JPH02265257A - Housing container of ic wafer - Google Patents

Abstract

PURPOSE:To prevent a wafer from being contaminated by a method wherein a specific resin is used for a housing container of an IC wafer. CONSTITUTION:A high nitrile resin whose content of an unsaturated nitrile monomer is 50weight% or higher is molded. The high nitrile resin is a copolymer which is composed mainly of the unsaturated nitrile monomer such as acrylonitrile, methacrylonitrile or the like; styrene, butadiene, isoprene or the like can be enumerated as a monomer which can be copolymerized with the unsaturated nitrile monomer; one or more kinds of them are copolymerized with the unsaturated nitrile monomer. Thereby, a chemical-resistant property can be enhanced; it is possible to prevent a swelling by a solvent from being caused and an IC wafer from being contaminated.

Description

[Detailed Description of the Invention] Field of Industrial Application] The present invention relates to an IC wafer storage container, and more particularly, to an IC wafer storage container that has excellent chemical resistance and does not contaminate the IC wafers. .

[Conventional technology]

Conventionally, IC wafers (hereinafter referred to as uni-bars) oxidize during storage or transportation, so they are re-polished and cleaned with a solvent such as acetone, trichlene, or isopropyl alcohol.

After drying with hot air, it is stored in containers made of polyethylene, polypropylene, etc. and transported to the next process.

[Problem that the invention seeks to solve]

However, solvents such as acetone, trichlene, and isopropyl alcohol are difficult to be completely blown away by hot air drying, and remain on the wafer and adhere to the storage container. Conventional storage containers made of polyethylene and polypropylene swell due to adhering solvent.

In the part swollen by the solvent, the solvent remains, and furthermore,
Substances soluble in the solvent leach from the resin. When such a container is used to store wafers, the problem of contaminating the wafers after drying remains unsolved.

An object of the present invention is to provide an IC wafer storage container that has excellent chemical resistance and does not contaminate the IC wafers.

[Means for solving problems]

As a result of intensive studies to solve this problem, the present inventors discovered that by using a specific resin as a storage container for IC wafers, it is possible to prevent solvent from remaining and swelling, thereby preventing wafer contamination. , finally completed the present invention.

That is, in the present invention, the unsaturated nitrile monomer content is 5
This is a storage container for Ic wafers, characterized in that it is formed by molding a high-quality IJ resin having a content of 0% by weight or more.

The high nitrile resin used in the present invention is a copolymer mainly composed of unsaturated nitrile monomers such as acrylonitrile and methacrylate, and has an unsaturated nitrile monomer content of 5 offffffi% or more, preferably 55% by weight. This includes the above.

Monomers that can be copolymerized with unsaturated nitrile monomers include:
Examples include styrene, butadiene, isoprene, methyl acrylate, ethyl acrylate, methyl methacrylate, and ethyl methacrylate, and one or more of these are copolymerized with an unsaturated nitrile monomer.

Further, examples of the high nitrile resin include butadiene-acrylonitrile copolymer, inbrene-acrylonitrile copolymer 5-butadiene-styrene copolymer, polybutadiene, a mixture of the above-mentioned copolymers with rubber-like polymers such as polyisoprene, and the like. It is also possible to use a product obtained by graft polymerizing an unsaturated nitrile monomer and the above copolymerizable monomer in the presence of a rubbery polymer. In particular, the acrylonitrile monomer content is 50% by weight or more, and a mixture of a large amount of acrylonitrile monomer and a monomer copolymerizable with the acrylonitrile monomer is prepared in the presence of a conjugated diene synthetic rubber. The product manufactured by polymerizing with
It is preferable because it has a good balance of properties and has good chemical resistance.

It should be noted that if the unsaturated nitrile monomer content is less than 50% by weight, chemical resistance tends to be insufficient and the container tends to swell, which is not preferable.

The storage container used in the present invention is manufactured by vacuum forming, pressure forming, etc. a sheet obtained by forming the above-mentioned high nitrile resin by a conventional T-die extrusion method, calendar method, inflation method, etc. Moreover, it can also be manufactured by directly injection molding the above resin. High nitrile resins can be easily deep-drawn, and containers of various shapes, such as circles, squares, hexagons, etc., can be easily obtained.

The thickness of the wall of the storage container of the present invention varies depending on the content, required strength, etc., but is usually 0.05 to 5I+lff1, preferably 0.1 to 1 m. 0.05m
If it is less than 51 m, the rigidity will be insufficient, and although it may be more than 51 m, it is not preferable because it will result in poor workability and increase in cost.

〔Example〕

The present invention will be explained below with reference to Examples.

Example I High nitrile resin (acrylonitrile A sheet with a thickness of 0.7 mm was obtained by an extrusion method.

This sheet was vacuum formed to produce a storage container with a depth of 15 cm+*. Add this container to acetone at 23°C as a cleaning solvent.
A 4-inch mirror wafer was immersed in C for 2 weeks, and then a 4-inch mirror wafer was placed in the container, and 30 minutes later, the wafer was examined for dust adhesion and oxidation. The measurement results of the amount of dust attached are shown in Table 1, and the oxidation evaluation results are shown in Table 2.

Example 2 Example 1 was repeated except that trichlene was used as the solvent. The results are shown in Tables 1 and 2.

Example 3 70 parts by weight of acrylonitrile and 15 methyl methacrylate in the presence of 10 parts by weight of a butadiene-acrylonitrile rubbery polymer (WL containing butadiene 80% by weight) as a resin.
A high nitrile resin (acrylonitrile content of about 65% by weight,
By nitrogen analysis. ) was repeated except that Example 1 was used.

The results are shown in Tables 1 and 2.

Comparative Example 1 Example 1 was repeated except that regular polyethylene was used as the resin. The results are shown in Tables 1 and 2.

Comparative Example 2 Comparative Example 1 was repeated except that trichlene was used as the solvent. The results are shown in Tables 1 and 2.

Comparative Example 3 Example 1 except that ordinary polypropylene is used as the resin
repeated. The results are shown in Tables 1 and 2.

Table 1 Amount of dust deposited on wafer surface Measured in a clean room with a cleanliness rating of 2 class 1000.

:Hitachi Engineering laser surface inspection device + 1LD300B measurement device Table 2 Wafer surface oxidation measurement results [Effects of the invention] The IC wafer storage container of the present invention has excellent chemical resistance, does not swell with solvents, and prevents contamination of the IC wafer. prevented,
It will greatly contribute to the work efficiency amplifier of IC manufacturers.

Patent applicant: Mitsui Toatsu Chemical Co., Ltd. The numerical value indicates the area of the spectrum of each element.

Measurement conditions equipment = VG company ESCA Luha B, ToK If X-ray source: Mg-α X-ray output crab 300W

Claims (1)

[Claims] 1. An IC characterized by being formed by molding a high nitrile resin having an unsaturated nitrile monomer content of 50% by weight or more.
Wafer storage container. 2. Claim 1, wherein the high nitrile resin is produced by polymerizing a mixture of an acrylonitrile monomer and a monomer copolymerizable with the acrylonitrile monomer in the presence of a conjugated diene synthetic rubber. IC wafer storage container.