツキにより所定の厚みまで銅を析出さ
せ、アニール処理を行い、特性評価を行ったところ、無
電解メッキ銅の密着性、２６０℃におけるはんだ耐熱性
は共に良好な結果であった。Furthermore, this multilayer film-laminated substrate was cured by heating in an electric oven at 150°C for 2 hours, roughened with a chromic acid mixture according to the conventional additive method, and copper was coated to a predetermined thickness by electroless plating. was precipitated, annealed, and characterized. As a result, both the adhesion of electroless plated copper and the soldering heat resistance at 260° C. were good.
実施例５
実施例１におけるアディティブ層フィルム用の２５％
Ｍ Ｅ Ｋ溶液をポリイミドフィルム（７，５μ）の片
面に乾燥膜厚３５μとなるようにコートした後、該ポリ
イミドフィルムの反対面に実施例１における絶８ｉＮフ
ィルム用の２５％ＭＥＫ溶液を乾燥膜厚１００μとなる
ようにコートし、アディティブ層と絶縁層との間にバリ
ヤー層としてポリイミドフィルムを配する複層フィルム
を得た。Example 5 25% for additive layer film in Example 1
After coating the M E K solution on one side of a polyimide film (7.5μ) to a dry film thickness of 35μ, a dry film of 25% MEK solution for the absolute 8iN film in Example 1 was applied to the opposite side of the polyimide film. A multilayer film was obtained by coating to a thickness of 100 μm and disposing a polyimide film as a barrier layer between the additive layer and the insulating layer.
この？Ｊ［フィルムをラインアンドスペース（Ｌ ／
Ｓ ） ０．５ｍｍの櫛歯回路（１オンス電解銅）を有
する回路基板へ絶縁層が該回路基板に接するように真空
ラミネーションしく１００℃）、回路間への流れ込み性
を確認したところ、ボイドレスで良好なものが得られた
。this? J [Film line and space (L /
S) Vacuum lamination was performed on a circuit board having a 0.5 mm comb-tooth circuit (1 oz electrolytic copper) so that the insulating layer was in contact with the circuit board (at 100°C), and the flowability between the circuits was confirmed, and it was found to be void-free. I got something good.
さらに、この複層フィルム−ラミネーション基板を真空
プレス中で４０トールの減圧下にプレス圧７ｋｇ／ｃｍ
！で１５０°ｃｘ２時間加熱して硬化させ、アディティ
ブ法の常法に従ってクロム酸混液により粗化処理を行い
、触媒付加、活性処理を行った後、無電解メツキにより
所定の厚みまで銅を析出させ、アニール処理を行い、特
性評価を行ったところ、無電解メッキ銅の密着性、２６
０″Ｃにおけるはんだ耐熱性は共に良好な結果であった
。Furthermore, this multilayer film-laminated substrate was placed in a vacuum press under a reduced pressure of 40 torr at a pressing pressure of 7 kg/cm.
! After hardening by heating at 150°C for 2 hours, roughening treatment with a chromic acid mixture according to the conventional additive method, addition of a catalyst, and activation treatment, copper was deposited to a predetermined thickness by electroless plating. When annealing was performed and the characteristics were evaluated, it was found that the adhesion of electroless plated copper was 26.
Both soldering heat resistance at 0''C showed good results.
比較例１
吏縁１
エポキシ樹脂 ３５重量部（ビスフェノー
ル・エビ
クロルヒトリンクイブ、
エポキシ当量５００）
Ｎ Ｂ Ｒ１０５重量部
にトリル含量４１％）
炭酸カルシウム ２０ 重量部イミダゾー
ル化合物 ２ 重量部パーオキシド
２．５重量部添加剤 ０．１重量
部上記配合の２０％ＭＥＫ溶液をつくり、離型フィルム
（ＰＥＴ）へ乾燥膜厚５０μとなるようにコートし、未
硬化フィルムを作製した（絶縁層フィルム）。得られた
フィルムについて、ＤＭＡ （Ｄｙｎａｍｉｃ Ｍｅｃ
ｈａｎｉｃａｌ Ａｎａｌｙｓｔｓ）により粘度を測定
したところ、１２０ ’Ｃで１０５ボイズ以上であった
。Comparative Example 1 Engagement 1 Epoxy resin 35 parts by weight (bisphenol/ebichlorohydrinib, epoxy equivalent 500) NBR105 parts by weight tolyl content 41%) Calcium carbonate 20 parts by weight Imidazole compound 2 parts by weight Peroxide
2.5 parts by weight Additives 0.1 parts by weight A 20% MEK solution with the above formulation was prepared and coated on a release film (PET) to a dry film thickness of 50μ to produce an uncured film (insulating layer film). ). The obtained film was subjected to DMA (Dynamic Mec
The viscosity was measured at 120'C (hanical analysts) and was found to be 105 voids or more at 120'C.
実施例１におけるアディティブ層フィルムとこの絶縁層
フィルムとをロールラミネータにより１００℃で貼り合
わせ、アディティブ層３５μ、絶縁層１００ μの複層
フィルムを得た。The additive layer film in Example 1 and this insulating layer film were bonded together at 100° C. using a roll laminator to obtain a multilayer film with an additive layer of 35 μm and an insulating layer of 100 μm.
この？ｉ層フィルムをラインアンドスペース（Ｌ ／
Ｓ ） ０．５ｍｍの櫛歯回路（１オンス電解銅）を有
する回路基板へ絶縁層が該回路基板に接するように真空
ラミネーションしく１２０℃）、回路間への流れ込み性
を確認したところ、回路間にボイドが多量に存在し、良
好なものは得られなかった。this? Line and space (L/
S) Vacuum lamination was performed on a circuit board having a 0.5 mm comb-tooth circuit (1 oz electrolytic copper) so that the insulating layer was in contact with the circuit board (at 120°C), and the flowability between the circuits was confirmed. There were a large number of voids in the sample, and a good product could not be obtained.
比較例２
エポキシ樹脂 １３０重量部（ビスフェノ
ール・エビ
クロルヒトリンクイブ、
エポキシ当１ｔ５００）
ＮＢＩＲ１０重量部
にトリル含量３５％）
炭酸カルシウム ２０ 重量部イミダゾー
ル化合物 ７ 重量部パーオキシド
０．３重量部添加剤 ０．１重量
部上記配合の７０％ＭＥＫ溶液をつくり、離型フィルム
（ＰＥＴ）へ乾燥膜厚１００μとなるようにコートし、
未硬化フィルムを作製したく絶縁層フィルム）。Comparative Example 2 Epoxy resin 130 parts by weight (bisphenol/ebichlorhydrinib, 1 t500 per epoxy) 10 parts by weight of NBIR and 35% tolyl content) Calcium carbonate 20 parts by weight Imidazole compound 7 parts by weight Peroxide
0.3 parts by weight Additives 0.1 parts by weight A 70% MEK solution with the above formulation was prepared and coated on a release film (PET) to a dry film thickness of 100μ.
I want to make an uncured film (insulating layer film).
実施例１におけるアディティブ層フィルムとこの絶縁層
フィルムとをロールラミネータにより８０℃で貼り合わ
せ、複層フィルムを得た。このフィルムのＤＭＡ法によ
る粘度は５００ポイズであった。The additive layer film in Example 1 and this insulating layer film were bonded together at 80° C. using a roll laminator to obtain a multilayer film. The viscosity of this film as determined by the DMA method was 500 poise.
この複層フィルムをラインアンドスペース（Ｌ ／ Ｓ
） ０．５ｍｍの櫛歯回路（１オンス電解銅）を有す
る回路基板へ絶縁層が回路基板に接するように真空ラミ
ネーションしく７０℃）、回路間への流れ込み性を確認
したところ、ボイドレスで良好なものが得られた。This multilayer film is line and space (L/S)
) Vacuum lamination was performed on a circuit board with a 0.5 mm comb-tooth circuit (1 oz electrolytic copper) so that the insulating layer was in contact with the circuit board (70°C), and the flowability between the circuits was confirmed. I got something.
さらに、この複層フィルム−ラミネーション基板を１５
０°ｃｘ２時間加熱して硬化させたところ、加熱時の樹
脂フローにより絶縁層の厚み均一性が失われ、平滑性良
好な基板が得られなかった。Furthermore, this multilayer film-lamination substrate was
When it was cured by heating at 0°c for 2 hours, the thickness uniformity of the insulating layer was lost due to resin flow during heating, and a substrate with good smoothness could not be obtained.
以上説明したように本発明によれば、絶縁層にボイドの
発生のない品質の安定した複層フィルムが得られる。配
線板の製造に際しては、第５図（Ａ）に示されるような
プリント回路基板にこの複層フィルムを積層させればよ
いので、従来に比し配線板の製造工程を簡略化できると
共に信頼性の高い配線板を得ることができる。As explained above, according to the present invention, a multilayer film with stable quality and no voids in the insulating layer can be obtained. When manufacturing wiring boards, this multilayer film can be laminated onto a printed circuit board as shown in FIG. 5(A), which simplifies the wiring board manufacturing process and improves reliability. It is possible to obtain a high-quality wiring board.
第１図〜第４図はそれぞれ本発明のアディティブ法配線
板用複層フィルムの一例の断面説明図、第５図（Ａ）〜
（Ｃ）はアディティブ法による従来の配線板の製造工程
を示す説明図である。
１・・・絶縁基板、２・・・銅パターン、３・・・プリ
ント回路基板、４・・・絶縁層、５・・・アディティブ
層、６・・・接着剤層、７・・・バリヤー層、８・・・
絶縁層のアディティブ層と接する部分。1 to 4 are cross-sectional explanatory diagrams of an example of the multilayer film for additive method wiring boards of the present invention, and FIGS. 5(A) to 4 are respectively
(C) is an explanatory diagram showing a conventional wiring board manufacturing process using an additive method. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Copper pattern, 3... Printed circuit board, 4... Insulating layer, 5... Additive layer, 6... Adhesive layer, 7... Barrier layer , 8...
The part of the insulating layer that comes into contact with the additive layer.
Claims (8)
主成分とする絶縁層とからなるアディティブ法配線板用
複層フィルム。1. A multilayer film for additive wiring boards, consisting of an additive layer and an insulating layer whose main components are epoxy resin and synthetic rubber.
・ブタジエンゴムである請求項１記載のアディティブ法
配線板用複層フィルム。2. 2. The multilayer film for an additive wiring board according to claim 1, wherein the main components of the insulating layer are an epoxy resin and acrylonitrile-butadiene rubber.
ィティブ法配線板用複層フィルム。3. The multilayer film for an additive wiring board according to claim 1, wherein the additive layer is uncured.
ィブ法配線板用複層フィルム。4. The multilayer film for an additive wiring board according to claim 1, wherein the additive layer is cured.
ィティブ法配線板用複層フィルム。5. The multilayer film for an additive wiring board according to claim 1, wherein an adhesive layer is laminated on the insulating layer.
させた請求項１記載のアディティブ法配線板用複層フィ
ルム。6. 2. The multilayer film for an additive wiring board according to claim 1, wherein a barrier layer is interposed between the additive layer and the insulating layer.
た請求項１記載のアディティブ法配線板用複層フィルム
。7. 2. The multilayer film for an additive wiring board according to claim 1, wherein a portion of the insulating layer in contact with the additive layer is partially cured.
０＾３〜１０＾５ポイズである請求項１又は４記載のア
ディティブ法配線板用複層フィルム。8. The viscosity of the insulating layer or adhesive layer when laminated is 1
The multilayer film for an additive wiring board according to claim 1 or 4, which has a poise of 0^3 to 10^5.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63175132A JPH0760922B2 (en) | 1988-07-15 | 1988-07-15 | Multi-layer film for additive method wiring board |
| US07/335,433 US5153987A (en) | 1988-07-15 | 1989-04-10 | Process for producing printed wiring boards |
| DE89303543T DE68909853T2 (en) | 1988-07-15 | 1989-04-11 | Process and film for making printed circuit boards. |
| EP89303543A EP0351034B1 (en) | 1988-07-15 | 1989-04-11 | Process and film for producing printed wiring boards |
| KR1019890004848A KR920000988B1 (en) | 1988-07-15 | 1989-06-08 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63175132A JPH0760922B2 (en) | 1988-07-15 | 1988-07-15 | Multi-layer film for additive method wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0226092A true JPH0226092A (en) | 1990-01-29 |
| JPH0760922B2 JPH0760922B2 (en) | 1995-06-28 |
Family
ID=15990846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63175132A Expired - Lifetime JPH0760922B2 (en) | 1988-07-15 | 1988-07-15 | Multi-layer film for additive method wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0760922B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO331361B2 (en) | 2009-11-13 | 2015-05-04 | Bewi Produkter As | Box for transport and / or storage of foodstuffs, as well as process for making them |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6251288A (en) * | 1985-08-30 | 1987-03-05 | 日立コンデンサ株式会社 | Manufacture of printed wiring board |
| JPS6259681A (en) * | 1985-09-09 | 1987-03-16 | Hitachi Chem Co Ltd | Adhesive for additive printed circuit board |
-
1988
- 1988-07-15 JP JP63175132A patent/JPH0760922B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6251288A (en) * | 1985-08-30 | 1987-03-05 | 日立コンデンサ株式会社 | Manufacture of printed wiring board |
| JPS6259681A (en) * | 1985-09-09 | 1987-03-16 | Hitachi Chem Co Ltd | Adhesive for additive printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0760922B2 (en) | 1995-06-28 |
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