JPH02265719A - Wafer and die therefor - Google Patents

Abstract

PURPOSE:To dispense with a post-process, to enhance a tight-seal degree to a large extent and to reduce total cost by mounting the first wafer part having a hole molded by punching the press member supporting a terminal at the time of molding and the second wafer part integrally molded along with the first wafer part and closing said hole. CONSTITUTION:The first wafer part 11 is integrally molded along with a terminal 10. The first wafer part 11 is formed into a box shape opened downwardly and the terminal 10 is embedded in the top part 12 thereof. The terminal 10 is formed so that the under surface thereof is exposed to the inner top surface of the first wafer part 11. When the first wafer part 11 is integrally molded, recessed parts 13 generated by removing a positioning member are formed to the upper and under surfaces of the terminal 10. The second wafer part 14 is molded on the upper surface of the first wafer part 11 so as to close the recessed part 13 on the upper surface side of the terminal 10 to be integrated with the first wafer part 11. Therefore, post-processing for closing a hole is unnecessary and total cost is reduced and a tight-seal degree is enhanced to a large extent.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a wafer and a mold for molding the same, and in particular to a wafer suitable for closing a hole in a holding bottle that positions a hoop material in a cavity during molding. and its molding die.

[Conventional technology]

Fig. 7 shows a conventional wafer. In Fig. 7, 1 is a terminal. This terminal 1 is formed into a hoop shape, and a frame 2 is provided on this terminal l by integrally molding synthetic resin. It is being

A method for manufacturing a wafer configured in this manner will be described next. The hoop material having the terminal l is conveyed into the injection mold, the movable side mold plate and the fixed side mold plate are closed, and molten resin is injected into the cavity. After solidification, the mold is removed and the mold is removed. Obtain a wafer as shown.

[Problem to be solved by the invention]

By the way, in the prior art, it is necessary to position the terminal 1 within the cavity during injection molding, and therefore the presser pin 3 is brought into contact with the terminal 1.

Therefore, when the wafer is released from the mold, the holes 4 for the presser pins 3 are formed, so when cleaning is performed to remove adhesives attached to the wafer mounted on a printed circuit board, for example, the cleaning solution is removed as shown in FIG. Hole 4 as shown by arrow A
The particles entered the frame 2, causing contact failure and contact deterioration.

In order to prevent this, post-processes such as coating with synthetic resin or applying adhesive are required to close the holes 4 of the presser pins 3, which requires many steps and increases costs.
In addition, there was a possibility that the sealing degree would not be sufficient due to incomplete coating.

The present invention has been made to solve the problems of the prior art described above, and its purpose is to provide a wafer that does not require post-processing, has significantly improved sealing, and can reduce total cost. and to provide a mold for the same.

[Means to solve the problem]

In order to achieve the above object, the wafer according to the present invention includes:
a first wafer part that is integrally molded with the terminal and has a hole that is molded by removing a presser member that supports the terminal during molding; The wafer mold according to the present invention also includes a second wafer portion that closes the wafer portion.
a fixed side mold plate, a movable side mold plate that can freely move toward and away from the fixed side mold plate, and a cavity provided at a joint surface between the movable side mold plate and the fixed side mold plate and into which molten resin is injected; a presser member that positions the hoop material in the cavity by abutting against a hoop material interposed between the fixed side mold plate and the movable side mold plate when the mold is closed, and injects molten resin into the cavity. In a wafer molding die in which resin is solidified and integrally molded onto the hoop material and taken out, the upper surface of the cavity is defined with respect to the lower surface portion of the cavity of the movable template that defines the lower surface of the cavity. A plurality of cavity upper surface portions of the fixed side mold plate are provided, a first wafer portion is molded in a first cavity defined by the cavity lower surface portion and the first cavity upper surface portion, and the first wafer portion is formed in the first cavity. The second wafer portion is molded in a second cavity defined by making the upper surface portion of the second cavity face the lower surface portion of the cavity instead of the upper surface portion, and the presser portion generated when molding the first wafer portion is removed. The second wafer portion is configured to close a hole in the member.

[Effect]

By the above means, the second wafer part is molded integrally with the first wafer part in which the punching hole of the holding member for positioning the terminal during molding is formed, so that the second wafer part is integrated with the first wafer part. The hole will be filled and blocked.

Therefore, there is no need for post-processing to close the holes, reducing the total cost and significantly improving the degree of sealing.

In addition, the cavity of the movable template is common when molding the first wafer part and the molding of the second wafer part, and only the cavity of the stationary template is replaced, so mold costs and processing costs can be reduced. .

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

Fig. 1(a), crest) is a cross-sectional view showing the primary forming and secondary forming of the wafer according to the present invention, Fig. 2 is a front view schematically showing the overall configuration, and Fig. 3 is a vertical cross-section. 4(a) to Tf) are schematic sectional views showing each process of molding, and FIG.
a) and (b) are schematic plan views corresponding to FIGS. 4(a) and (d), and FIG. 6 is a process chart showing the forming process.

In FIG. 1 Tbl, 10 is a hoop-shaped terminal, and a first wafer portion 11 is integrally molded on this terminal 10. In FIG. This first wafer part 11 is formed into a box shape with an open bottom surface, and a terminal 10 is provided on the top part 12 of the first wafer part 11.
is buried. The lower surface of this terminal 10 is formed so as to be exposed on the inner top surface of the first wafer portion 11. Furthermore, when the terminal IO is integrally molded onto the first wafer part 11, it needs to be positioned within the cavity of the molding die, and therefore, there are recesses 13 on the upper and lower surfaces of the terminal IO, which are created by removing the positioning member. do. The r side of the terminal 10 (
In FIG. 1(b)), the first
A second wafer section 14 is formed on the upper surface of the wafer section 11 and is integrated with the first wafer section 11 .

Next, a mold for manufacturing the above-mentioned wafer will be explained.

In Figures 2 and 3, the reference numeral 15.16 collectively indicates the fixed side mold and the movable side mold, Ll is the mold opening surface for taking out the product X, and Lt is the unnecessary resin. Each figure shows the mold opening surface for removing Y.

The fixed side mold 15 includes a fixed side mounting plate 17 and a runner forming plate member 1B integrally fixed to this fixed side mounting plate 17.
, a fixed side mold plate 19, etc., which can be freely moved toward and away from the fixed side mounting plate 17 and the runner forming plate member 18 by a predetermined amount and slidable in a direction orthogonal to the direction of coming and going. The stationary mold 15 has an injection port 21 to which a nozzle 20 of an injection machine is attached.
is formed, and the tip of the nozzle 20 communicates with a runner 22 provided on the lower surface of the runner forming plate member 18. Further, the fixed side template 19 is composed of a guide plate 23 and a slide cavity 24 that is supported by the guide plate 23 and performs the above-mentioned sliding. This guide plate 23 and slide cavity 24
In the mold closed state shown in FIG. 3, the runner 22 is
A spool 25 is formed which communicates with the cavity 26 through a bin gate. That is, on the lower surface side of the slide cavity 24, there is a first cavity upper surface portion 27 that defines one surface of the product X.
, and the second cavity upper surface portion 28 are formed alternately.

Reference numeral 29 denotes an undercut notch provided in the runner forming plate member 18, which communicates with the runner 22 in the mold closed state, and as shown in the fourth (a1), the resin enters the notch 29. Then, when the mold opening surface for removing the unnecessary resin Y, which will be described later, is opened, the unnecessary resin Y is pushed to the runner forming plate member 18 side by the biting force of the resin in the notch 29. This notch 29 can be made considerably larger than the runner 22, and even if the resin stretches, it will not affect the holding force, so it can exert a large holding force on the unnecessary resin Y. It is now possible to have

30 is an air cylinder, and a drive shaft 30a of this air cylinder 30 passes through the guide plate 23 and is fixed to the slide cavity 24. By operating this air cylinder 30, the slide cavity 24 can be freely slid along the guide groove 23a of the guide plate 23. Note that the air cylinder 30 is attached to the guide plate 23, and the air cylinder 30 is attached to the guide plate 23.
3.

31 is an unnecessary resin Y provided on the fixed side mounting plate 17.
This is an eject mechanism for extrusion and separation, and includes a reciprocating plate 32 operated by an appropriate drive source such as an air cylinder, an eject bin 33 fixed to the reciprocating plate 32, and a support bin 34. The tip of the eject bin 33 is arranged to be flush with the upper bottom surface of the notch 29 when the mold is closed.

35 is a cavity positioning bin provided in the movable mold 16, and the tip of this cavity positioning bin 35 is
It is inserted into a positioning hole 36 bored in the slide cavity 24. Therefore, the slide cavity 24 is accurately positioned with respect to the movable mold plate 37 of the movable mold 16 when the mold is in the closed state.

The movable side mold 16 includes a movable side mounting plate 38, a smoothing block 39 that is integrally fixed to the movable side mounting plate 38,
The spacer block 39 includes a movable template 37, an ejector plate 40, an ejector lock plate 41, etc. which are integrally fixed to the spacer block 39. A cavity lower surface portion 42 defining the other side of the product The mold plates 19 are brought into close contact to form a cavity 26.

This cavity 26 has two types of shapes in this embodiment. That is, as described above, the first and second cavity upper surface portions 27 and 28 are provided as the cavity upper surface portion of the fixed side mold plate 19 corresponding to one cavity lower surface portion 42 of the movable side mold plate 37. Primary molding is performed by the cavity defined by the first cavity upper surface portion 27 and the cavity lower surface portion 42. Then, the slide cavity 24 is slid with respect to the cavity lower surface section 42 so that the second cavity upper surface section 28 faces instead of the first cavity upper surface section 27 . Secondary molding is performed by a cavity defined by the second cavity upper surface portion 28 and the upper surface of the first wafer portion 11 formed by the primary molding. This secondary molding embeds the punched-out marks of the positioning member remaining after the primary molding, thereby improving the sealing performance.

43 is a pilot bin, and this pilot bin 43 is
It is inserted into the positioning hole of the hoop material conveyed between the movable side template 37 and the fixed side template 19, and positions the hoop material with respect to the cavity. This hoop material has a large number of terminals 10 arranged in series, and is fed out by a feeding device 44 shown in FIG. 2. This hoop material is being conveyed in a direction perpendicular to the plane of the paper in FIG.
is set so that it can slide.

Both side edges of the hoop material are positioned by hoop material guide plates 45. This hoop material guide plate 45
is attached to the movable template plate 37.

Although not shown in the ejector plate 40, the product
An ejector bin for ejection is fixed, and this ejector bin penetrates the movable template 37 of the member 2.
4, and in the mold closed state, the tip end surface of the ejector pin forms a part of the cavity lower surface part 42, so that the top surface side main plane of the movable side mold plate 37 and the plane-height It is positioned in the It goes without saying that the number of ejector bins is set to correspond to each product X.

46 is a guide plate support bin; 47 is a positioning bin provided on the movable side mold plate 37; this positioning bin 47 is elastically installed with respect to the guide plate support bin 46;
It is adapted to be engaged with the positioning groove 6.

Next, a molding method using the molding die configured as described above will be explained based on FIGS. 4 to 6.

First, primary molding is performed. During this primary molding, as shown in FIG. It is necessary to position the terminal 10 of the hoop material within the cavity, and for example, a presser pin is provided on the upper surface portion 27 of the first cavity. At times, melted resin is filled into the cavity from the nozzle 20 of the injection machine via the runner 22, spool 25, and bin gate.
As shown in FIG. 1, it is divided into two forked shapes and communicated with two cavities, so there are two cavities.

The injected resin is integrally molded with the terminal 10 inside the cavity, and the first wafer part 11 shown in FIG. 1(a) is molded.

The wafer in this primary molding has traces left by the positioning member for positioning the terminal 10 within the cavity. Further, the remaining resin in the mold among the injected resin becomes unnecessary resin Y.

From this state, the movable mold 16 begins to move downward in the drawing by a drive source (not shown). Due to this movement of the movable mold 16, the mold opening surface for taking out the product X begins to open, and the resin in the mold is cut at the fragile pin gate portion, separating the product X and unnecessary resin Y. . Then, the movable mold 16 further moves downward, the fixed mold plate 19 also moves, and the mold opening L2 for removing the unnecessary resin Y begins to open.

During this opening operation of the mold opening surface L1, the unnecessary resin Y is held at a portion of the runner by the resin in the notch 29 of the runner forming plate member 18 with a considerably strong holding force. It is separated from the stationary template 19 while being in close contact with the runner forming plate member 18 side. Subsequently, the movable mold 16 continues to move downward,
When the mold opening surface L2 opens a predetermined mold, the eject mechanism 31 operates to move the eject bin 33 downward. As a result, the unnecessary resin Y in the notch 29 is extruded from the runner forming plate member 18 and
The unnecessary resin Y is separated from the resin Y and taken out by appropriate means (
In FIG. 4(bl), the unnecessary resin Y is taken out by inserting a packet in the middle of the mold opening, stopping the mold opening halfway, and dropping the unnecessary resin Y into the packet. In this way, the series of mold opening steps is completed and primary molding is performed.

Next, secondary molding is performed. This secondary forming is shown in Figure 4 (b
Slide cavity 24 from position l to air cylinder 3
0 and slide it to the left.

Due to this sliding movement, as shown in FIG. 4 (C1), the cavity upper surface portion of the slide cavity 24 facing each cavity lower surface portion 42 of the movable side mold plate 37 becomes the first cavity upper surface portion 27 during primary molding. 28. Therefore, during secondary molding, the cavity is defined by the second cavity upper surface 28 and the cavity lower surface 42.

The movable mold 16 is moved upward from the state shown in FIG. 4(C) to the closed state shown in FIG. 4(d). In the state shown in FIG. 4(d), the runner 22 and the second cavity upper surface part 2
The spool 25 of the first cavity upper surface 27 is in communication with the spool 25 of the first cavity upper surface 27 (FIG. 5(b)). In the state shown in FIG. 4(d), the wafer from the primary molding remains in the cavity, and in this state, the same type of melted resin from the primary molding flows from the nozzle 20 again to the runner 22, spool 25, and bin gate. It is then filled into a cavity for secondary molding. By this filling, the second wafer part 14 is integrally molded by closing the punched area of the first wafer part 1, and the sealing performance is improved.

From this state shown in FIG. 4(d), the mold is opened in the same way as the mold opening in the above-mentioned primary molding, and as shown in FIG. 4(e), the unnecessary resin Y is separated from the runner molding plate member 18, and the packet is Take it out.

On the other hand, separation of unnecessary resin Y from the mold during secondary molding
Since the eject plate 40 is pushed out by an ejecting device (not shown) before and after taking out, the product
is ejected and separated from the movable mold plate 37 by an eject bin, and the product X is taken out by an appropriate means (FIG. 4(f)).

In this way, a series of mold opening steps is completed, secondary molding is completed, and a wafer as shown in FIG. 1 (bl) is obtained.

〔Effect of the invention〕

As described above, according to the present invention, there is no need for post-processes such as applying adhesive, the degree of sealing is significantly improved, and the total cost can be reduced.

[Brief explanation of drawings]

1 to 6 show examples of the present invention. Figure 2 is a front view schematically showing the overall configuration, Figure 3 is a vertical sectional view, Figure 4 (al or f) is a schematic sectional view showing each molding process, and Figure 5 (
a) and (bl) are plan views schematically corresponding to FIGS. 4(a) and (d), FIG. 6 is a process chart showing the molding process, and FIG.
The figure is a longitudinal cross-sectional view of a conventional wafer. 10... terminal, 11... first wafer part, 14... second wafer part, 15...
...Fixed side mold, 16...Movable side mold, 24
. . . Slide cavity, 27 . . . First cavity upper surface portion, 28 . . . Second cavity upper surface portion, 42 . . . Cavity lower surface portion. 11L Figure (b) Figure Figure 5 Figure 5 (b) Figure

Claims (2)

[Claims] (1) A terminal, a first wafer part that is integrally molded with the terminal and has a hole that is formed by removing a presser member that supports the terminal during molding; and a second wafer portion that closes the hole. (2) A fixed-side template, a movable-side template that can freely move toward and away from the fixed-side template, and a joint surface between the movable-side template and the fixed-side template, and inject molten resin. a cavity, and a holding member that positions the hoop material in the cavity by abutting against the hoop material interposed between the fixed side mold plate and the movable side mold plate when the mold is closed; In a wafer molding die in which a resin is injected and solidified, the resin is integrally molded on the hoop material, and the resin is taken out, the upper surface of the cavity is lower than the lower surface of the cavity of the movable template that defines the lower surface of the cavity. A plurality of cavity upper surface portions of the fixed side template are provided, and a first wafer portion is molded in a first cavity defined by the cavity lower surface portion and the first cavity upper surface portion,
Molding the second wafer part in a second cavity defined by having a second cavity top face opposed to the cavity bottom face in place of the first cavity top face, and molding the first wafer part. A wafer molding die, characterized in that the second wafer part closes a hole formed in the holding member.