JPH0226242U - - Google Patents

Info

Publication number
JPH0226242U
JPH0226242U JP1988103292U JP10329288U JPH0226242U JP H0226242 U JPH0226242 U JP H0226242U JP 1988103292 U JP1988103292 U JP 1988103292U JP 10329288 U JP10329288 U JP 10329288U JP H0226242 U JPH0226242 U JP H0226242U
Authority
JP
Japan
Prior art keywords
bonding wedge
end surface
wires
bottom wall
wall portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988103292U
Other languages
English (en)
Other versions
JPH0621240Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988103292U priority Critical patent/JPH0621240Y2/ja
Publication of JPH0226242U publication Critical patent/JPH0226242U/ja
Application granted granted Critical
Publication of JPH0621240Y2 publication Critical patent/JPH0621240Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例の縦断面図、第２図は
第１図―線矢視図、第３図は別の実施例の縦
断面図、第４図ａ，ｂはそれぞれ従来例の縦断面
図である。 １，１１，１１１……ウエツジ、２，２１，２
１１……ワイヤガイド孔、３，３１，３１１……
中央部、４，４１，４１１……天井壁部、５，５
１，５１１……底壁部、６，６１，６１１……振
動付与面部、７……側壁部、８……入口部、９…
…出口部、１０，１０′……ワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 入口をボンデイングウエツジの一側面部に開口
    し出口をボンデイングウエツジの下端面部に開口
    したワイヤガイド孔を有するボンデイングウエツ
    ジにおいて、前記ワイヤガイド孔の中央部の天井
    壁部と底壁部はそれぞれ前記下端面部に対する傾
    きを異ならしめられるとともに天井壁部と底壁部
    にワイヤを真直状態で沿わしめたときにワイヤが
    前記下端面部の振動付与面部を含む平面上で交差
    するように設けられ、該中央部から入口開口に至
    る入口部及び出口開口に至る出口部はワイヤを真
    直状態で前記天井壁部及び底壁部に沿わしめるこ
    とができる大きさの出入口部に形成されているこ
    とを特徴とするボンデイングウエツジ。
JP1988103292U 1988-08-05 1988-08-05 ボンディングウェッジ Expired - Lifetime JPH0621240Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988103292U JPH0621240Y2 (ja) 1988-08-05 1988-08-05 ボンディングウェッジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988103292U JPH0621240Y2 (ja) 1988-08-05 1988-08-05 ボンディングウェッジ

Publications (2)

Publication Number Publication Date
JPH0226242U true JPH0226242U (ja) 1990-02-21
JPH0621240Y2 JPH0621240Y2 (ja) 1994-06-01

Family

ID=31333990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988103292U Expired - Lifetime JPH0621240Y2 (ja) 1988-08-05 1988-08-05 ボンディングウェッジ

Country Status (1)

Country Link
JP (1) JPH0621240Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0471245A (ja) * 1990-07-12 1992-03-05 Oki Electric Ind Co Ltd ワイヤボンダ及びワイヤボンディング方法
JP5953385B1 (ja) * 2015-02-25 2016-07-20 本田技研工業株式会社 車両

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0471245A (ja) * 1990-07-12 1992-03-05 Oki Electric Ind Co Ltd ワイヤボンダ及びワイヤボンディング方法
JP5953385B1 (ja) * 2015-02-25 2016-07-20 本田技研工業株式会社 車両

Also Published As

Publication number Publication date
JPH0621240Y2 (ja) 1994-06-01

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