JPH0226872Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] Among various electronic components, the present invention is applicable to so-called leadless electronic components that do not have lead wires protruding from the main body, such as leadless diodes. This relates to a magazine for packing a plurality of magazines arranged in a line.

[Conventional technology]

Generally, when packing this type of leadless electronic component, semi-hard synthetic resin is used, as described in, for example, Japanese Utility Model Application Publication No. 57-161299, and as shown in Figures 1 and 2. A recess 2 having a planar rectangular shape is formed in a thin long tape 1 made of
After forming depressions at appropriate intervals in the longitudinal direction by vacuum forming or the like, and inserting one leadless electronic component 3 into each depression 2, a cover tape 4 is heat-sealed onto the top surface of the long tape 1. By pasting the tape, the recesses 2 are covered and packed (packing using the long tape 1 in this way is called taping), and the long tape 1 is reeled (not shown in the figure). At the same time, the electronic components 3 taped to the long tape 1 are taken out from each recess 2 of the long tape 1 and transferred to the electronic device. When attaching to a predetermined attachment point in , one end of the long tape 1 is fed out from the reel and the cover tape 4 affixed to the surface of the long tape 1 is sequentially peeled off from the long tape 1.
The electronic components 3 in each recess 2 are taken out.

[The problem that the idea aims to solve]

However, the conventional magazine here packs electronic components by pasting a cover tape onto a long tape, and takes out the electronic components by peeling the cover tape from the long tape. Since the tape and cover tape can only be used once and are so-called disposable, they are extremely uneconomical.

Furthermore, when attaching the cover tape to the long tape by heat welding, while the cover tape can be easily peeled off from the long tape, the cover tape should not be accidentally peeled off during handling such as transportation. Furthermore, the temperature must be strictly controlled, which requires a great deal of effort, which further increases the cost required for the pack.

The present invention eliminates the need to attach and peel off cover tape when packing and removing electronic components, as in the conventional method, in other words, the electronic components can be used repeatedly instead of being disposable. The purpose is to provide a magazine that can be manufactured at low cost.

[Means to solve the problem]

In order to achieve this object, the present invention provides at least one groove for accommodating electronic components on the surface of a disk-shaped substrate having an appropriate thickness, from a starting end at the outer periphery of the substrate to a terminal end at the center of the substrate. The starting end of the electronic component housing groove is opened on the outer circumferential surface of the substrate, and a cover plate is provided on the surface of the substrate so as to extend in a spiral shape toward the electronic component housing groove. The structure is such that it is installed so as to close the opening on the top surface of the board.

[Effect]

With this configuration, the spiral electronic component housing groove carved on the surface of the board is formed into a tunnel-shaped underdrain groove by the cover plate attached to the surface of the board, so that the electronic components can be stored easily. By feeding a large number of electronic components arranged in a line into the spiral electronic component housing groove from the opening on the outer circumferential surface of the board in the electronic component housing groove, a large number of electronic components can be inserted into the spiral electronic component housing groove. They can be packed in a line in a groove.

As described above, each electronic component packed in a line in the spiral electronic component housing groove on the board can be packed into the spiral electronic component housing groove without removing the cover plate on the surface of the board. They can be sequentially taken out one by one from the opening in the outer circumferential surface of the substrate in the groove, in a line-up state.

[Effect of idea]

Therefore, according to the present invention, unlike the conventional technique, it is not disposable and can be used repeatedly, and the cover plate on the surface of the substrate can be easily attached to a long tape as in the conventional technique. It is removable and does not need to be attached to prevent the cover tape from accidentally peeling off during handling such as transportation, and can be simply attached to the surface of the board, making it extremely easy to manufacture and inexpensive. This has the effect of significantly reducing the cost required for packaging electronic components.

〔Example〕

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.A magazine 10 according to the present invention includes a substrate 11 of an appropriate thickness formed in a disc shape from an appropriate material such as a hard synthetic resin, and a transparent synthetic resin film. and a cover plate 12 similarly formed into a disk shape.

On the upper surface of the board 11, a groove 13 for accommodating electronic components is formed to have a width and depth such that the leadless electronic components 3 are lined up in a row, and the groove 13 is formed from the starting end 14 on the outer periphery of the board 11. It is engraved so as to extend in a spiral shape to the end at the center,
A starting end 14 of the electronic component housing groove 13 is opened on the outer circumferential surface of the substrate 11 .

On the other hand, the cover plate 12 is stretched over the upper surface of the substrate 11 so as to close the opening of the spiral housing groove 13 to the upper surface of the substrate 11.

In this case, the cover plate 12 may be fixed to the substrate 11 by adhesive or the like;
It may also be configured to be detachably attached to the substrate 11, such as by attaching it to the substrate 11 with a plurality of screws.

The magazine 10 configured in this manner is attached to a vibrating parts feeder, and the leadless electronic components 3 are aligned in a line by a separately prepared alignment parts feeder, and fed out in a line from this alignment parts feeder. Electronic parts 3
are sequentially fed into the spiral electronic component accommodating groove 13 provided in the substrate 11 of the magazine 10 from the opening to the outer peripheral surface of the substrate 11 at the starting end 14 of the electronic component accommodating groove 13. The parts 3 are placed in the magazine 10 while being aligned in a fixed direction on the aligning parts feeder.
When the electronic components 3 are fully loaded into the electronic component housing groove 13 in this way, the electronic component housing groove 13 is filled with the electronic components 3. Starting end 1 of groove 13
The opening to the outer peripheral surface of the substrate 11 in 4 is
By plugging with a removable plug or a removable adhesive tape, the electronic component 3 in the spiral electronic component storage groove 13 remains in the same position as when it was loaded, or in other words, the position changes. They are arrested without even doing anything.

In order to take out the electronic component 3 packed in the magazine 10 in this way, this magazine 1
0 is attached to a vibrating parts feeder, and the electronic component 3 is placed in the spiral electronic component housing groove 13.
However, the starting end 14 of the electronic component housing groove 13 is
By vibrating as if moving toward
The electronic components 3 are fed out one by one in a line from the opening at the starting end 14 of the electronic component storage groove 13, and the loading and unloading of the electronic components 3 into the magazine 10 is performed in a conventional manner. This can be done extremely easily using a commonly used vibrating parts feeder, and the magazine 10 can be used many times.

In addition, although the above-mentioned embodiment shows the case where there is only one spiral electronic component housing groove 13, the number of spiral electronic component housing grooves 13 is not limited to one, but may be multiple. Furthermore, one or more spiral electronic component housing grooves 13 may be provided on both the upper and lower surfaces of the substrate 11.

Furthermore, if the cover plate 12 attached to the surface of the substrate 11 so as to close the electronic component housing groove 13 is made of a transparent material, the electronic component 4 housed in the spiral electronic component housing groove 13 can be It is convenient to be able to see it all the time. Furthermore, by setting the width and depth of the electronic component housing groove 13, a cylindrical electronic component can be accommodated with its axis oriented in the longitudinal direction of the electronic component housing groove 13. It goes without saying that the electronic component can be accommodated with its axis oriented perpendicular to the longitudinal direction of the electronic component accommodation groove 13, and furthermore, it can be applied to rectangular parallelepiped-shaped electronic components. do not have.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a conventional magazine for electronic components, FIG. 2 is a sectional view taken from the side of FIG. 1, FIG. 3 is a partially cutaway plan view showing an embodiment of the present invention, and FIG. FIG. 3 is a cross-sectional view taken from FIG. 3; DESCRIPTION OF SYMBOLS 10... Magazine, 11... Board, 12... Cover plate, 13... Groove for accommodating electronic components, 14... Starting end of groove for accommodating electronic components, 3... Electronic components.

Claims (1)

[Scope of utility model registration request] At least one groove for accommodating an electronic component is carved into the surface of a disk-shaped substrate having an appropriate thickness so as to extend in a spiral shape from a starting end at the outer periphery of the substrate to a terminal end at the center of the substrate. Then, the starting end of the electronic component housing groove is opened on the outer circumferential surface of the substrate, while a cover plate is placed on the surface of the substrate.
1. A leadless electronic component magazine, characterized in that the electronic component housing groove is mounted so as to close an opening to the top surface of the substrate.