JPH02267979A - Manufacturing method of magnetoelectric conversion element - Google Patents
Manufacturing method of magnetoelectric conversion elementInfo
- Publication number
- JPH02267979A JPH02267979A JP1088540A JP8854089A JPH02267979A JP H02267979 A JPH02267979 A JP H02267979A JP 1088540 A JP1088540 A JP 1088540A JP 8854089 A JP8854089 A JP 8854089A JP H02267979 A JPH02267979 A JP H02267979A
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- film
- insb
- mobility
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000006243 chemical reaction Methods 0.000 title description 3
- 238000010438 heat treatment Methods 0.000 claims description 51
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 claims description 25
- 230000001681 protective effect Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 17
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
Landscapes
- Hall/Mr Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は磁電変換素子の製造方法に関し、具体的にはI
nSb膜の移動度を向上させるための技術に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a method for manufacturing a magnetoelectric transducer, and specifically relates to a method for manufacturing a magnetoelectric transducer, and specifically
This invention relates to a technique for improving the mobility of nSb films.
1nSbgの移動度を向上させるための技術としては、
従来より次のような方法が知られている。As a technology to improve the mobility of 1nSbg,
Conventionally, the following methods are known.
これは、三温度法によって基板の表面にIn5biを形
成した後、このInSb膜の上にSiO□とSiNから
なる絶縁膜を形成してInSb膜を被覆させ、大気圧の
下において300℃以上の熱処理温度で長時間(5時間
以上)熱処理を行うものである。After forming In5bi on the surface of the substrate by the three-temperature method, an insulating film made of SiO□ and SiN is formed on the InSb film to cover the InSb film. Heat treatment is performed at a heat treatment temperature for a long time (5 hours or more).
上記のような熱処理方法によれば、InSb膜の移動度
を向上させることができるが、この方法には以下のよう
な欠点があった。According to the above heat treatment method, the mobility of the InSb film can be improved, but this method has the following drawbacks.
この熱処理方法では、300℃以上という比較的高い熱
処理温度で熱処理を施さなければならないので、In5
blの上に電極を形成した後にInSb膜の上に絶縁膜
を形成して熱処理を施すと、熱膨張係数の差により電極
とInSb/Ilとの間に亀裂が発生し、断線を生じる
という問題がある。この問題を避けるためには、上記の
ような熱処理を施した後にInSb膜の上に電極を形成
する必要があるが、熱処理後にはInSb膜は絶縁膜に
よって覆われているので、熱処理後に絶縁膜をInSb
膜から剥離する必要があり、この剥離作業が困難であっ
た。In this heat treatment method, heat treatment must be performed at a relatively high heat treatment temperature of 300°C or higher, so In5
If an insulating film is formed on the InSb film and heat treated after forming an electrode on the BL, cracks will occur between the electrode and the InSb/Il due to the difference in thermal expansion coefficients, resulting in disconnection. There is. In order to avoid this problem, it is necessary to form an electrode on the InSb film after the heat treatment as described above, but since the InSb film is covered with an insulating film after the heat treatment, the insulating film cannot be formed after the heat treatment. InSb
It was necessary to peel it off from the film, and this peeling work was difficult.
また、熱処理時間が5時間以上と比較的長いので、量産
には不向きであった。Further, since the heat treatment time is relatively long, 5 hours or more, it is not suitable for mass production.
しかして、本発明は上記従来方法の欠点に鑑みてなされ
たものであり、その目的とするところは比較的低い熱処
理温度で、かつ比較的短い時間の熱処理でInSb膜の
移動度を向上させることのできる方法を見い出し、上記
のような問題を解決することにある。The present invention has been made in view of the drawbacks of the conventional methods described above, and its purpose is to improve the mobility of an InSb film by heat treatment at a relatively low temperature and for a relatively short time. The goal is to find ways to solve problems such as those mentioned above.
このため、本発明の磁電変換素子の製造方法は、基板表
面に形成されたInSb膜の上にSOG塗布法によって
保護膜を回転塗布し、220〜260℃の熱処理温度で
90分間以上熱処理を施すことを特徴としている。For this reason, the method for manufacturing a magnetoelectric transducer of the present invention includes spin-coating a protective film on the InSb film formed on the surface of the substrate using the SOG coating method, and performing heat treatment at a heat treatment temperature of 220 to 260°C for 90 minutes or more. It is characterized by
本発明は、InSb膜の上に絶縁層を形成して熱処理を
施すことによりInSb膜の移動度を増加させ、磁電変
換素子の磁気感度をより高感度にすることができる。し
かも、SOG (スピン・オン・グラス)法によって形
成された保護膜を用いて220〜260℃の比較的低い
熱処理温度で熱処理を施すことができるので、InSb
膜の上に電極を形成した後に熱処理を施してもInSb
膜と電極との間に亀裂の発生などがない。したがって、
熱処理後に保護膜をI n5bpから剥離する必要がな
くて磁電変換素子の製造工程を簡略化することができ、
さらに熱処理後も保護膜を残しておくことによりrns
b膜及び電極の保護用として用いることができる。The present invention can increase the mobility of the InSb film by forming an insulating layer on the InSb film and subjecting it to heat treatment, thereby increasing the magnetic sensitivity of the magnetoelectric transducer. Moreover, heat treatment can be performed at a relatively low heat treatment temperature of 220 to 260°C using a protective film formed by the SOG (spin-on-glass) method.
Even if heat treatment is performed after forming electrodes on the film, InSb
There are no cracks between the membrane and the electrode. therefore,
There is no need to peel off the protective film from In5bp after heat treatment, and the manufacturing process of the magnetoelectric transducer can be simplified.
Furthermore, by leaving a protective film even after heat treatment,
It can be used to protect b-films and electrodes.
さらに、SOG法によって形成された絶縁層を用いるこ
とにより熱処理時間を90分間以上、例えば90〜12
0分程度に短くすることができるので、磁電変換素子の
量産性にも優れている。Furthermore, by using an insulating layer formed by the SOG method, the heat treatment time is 90 minutes or more, for example, 90 to 12 minutes.
Since the time can be shortened to approximately 0 minutes, it is also excellent in mass production of magnetoelectric conversion elements.
以下、本発明の実施例を添付図に基づいて詳述する。 Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
第1図に示すように、鏡面研磨したNi−Znフェライ
ト基板lの表面にAQ20.絶縁膜6を形成し、基板温
度を480〜520℃に保って蒸着速度比(In :S
b=>1:3ないし1;4で絶縁膜6の上にInSb膜
2を蒸着させる。このInSb膜2をエツチングしてホ
ール素子4を形成し、ホール素子4に電極5を形成した
後、ホール素子4及び電極5の上から東京応化製OCD
TYPE2(#59000)をSOG法によって回転
塗布し、保護膜3を形成した。As shown in FIG. 1, AQ20. An insulating film 6 is formed, the substrate temperature is maintained at 480 to 520°C, and the deposition rate ratio (In:S
An InSb film 2 is deposited on the insulating film 6 at a ratio of b=>1:3 to 1:4. After etching this InSb film 2 to form a Hall element 4 and forming an electrode 5 on the Hall element 4, an OCD manufactured by Tokyo Ohka Co., Ltd.
TYPE 2 (#59000) was spin-coated by the SOG method to form a protective film 3.
この試料に対し熱処理温度及び熱処理時間を変化させて
N2雰囲気(0〜6%の0□を含んでいてもよい、)中
で熱処理を施し、各々について移動度及びキャリア密度
の変化を測定したところ、第2図(aHb)及び第3図
(a>(b)のような結果を得た。第2図(a)(b)
は、熱処理時間を2時間として熱処理温度をほぼ150
℃から300℃まで変化させた場合の移動度の変化率Δ
μ(X)とキャリア密度の変化率Δn (%)を示して
いる。第2図(a)より明らかなように、移動度は22
0℃と 260℃の間で極大となっている。一方、第2
図(b)に示すように、この温度範囲(220〜260
℃)においてはキャリア濃度はほとんど変化を示さない
、又、第3図(a)(b)は、熱処理温度を250℃と
して熱処理時間を120分まで変化させた場合の移動度
の変化率Δμ(X)とキャリア密度の変化率Δn (X
)を示している。This sample was heat-treated in an N2 atmosphere (which may contain 0 to 6% 0□) by varying the heat treatment temperature and heat treatment time, and the changes in mobility and carrier density were measured for each. The results shown in Figure 2 (aHb) and Figure 3 (a>(b) were obtained. Figure 2 (a) (b)
The heat treatment time was 2 hours and the heat treatment temperature was approximately 150℃.
Rate of change in mobility Δ when changing from °C to 300 °C
It shows μ(X) and the rate of change in carrier density Δn (%). As is clear from Figure 2(a), the mobility is 22
The maximum temperature is between 0°C and 260°C. On the other hand, the second
As shown in figure (b), this temperature range (220-260
℃), the carrier concentration shows almost no change, and Figures 3(a) and 3(b) show the rate of change in mobility Δμ( X) and carrier density change rate Δn (X
) is shown.
第3図(a)に示すように、熱処理時間が90分までは
移動度が増加を続けるが、熱処理時間が90分以上にな
ると移動度は最大値に達して以後増加傾向は認められな
い、一方、第3図(b)に示すように、熱処理時間が長
くなると、キャリア密度は漸増傾向を示すが、熱処理時
間が90分を越えると増加率は緩やかになっている。従
って、この実験に基づけば、SOG法によって保護膜を
回転塗布されたInSb膜は、熱処理温度220〜26
0℃、熱処理時間90分以上(好ましくは90〜180
分)の条件下で熱処理を施すことにより、キャリア濃度
を大きく変化させることなく移動度を20%近く増加さ
せられることが明らかとなった。よって、比較的低い熱
処理温度で、しかも短い熱処理時間で移動度を高めるた
めの熱処理を行うことができる。なお、この熱処理工程
は、保護膜の形成工程と兼ねることができる。また、熱
処理温度は300℃以下であり、雰囲気ガスもN2ガス
で十分であるので、熱処理には通常のクリーンオーブン
を使用することができる。As shown in FIG. 3(a), the mobility continues to increase until the heat treatment time reaches 90 minutes, but when the heat treatment time exceeds 90 minutes, the mobility reaches its maximum value and no increasing trend is observed after that. On the other hand, as shown in FIG. 3(b), as the heat treatment time increases, the carrier density shows a gradual increasing tendency, but when the heat treatment time exceeds 90 minutes, the rate of increase becomes gradual. Therefore, based on this experiment, the InSb film spin-coated with a protective film by the SOG method was heat-treated at a temperature of 220 to 26°C.
0°C, heat treatment time 90 minutes or more (preferably 90-180
It has been revealed that by performing heat treatment under the conditions of 200 min), the mobility can be increased by nearly 20% without significantly changing the carrier concentration. Therefore, heat treatment for increasing mobility can be performed at a relatively low heat treatment temperature and in a short heat treatment time. Note that this heat treatment step can also serve as a protective film forming step. Further, since the heat treatment temperature is 300° C. or lower and N2 gas is sufficient as the atmospheric gas, a normal clean oven can be used for the heat treatment.
(第−例)
鏡面研磨されたNi−Znフェライト基板の上に三温度
法によってInSbの蒸着膜を形成した。この時の基板
の温度は490℃で、Inとsbの蒸着速度比はに3な
いしl:4で一定の比率とした。こうして得られたIn
Sb膜の上に東京応化製OCD TYPE2(#590
00)をSOG法によって回転塗布した。この後、N2
雰囲気中で90℃、30分→150℃、30分−250
℃、2時間と予熱工程を経て熱処理を行った。(Example 1) An InSb vapor deposition film was formed on a mirror-polished Ni--Zn ferrite substrate by a three-temperature method. The temperature of the substrate at this time was 490° C., and the deposition rate ratio of In and sb was kept at a constant ratio of 1:3 to 1:4. In thus obtained
Tokyo Ohka OCD TYPE2 (#590
00) was spin-coated by the SOG method. After this, N2
90℃, 30 minutes in atmosphere → 150℃, 30 minutes -250
Heat treatment was performed through a preheating step at ℃ for 2 hours.
この結果、InSb膜の移動度は、熱処理前に25 、
000cm”/V−secテあったのが、熱処理後には
30 、000cm 2/v−気へと増加し、20%近
く移動度が向上した。As a result, the mobility of the InSb film was 25,
After heat treatment, the mobility increased from 000 cm"/V-sec to 30,000 cm"/V-sec, resulting in an improvement of nearly 20%.
(第二例)
鏡面研磨されたNj−Znフェライト基板の上に三温度
法によってInSbの蒸着膜を形成した。この時の基板
の温度は490℃で、Inとsbの蒸着速度比は1:3
ないし1:4で一定の比率とした。ついで、このInS
b膜をフォトエツチング法によってエツチングしてホー
ル素子パターンを形成し、電極用金属とホール素子パタ
ーンの所定位置に蒸着させて電極を形成した。この後、
東京応化製OCD TYPE2(#59000)をI
nSb膜及びホール素子の上から基板全体にSOG法に
よって回転塗布した。この後、クリーンオーブン内にお
いてN2雰囲気(約6%の残留02を含む)中で90℃
、30分→150℃。(Second example) An InSb vapor deposition film was formed on a mirror-polished Nj-Zn ferrite substrate by a three-temperature method. The temperature of the substrate at this time was 490°C, and the deposition rate ratio of In and sb was 1:3.
A constant ratio of 1:4 was used. Next, this InS
The B film was etched by photoetching to form a Hall element pattern, and electrode metal was deposited on predetermined positions of the Hall element pattern to form electrodes. After this,
Tokyo Ohka OCD TYPE2 (#59000) I
The entire substrate was spin-coated over the nSb film and Hall element by the SOG method. After this, in a clean oven at 90°C in a N2 atmosphere (containing about 6% residual 02).
, 30 minutes → 150℃.
30分→250℃、2時間と予熱工程を経て熱処理を行
った。この結果、ホール電圧は、熱処理前に9011v
/v−KGであったのが、熱処理後には109mV/V
−KGへと増加した。さらに、不平衡電圧が±7mV以
下の素子の割合が全体の80%から85%に増大した。Heat treatment was performed through a preheating step of 30 minutes → 250° C. for 2 hours. As a result, the Hall voltage was 9011v before heat treatment.
/v-KG, but after heat treatment it became 109mV/V
-Increased to KG. Furthermore, the percentage of devices with an unbalanced voltage of ±7 mV or less increased from 80% to 85% of the total.
このように、不平衡電圧が小さくなると共にバラツキも
少なくなるので、良品率が向上する。さらに、環境試験
(特に、耐熱試験)での特性変化も小さくなった。また
、熱処理を施しても電極とIn5b膜の間に亀裂の発生
は見られなかった。したがって、I nSb膜と電極が
ガラス質の保護膜によって保護されたホール素子を得る
ことができた。In this way, the unbalanced voltage is reduced and the variation is also reduced, so the yield rate is improved. Furthermore, changes in characteristics during environmental tests (especially heat resistance tests) were also reduced. Further, even after heat treatment, no cracks were observed between the electrode and the In5b film. Therefore, it was possible to obtain a Hall element in which the InSb film and electrodes were protected by a glassy protective film.
本発明によれば、InSb膜の移動度を向上させること
ができ、磁電変換素子の磁気感度をより高感度化するこ
とができる。しかも、製造工程における熱処理温度を低
くできるので、電極をInSb膜の上に形成した後に保
護膜で覆って熱処理を施しても電極とInSb膜の間に
亀裂が生じることがなく良品率を向上させることができ
、熱処理後には保護膜を#I Mする必要がなくてIn
5bJliや電極の保護用として使用でき、製造工程も
簡略化することができる。さらに、熱処理時間も従来よ
り短くすることができ、量産性が向上する。According to the present invention, the mobility of the InSb film can be improved, and the magnetic sensitivity of the magnetoelectric transducer can be made higher. Moreover, since the heat treatment temperature in the manufacturing process can be lowered, even if the electrode is formed on the InSb film and then covered with a protective film and heat treated, no cracks will occur between the electrode and the InSb film, improving the yield rate. There is no need to #IM the protective film after heat treatment.
It can be used to protect 5bJli and electrodes, and the manufacturing process can be simplified. Furthermore, the heat treatment time can be made shorter than before, and mass productivity is improved.
第1図は本発明の磁電変換素子の一部を拡大した断面図
、第2図(a)(b)は熱処理温度を変化させた時の移
動度の変化率を示すグラフ及びキャリア濃度の変化率を
示すグラフ、第3図(aHb)は熱処理時間を変化させ
た時の移動度の変化率を示すグラフ及びキャリア濃度の
変化率を示すグラフである。
1・・・基板
2・・・InSb膜
3・・・保護膜
第1面
第
図
(a)
(b)
熱処理温度(’C)
第
図
(a)
(b)
熱処理時間(min>Figure 1 is an enlarged cross-sectional view of a part of the magnetoelectric conversion element of the present invention, and Figures 2 (a) and (b) are graphs showing the rate of change in mobility and the change in carrier concentration when the heat treatment temperature is changed. FIG. 3 (aHb) is a graph showing the rate of change in mobility and a graph showing the rate of change in carrier concentration when the heat treatment time is changed. 1... Substrate 2... InSb film 3... Protective film first side Figures (a) (b) Heat treatment temperature ('C) Figures (a) (b) Heat treatment time (min>
Claims (1)
布法によって保護膜を回転塗布し、220〜260℃の
熱処理温度で90分間以上熱処理を施すことを特徴とす
る磁電変換素子の製造方法。(1) A method for producing a magnetoelectric transducer element, which comprises spin-coating a protective film on an InSb film formed on a substrate surface by an SOG coating method, and subjecting it to heat treatment at a heat treatment temperature of 220 to 260°C for 90 minutes or more. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1088540A JPH02267979A (en) | 1989-04-08 | 1989-04-08 | Manufacturing method of magnetoelectric conversion element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1088540A JPH02267979A (en) | 1989-04-08 | 1989-04-08 | Manufacturing method of magnetoelectric conversion element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02267979A true JPH02267979A (en) | 1990-11-01 |
Family
ID=13945681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1088540A Pending JPH02267979A (en) | 1989-04-08 | 1989-04-08 | Manufacturing method of magnetoelectric conversion element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02267979A (en) |
-
1989
- 1989-04-08 JP JP1088540A patent/JPH02267979A/en active Pending
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