JPH02270364A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable the highly dense mounting of semiconductor chips on a circuit board by a method wherein two or more semiconductor device assemblies provided with a semiconductor chip whose pad and lead are connected together through a wire respectively are arranged providing a certain space between them respectively, and these semiconductor device assemblies are sealed off with a package of plastic or the like. CONSTITUTION:Two or more semiconductor device assemblies 5, in which the pad of a semiconductor chip 3 and a lead 2 of a lead frame are connected together through a wire respectively, are arranged providing a certain space between them, and these semiconductor device assemblies 5 are enveloped in a package 6 of plastic or the like. For instance, two or more pads provided to the semiconductor chips 3 and the corresponding leads 2 are connected together through the wires 4 to constitute a semiconductor device assembly 5. Two semiconductor device assemblies 5 formed as above are arranged in two layers providing a proper space vertically between them and sealed off with a package 6 of epoxy resin or the like to form a semiconductor device. By this setup, a space between semiconductor chips becomes small, so that the semiconductor chips can be more densely mounted on a circuit board by the rate of the reduced space.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor device, and more particularly, to a semiconductor device for high-density packaging on a circuit board or the like.

[Prior Art] FIG. 8 is a perspective view showing a conventional semiconductor device, and FIG. 9 is a sectional view of the same semiconductor device. In the figure, 1 is a die pad supported by a support arm (not shown) of a lead frame;
3 is a plurality of leads protruding from a lead frame, 3 is a semiconductor chip attached to the die pad 1 with adhesive or the like, and the plurality of pads provided on the semiconductor chip 3 and each corresponding lead 2 are respectively A semiconductor device assembly 5 is formed by connecting with wires 4.

Semiconductor device assembly 5 beam board 2 formed as described above
A portion of the die pad 1 is sealed with a plastic package 6 such as epoxy resin. Then,
The base end side of the lead 2 is cut and separated from the lead frame, and the semiconductor device is completed.

[Problems to be Solved by the Invention] In the conventional semiconductor device as described above, a plurality of pads provided on one semiconductor chip 3 and each corresponding inner lead 2 are connected by wires 4, and the semiconductor device Since an assembly 5 is formed and this semiconductor device assembly 5 is sealed with a plastic package 6, one semiconductor chip 3 is sealed in one package 5, which is a feature of recent electronic equipment. With miniaturization, efforts are being made to increase the density of semiconductor chips themselves, such as by narrowing the distance between the wires 4, in order to achieve higher density mounting of semiconductor chips on circuit boards, but there are limits to some extent. When mounting a plurality of semiconductor devices on a plurality of circuit boards, there has been a problem in that it is difficult to mount the semiconductor chips on the circuit board at high density.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain a semiconductor device that can be mounted on a circuit board with high density.

[Means for Solving the Problems] A semiconductor device according to the present invention includes a plurality of semiconductor device assemblies in which pads and leads of a semiconductor chip are connected by wires, and these semiconductor device assemblies are arranged at intervals. is sealed in a plastic package.

[Function] In the present invention, since a plurality of semiconductor device assemblies in which semiconductor chips and leads are connected by wires are sealed in a package made of plastic or the like, when a plurality of semiconductor devices are mounted on a board, it is not necessary to use a single conventional package. Compared to a semiconductor device in which one semiconductor chip is sealed in a semiconductor device, the spacing between semiconductor chips is narrower, which makes it possible to mount semiconductor chips on a circuit board at a higher density, reducing the sealing cost per semiconductor chip. It also goes down.

[Embodiment] FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view of the same embodiment. In the figure, 1 indicates die pads supported by support arms (not shown) of lead frames, 2 indicates three leads protruding from each lead frame, and 3 indicates adhesive on each die pad 1. It is a semiconductor chip attached by etc. semiconductor chip 3
A plurality of pads provided on the pads and each corresponding lead 2 are connected by wires 4 to form one semiconductor device assembly 5.

Two semiconductor device assemblies 5 thus formed are arranged in two layers with an appropriate distance in the vertical direction, and these two semiconductor device assemblies 5 are sealed with a package 6 made of epoxy resin, for example. A semiconductor device is obtained.

In the semiconductor device configured as described above, two semiconductor chip assemblies 5 formed by connecting the semiconductor chip 3 and the leads 2 with wires 4 are sealed in one package 6, so that the circuit board For example, considering the case where two semiconductor chips 3 are mounted on a circuit board, in the conventional method, two semiconductor devices in which one semiconductor chip 3 is sealed in one package 6 are mounted on a circuit board. Then, one semiconductor device, in which two semiconductor chips 3 are sealed in one package 6, is mounted on a circuit board. Therefore, in this case, the distance between the semiconductor chips 3 is narrower in this embodiment than in the conventional one, and the semiconductor chips 3 can be mounted with higher density on the circuit board accordingly. Furthermore, the sealing cost per 3 semiconductor chips is also reduced. Furthermore, by using one semiconductor device in which two semiconductor chips 3 are sealed in one package 6, the circuit design of the electronic device can be simplified, and reliability is also improved by reducing the number of connected parts.

FIG. 3 is a perspective view showing another embodiment of the invention.

In this embodiment, a plurality of semiconductor device assemblies 5 formed by connecting a plurality of pads provided on a semiconductor chip 3 and corresponding leads 2 with wires 4 are stacked in a multilayer structure with appropriate intervals in the vertical direction. A plurality of semiconductor device assemblies 5 are placed in one package 6 and sealed in one package 6.

In this embodiment, compared to the embodiment shown in FIG.
The sealing cost per 3 semiconductor chips is also decreasing.

FIGS. 4 to 6 are sectional views showing other embodiments of the present invention. All of these embodiments are semiconductor devices in which two semiconductor chips 3 are sealed in one package 6, and the protruding positions of the leads 2 protruding from the package 6 are different from each other. That is, in the case shown in FIG. 4, two leads 2 protrude in the same direction from one side of the package 6, and in the case shown in FIG. 2
In the case shown in FIG. 6, the leads 2 protrude from one side and the lower surface of the package 6, respectively.

In this way, by making the protruding position of the lead 2 different depending on the semiconductor device, a degree of freedom is given to the circuit design of the electronic device.

FIG. 7 is a sectional view showing still another embodiment of the present invention, which is a semiconductor device in which four semiconductor chips 3 are sealed in one package. In this embodiment, the leads 2 protrude from the upper and lower surfaces of the package 6, as well as from the left and right sides, respectively, thereby providing greater freedom in circuit design of electronic equipment.

[Effects of the Invention] As explained above, this invention seals a plurality of semiconductor device assemblies in which semiconductor chips and leads are connected by wires in a package made of plastic, etc. Compared to a semiconductor device in which semiconductor chips are encapsulated, the distance between the semiconductor chips is narrower when multiple semiconductor chips are mounted on a circuit board, allowing high-density mounting of semiconductor chips on a circuit board, and a reduction in the number of semiconductor chips per piece. This has the effect of reducing the sealing cost. Furthermore, by using a semiconductor device in which a plurality of semiconductor chips are sealed in one package, the circuit design of electronic equipment can be simplified, and the number of connected parts can be reduced, thereby improving reliability.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing one embodiment of the invention, FIG. 2 is a sectional view of the same embodiment, FIG. 3 is a perspective view showing another embodiment of the invention, FIGS. 6 is a sectional view showing another embodiment of the invention, FIG. 7 is a sectional view showing still another embodiment of the invention, FIG. 8 is a perspective view of a conventional semiconductor device, and FIG. 9 is a sectional view showing another embodiment of the invention. is a cross-sectional view of the same semiconductor device. DESCRIPTION OF SYMBOLS 1... Die pad, 2... Lead, 3... Semiconductor chip, 4... Wire, 5... Package.

Claims (1)

[Claims] A method in which multiple semiconductor device assemblies are arranged at intervals, each consisting of a pad of a semiconductor chip and a lead of a lead frame connected by a wire, and these multiple semiconductor device assemblies are sealed in a package made of plastic or the like. A semiconductor device characterized by: