JPH02263449A - Ic chip provided with bump - Google Patents

Abstract

PURPOSE:To eliminate difficulties at the time of bump forming and IC chip mounting, and simplify IC chip production, by retaining a conductor in a through hole, one end of which conductor is electrically connected to a wiring pattern, and electrically connecting the other end of said conductor to a connection terminal, CONSTITUTION:A film 13 for a bump use is provided with conductors 14 connected to a wiring pattern 12 of an electronic parts mounting member 10; while connection terminals 4 for bonding an IC chip 3 are connected to the conductors 14. As a result, by aligning the film 13 for a bump with respect to the wiring pattern 12 of the electronic parts mounting member 10, the IC chip 3 can be simply mounted. Since the conductors 14 are uniformly arranged in through holes, individual connection work of the connection terminals 4 for bonding an IC chip 3 and the conductors 14 is simplified; via the conductor 14, the wiring pattern 12 of the electronic parts mounting member 10 and the connection terminals 4 of the IC chip 3 are precisely connected. Thereby IC chip production is simplified and facilitated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC chip that constitutes a semiconductor integrated circuit (hereinafter referred to as IC).

[Conventional technology]

Conventionally, there is a tape carrier method as a method of bonding an IC chip to an insulating carrier film. As IC chips used in this tape carrier method, the IC chips shown in FIGS. 18 to 20 are known.

In the device shown in FIG. 19, a device hole 2 for mounting an IC chip is opened in an elongated carrier film 1 that serves as a base material for mounting an IC chip. Device hole 2
is formed in a size approximately corresponding to the outer peripheral shape of the IC chip 3, and on the opening edge of the device hole 2, wiring patterns 5, 5 connected to the bonding connection terminals 4.4 of the IC chip 3 are formed. The tips of the wiring patterns 5, 5 that have been formed (see FIG. 18) protrude into the device hole 2.

The leading ends of the wiring pattern 5.5 are lead terminals 5a, 5a extending above the connection terminals 4.4 of the IC chip 3. The connection terminal 4.4 is provided with a bump 6.6 made of low-temperature melting metal such as gold or solder.
The IC chip 3 is mounted on the carrier film 1 by electrically connecting the lead terminals 5a, 5a of the wiring patterns 5, 5 to the carrier film 6.

In the case of the one shown in FIG. 20, substantially similar to the IC chip shown in FIG. 5a, . . . protrude into the device hole 2. Lead terminal 5al1 of wiring patterns 5, 5
A bump 7.7 made of low-temperature melting metal is formed at the tip of the tip. A pad 8.8 is provided on the connection terminal 4.4 of the IC chip 3, and the connection terminals 4, 4 are supported by the pads 8, 8 when the bump 7.7 and the connection terminal 4.4 are electrically connected. , the IC chip 3 is mounted on the carrier film 1.

[Problem to be Solved by the Invention III] However, the IC chip suitable for the tape carrier method is the lead terminal 5a of the carrier film 1.

Bumps 6.6, 7.7 are required for any bonding, but the conventional IC chips shown in FIGS. 18 to 20 have bumps 7.7 formed on lead terminals 5a, 5a, Or bumps 6 and 6 on the connection terminals 4 and 4 of the IC chip 3.
When providing a lead terminal 5a, connect each bump 6.6 to the lead terminal 5a.
, 5a, and connecting the lead terminals 5a, 5a to the bumps 8, 8 one by one from the connecting terminals 4, 4, which takes time and effort. , 5a is easily bent.

On the other hand, there is a problem in that IC chips without bumps cannot be used in the tape carrier method.

The present invention has been made to solve the above problems,
The purpose of this invention is to simplify the production of IC chips that can be adopted by the tape carrier method by eliminating difficulties in forming bumps and mounting IC chips.

[Means for Solving the Problems J In order to solve the above problems, bumped I according to the present invention
The C-chip includes a plurality of bonding connection terminals and a bump film in which through-holes corresponding to the number of bonding terminals are opened, and the -end is electrically connected to the wiring pattern of the electronic component mounting member. A conductor is held in the through hole, and the other end of the conductor is electrically connected to the connection terminal.

[Function] According to the bumped IC chip according to the present invention, the bump film is provided with a conductor that is connected to the wiring pattern of the electronic component mounting member, and the conductor has a connection terminal for bonding the IC chip. Since these are connected, the IC chip can be easily mounted by aligning the bump film with the wiring pattern of the electronic component mounting member.

In addition, since the conductors are uniformly provided in the through holes, the individual connection work between the connection terminals for IC chip bonding and the conductors is simplified, and the electronic component mounting member can be connected via the conductors. The wiring pattern and the connection terminal of the IC chip are precisely connected.

[Example] Hereinafter, a bumped IC chip according to an example of the present invention will be described using FIGS. 1 to 15. In addition, in order to clarify the differences from conventional IC chips, the I
The C chip will be explained using the reference numeral of the conventional IC chip 3.

1 to 4, 10 is a carrier film used as an electronic component mounting member used in the tape carrier method; 11
1 is a device hole opened in the carrier film 1, 4 is a connection terminal for bonding the IC chip 3, and 12 is a wiring pattern connected to the connection terminals 4, 4. In this embodiment, a case where the bumped IC chip 3 is mounted on a carrier film will be described, but it may also be directly mounted on a wiring board as an electronic component mounting member.

(Carrier Film) First, a carrier film on which the bumped IC chip 3 according to this embodiment can be mounted will be described.

Figure 4)! This figure shows a carrier film 10 having a thickness of 20 μm and a width of 35 m in order to mount the bumped IC chip 3 of this embodiment.
An elongated polyimide film of m is used. This polyimide film has properties of insulation, acid resistance, and alkali resistance, but is soluble in a solution containing hydrazine and ethylenediamine mixed at a ratio of 1:1.

In addition to the device holes 11, the carrier film 10 has:
Subrocket holes 11a and character holes 11b for feeding the carrier film 10 itself are opened. This punching is performed using a punch and die (not shown) formed in a predetermined shape and size.

The device hole 11 is opened so that the connection terminal 4.4 of the IC chip 3 is located inside the device hole 11. A wiring pattern 12 is formed on the opening edge 10a of the device hole 11 after punching the device hole 11 and the sprocket hole 11a.
is formed. The wiring pattern 12 is formed corresponding to the connection terminal 4.4 of the IC chip 3, and the tip of the wiring pattern 12 is connected to the device hole 11 as the lead terminal 12a, .
protrudes inward. Note that a sprocket (not shown) for feeding the bump film 10 is engaged with the sprocket hole 11a.

(IC chip with bumps) The IC chip 3 according to this embodiment has a bump film 13.
It is equipped with This bump film 13 has bumps 141 as conductors that connect the connection terminals 4.4 of the IC chip 3 and the lead terminals 12a of the wiring pattern 12.
2. is held. In this embodiment, the bump film 13 is a carrier film 10 that is in a stage before the wiring pattern 12 is formed, as shown in FIG. 2, and is made of the same material as the carrier film 10. is used. The bump film 13 has a positioning hole 15 with a similar shape that is smaller than the device hole 1 of the carrier film 10, a sprocket hole 15a with the same shape as the sprocket hole 11a, and a character hole 15b with the same shape as the character hole 11b. is formed (Fig. 2,
(See FIG. 5), the sprocket hole 15a is used for positioning the IC chip 3 and the bumped film 13.

(Formation of bumps) Bumps 14 are formed on this bump film 13. , , , first, by electroless plating using the Sibley P-T-H process (trademark), as shown in FIG. A 1 μm thick copper film 16 is formed.

After forming the copper film 16 with a thickness of 1 μm, as shown in FIG. 8, the connection terminals 4.
Microhole 17a corresponding to 4 (Through hole 17
In order to form a photoresist 18 on both surfaces 13a and 13b of the bump film 13, the photoresist 18 is exposed and developed (see FIG. 7).

After developing the photoresist 18, the solution temperature is 40 degrees Celsius.
The copper film 16 is spray-etched using a ferric chloride etching solution having a concentration of 685 g/11 to remove the copper film 16 having a shape corresponding to the through hole 13 (see FIG. 8).

After the micro holes 17a, , , are opened in the copper film 16, as shown in FIG. Through hole 17. , , are opened. As this spray etching solution, a mixed solution of hydrazine and ethylenediamine in a ratio of 1:1 is used at room temperature.

Through hole 17. , , are opened, a copper film 19 with a film thickness of 0.2 μm is formed in the through hole 17 and on the copper film 16 by electroless plating using the Sibley P-T-H process (trademark) again. (See Figure 10).

In this embodiment, after forming the copper film 19 with a film thickness of 0.2 μm in the through hole 17 and on the copper film 1B, a photoresist 20 is provided on the copper film 16 to open the opening of the through hole 17 ( In this case, the photoresist 20 is not provided at the opening of the through hole 17. After the photoresist 20 is formed, it is exposed and developed. The copper film 16 in the hole 17 is exposed.

After exposing the copper film 16 in the through hole 17, the first
As shown in Figure 2, bumps 14. , through hole 1
7. Form within. This bump 14. When forming ++, use gold potassium cyanide Temperex 702 (trademark, EEJA product) at a bath temperature of 75 degrees C.
(plus, minus 5 degrees C), PH8 (plus, minus 1.0), under the conditions of current density 0.5 to IOA/dm.
Perform the electroplating method, thereby forming the through hole 17.
．． ,, purity 99°99%, film thickness 10 μa I ~ 30 μ
m bumps 14□ are formed. In this case, if gold plating is performed after electrolytic copper plating, manufacturing costs can be reduced.

Bump 14. As shown in FIG. 13, the photoresist 20 is removed, and then the 14th
Excess copper films 16 and 19 adhering to the polyimide film are removed by spray etching as shown in FIGS. The solution for this spray etching has a liquid temperature of 4.
A ferric chloride solution of 1665 g/11 at 0 degrees Celsius is used.

At this time, if there are any exposed areas of the copper films 16, 19, a layer of 0.2 to 0.5 μm is applied using an electroless gold plating method.
Gold of about m may be formed.

(Formation of IC chip with bumps) Bumps 14. , , is formed, the bump film 13 is mounted on the IC chip 3 as shown in FIG.

In this case, the IC chip 3 is positioned with reference to the sprocket hole 15a, and the bump 14. , , to the lead terminal 12a of the wiring pattern 12 of the carrier film 10
, , , , to match.

Bump 14. , , are made to match the lead terminals 12a, , , of the wiring pattern 12 of the carrier film 10, the heating temperature is set to 350 degrees Celsius to 450 degrees Celsius for the lead terminals 12a of the tin-plated wiring pattern 12.
Pulse heat bonding is uniformly performed at once under the condition that the pressure cuff per lead terminal is 0 g to form the IC chip 3 with bumps.

Incidentally, the bump film 13 is cut at the boundary between adjacent character holes 15b, 15b, for example, when mounting the IC chip 3 (see FIG. 3).

According to the IC chip mounting structure according to this embodiment,
Bumps 7.7 may be formed on the lead terminals 5a, 5a one by one as in the prior art, or bumps 14. In addition to simplifying the process of providing the bumped IC chips 3 one by one, the lead terminals 12a1 . Bump 14. . . . The entire precision connection becomes easy.

(Mounting the IC chip on the wiring board) Next, based on FIGS. 16 and 17, the bumped IC according to this embodiment
A case will be described in which a chip is directly mounted on a wiring board as an electronic component mounting member.

In this case, the bumped IC chip 3 is carried onto the wiring board 21 of the electronic device while being mounted on the bump film 13. Therefore, the bump film 13 functions as a transport film in the tape carrier method. In this transportation method, as shown in FIG. 16, the wound bump film 13 is developed on the wiring board 21. Wiring board 2
1 is arranged so that its position can be adjusted in the horizontal direction, and on the wiring board 21 there is a mounting position 2 of the IC chip 3 with bumps.
A press device ji122 that can move up and down toward 1a is provided. The bumped IC chip 3 of the bump film 13 is placed at the mount position 2 based on the feed amount of the sprocket hole 15a when the bump film 13 is developed and wound.
1a, the bump film 13 is temporarily stopped, the press device 22 is lowered toward the bump film 13, the bumped IC chip 3 is cut off from the bump film 13, and the wiring of the wiring board 21 is removed. pattern 2
Connected to 3. The connection conditions at this time may be the same as those for mounting the bumped IC chip 3 on the carrier film 10 of the first embodiment.
Once the bumped IC chip 3 is mounted, the press device 22 is raised and the bump film 13 is wound again, and when a new bumped IC chip 3 is positioned at a predetermined position, a similar IC chip mounting operation is performed.

The bumped IC chip 3 can be mounted on an electronic component mounting member such as the wiring board 21 in this way, and the carrier film O is not required, making it easy to mount the IC chip using the tape carrier method.

[Effect of the Invention J As explained above, the bumped IC chip according to claim 1 of the present invention includes a plurality of bonding connection terminals and a bump having through holes corresponding to the number of the connection terminals. A conductor having one end electrically connected to the wiring pattern of the electronic component mounting member is held in the through hole, and the other end of the electrical conductor is electrically connected to the connection terminal. This eliminates the difficulty of individually forming bumps on the connection terminals or wiring patterns of IC chips, and simplifies and facilitates the production of IC chips employed in the tape carrier method.

Also, since the conductor is held in the bump film,
By accurately positioning one of the predetermined bumps with respect to one of the wiring patterns of the electronic component mounting member, the other wiring patterns and other bumps are also uniformly and accurately positioned. IC chip mounting work can be simplified.

[Brief explanation of drawings]

1 to 15 are explanatory diagrams showing the manufacturing process of the carrier film according to the embodiment of the present invention. Figure 3 is a plan view of the cut-out bump film, Figure 4 is a cross-sectional view of the carrier film near the device hole, and Figure 5 is a partial plan view of the bump film after punching and before copper film formation. A cross-sectional view of the bump film. Figure 6 is an explanatory diagram of a state in which a thin retina is formed on the bump film shown in Figure 5. Figure 7 is a photoresist for forming micropores on the bump film shown in Figure 6m. Figure 8 is an explanatory diagram of the state in which the bump film shown in Figure 7 has been etched to open microholes in the copper film, and Figure 9 is an illustration of the state in which the photoresist in Figure 8 has been removed. An explanatory diagram of a state in which a through hole is opened by etching, Fig. 10 is an explanatory diagram of a state in which a thin copper film is formed in a through hole, and Fig. 11 is an explanatory diagram of a state in which a thin copper film is formed in a film for bumps. Figure 12 is an explanatory diagram of a state in which a photoresist is provided, Figure 12 is an explanatory diagram of a state in which a bump is formed in a through hole, and Figure 13 is an explanatory diagram of a state in which a photoresist is removed from a bump film on which bumps are formed. Figure 14 is an explanatory diagram of the state where the thin retina has been removed by etching, Figure 15 is an explanatory diagram of the state where the copper film on the bump film has been removed by etching, and Figure 18 is an explanatory diagram of the state where the bumped IC chip is directly attached. Explanatory diagram when mounting on a wiring board, Figure F is a partially enlarged perspective view of Figure 16, Figures 18 to 2
FIG. 0 is an explanatory diagram of a conventional IC chip mounting structure. 3...IC chip 4...Connection terminal lO
...Carrier film (electronic component mounting member) 10a
...Opening edge 11...Device hole (IC chip mounting hole) 12...
・Wiring pattern 12a...Lead terminal (conducting tip) 13...Bump film 14...Bump (4 electric bodies) 21...Wiring board 23...Wiring pattern Fig. 3 Fig. 4 5Figure 6Figure 7Figure 2Figure 8Figure 1OFigure 111!1Figure I4Figure 12Figure 13Figure 15Figure 18Figure 19Figure 20

Claims (1)

[Claims] The conductor is provided with a plurality of bonding connection terminals and a bump film in which through holes corresponding to the number of the connection terminals are opened, and one end of which is conductively connected to the wiring pattern of the electronic component mounting member. An IC chip with a bump, characterized in that the conductor is held in a through hole, and the other end of the conductor is electrically connected to the connection terminal.