JPH0227070B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus that is mounted on a solder tank and supplies solder balls directly to the solder tank.

The inventor of the present application first applied solder with a diameter of 5 mm to 50 mm.
We proposed that the solder be formed into a spherical shape and that its rolling properties be used to supply solder to the solder bath. The present invention is an extension of that proposal (Japanese Patent Application No. 57-7539), and aims to provide a device for smoothly and reliably feeding out solder balls from a ball storage tank.

In order to achieve the above object, the device of the present invention includes a ball storage tank, at least two stages of alternately oppositely inclined bottom plates disposed inside the ball storage tank, and an alignment member provided at the lowest stage, and also a ball storage tank. and a gate member provided at the lower end of the lower bottom plate.The alignment member arranges the solder balls in an orderly manner in each row without stacking them one above the other, and the gate member arranges the solder balls at the forefront of each row from the subsequent solder balls. is characterized by being separated and sequentially allowed to fall under its own weight.

The alignment member consists of bar materials such as round bars, half-round bars, rails, etc. arranged at a pitch equal to or slightly larger than the diameter of the solder balls, and is the bottom plate itself at the bottom. In order to prevent the solder balls from overlapping above and below, a ceiling plate may be provided on the bottom plate of the lowest stage, and the distance between the bottom plate and the ceiling plate may be equal to or slightly larger than the diameter of the solder balls. When a ceiling plate is not provided on the bottom plate of the lowest stage, it is desirable that the slope of the second bottom plate from the bottom is made gentle so that the solder balls do not overlap vertically on it. The gate member may be one in which partition pieces are inserted alternately before and after the solder ball at the front end, or may be one that receives the solder ball at the front end and moves to the delivery position. Further, the gate member may be shaped like a star wheel.

The apparatus of the present invention will be explained based on embodiments shown in the drawings. As shown in FIG. 1, the interior of the ball storage tank 1 is partitioned by bottom plates 2, 3, and 4 that extend in a dogleg shape between three side walls 1a and 1b. Falling paths 2a, 3a each having a width slightly larger than the diameter of the solder ball 10 are provided between the lower edges of the bottom plates 2, 3 of the upper and middle tiers, excluding the lower tier, and the side walls 1a, 1b. The upper and middle bottom plates 2 and 3 are made of flat plate materials, while the bottom plate of the lower step is made of round bar material. The solder balls 10 on the upper bottom plate 2 are stacked vertically in several layers, but since the middle and lower bottom plates 3 and 4 have a gentle slope, the solder balls 10 are stacked vertically on the middle and lower bottom plates 3 and 4. There is no overlap. A solenoid 5 is fixed to the outer surface of the ball storage tank 1. A rod 6 that reciprocates up and down by electromagnetic action hangs down from the solenoid 5. One end of the lever 8 of the gate member 7 is hooked into the hook groove (or hole) of the rod 6. The other end of the lever 8 is fixed to the rotating shaft 18 of the gate member 7, as shown in FIG.
As shown in FIGS. 1 and 2, a ball tube 9 for discharging solder balls 10 is attached to one corner of the bottom of the ball storage tank 1. The discharge tube 9 is connected to the outlet of the chute 17 shown in FIGS. 2 and 3.

As shown in FIG. 2, the bottom plate 4 of the lower stage of the ball storage tank 1
are made of round bars arranged at a pitch slightly larger than the diameter of the solder balls 10, and the rear end of the round bars is supported by a support member 29. The front end of each round bar is supported by two pairs of guide rolls 11, 12, 13, 14, and the front and rear partition pieces 15, 16 of the gate member are arranged between these guide rolls so as to be able to rise and fall freely. A chute 17 for receiving solder balls in front of the bottom plate 4 made of round bar material
is disposed, and the solder ball 10 is discharged from the ball tube 9 on one side of the chute 17.

As shown in FIGS. 3 and 4, the gate member 7
consists of a rotating shaft 18 bearing on the side plate of the ball storage tank 1, a rocking plate 19 integrally fixed to the rotating shaft, and partition pieces 15 and 16 pivotally attached to both ends of the rocking plate. The lever 8 moves up and down in response to the operation of the solenoid 5 (FIG. 1), causing the rotating shaft 18 to swing. As the rotating shaft 18 swings, the front and rear partition pieces 15, 16 are guided by the guide rolls 11, 12, 13, 14 and alternately protrude. The partition pieces 15 and 16 have comb-shaped recesses into which the round bars of the bottom plate 4 fit, and the partition pieces 15 and 16 at the front end
When the solder balls 10 protrude, the solder balls 10 in the front row are prevented from falling, but as the partition plate 16 on the rear side protrudes, they roll and fall into the chute 17.

Solenoid 5 is connected to a level switch (not shown), and when supplying solder balls directly to the solder tank,
When the liquid level in the solder tank drops below a predetermined height,
When replenishing the ball lifter with solder balls, when the number of solder balls in the hopper of the ball lifter decreases below a certain number,
Each works. 10 solder balls equivalent to at least one day's worth of solder balls are placed on the upper bottom plate 2 of the ball storage tank 1.
However, since the middle bottom plate 3 has a gentle slope, the solder balls 10 roll on the middle bottom plate 3 without overlapping vertically and fall to the lower level. Since the round bars 4 on the lower bottom plate are arranged at intervals slightly larger than the diameters of the solder balls 10, the solder balls 10 roll on the bottom plate 4 while being regularly aligned. the result,
The number of solder balls 10 discharged from the ball storage tank by one operation of the solenoid 5 matches the number of rows. In this way, the device of the present invention can accurately determine the amount of solder to be supplied to the solder tank, making it possible to maintain the liquid level in the solder tank with high precision.

When the bottom plate is made into two layers, upper and lower, as shown in FIG. It is desirable to increase the number to one level.
Also, assemble the bottom plate 4 from the semi-round bar 21 and the flat plate 22,
As shown in FIG. 6, the length of the semi-round bar 21 may be changed from the center to the left and right to guide the solder ball 10 so as to flow from the center to the left and right.

The gate member 7 in FIG.
and a guide 24 that guides the lifting and lowering of the separation plate.
A spring 25 that pulls up the separation plate 23 and a ball storage tank 1
The solenoid 5 is fixed inside the solenoid 5 and operates to push up the separation plate 23. The thickness of the separation plate 23 is slightly larger than the diameter of the solder ball 10. When the separation plate 23 is lowered, the delivery hole 27 of the separation plate communicates with the outlet 28 of the front plate of the ball storage tank, but the separation plate 23
, the delivery hole 27 of the separation plate 23 is connected to the bottom plate 4.
and communicates with the gap between the ceiling plate 20. Therefore, when the separation plate 23 rises, the solder balls 10 in the front row on the bottom plate enter the transfer hole 27, and when the separation plate 23 descends, the solder balls 10 in the transfer hole 27 reach the solder tank from the discharge port 28. Injected into the distribution pipe.

Since the solder balls 10 regularly roll between the flat plate 22 and the ceiling plate 20 and line up in a line in the delivery hole 27, the number of solder balls discharged each time the separation plate 23 is raised and lowered is kept constant. Therefore, like the apparatus of the previous embodiment, the embodiment of FIG. can be held with high precision.

[Brief explanation of drawings]

FIG. 1 is a side sectional view of an apparatus according to an embodiment of the present invention;
Figure 2 is a view of the lower bottom plate in Figure 1 seen from a direction perpendicular to Figure 1, Figure 3 is an enlarged side sectional view of the gate member in Figure 1, and Figure 4 is along the - line in Figure 3. 5 and 6 are views corresponding to FIGS. 1 and 2 of another embodiment, and FIG. 7 is a cross-sectional view of the bottom plate of FIG. 2. 1: Ball storage tank, 2, 3, 4: Bottom plate, 5: Solenoid (driving member), 7: Gate member, 11, 12,
13, 14: Guide roll, 15, 16: Partition piece,
18: Rotating shaft, 19: Swing plate, 20: Ceiling plate, 2
3: Separation plate, 27: Delivery hole, 28: Discharge port.

Claims (1)

[Scope of Claims] 1. A ball storage tank 1 in which solder balls of approximately the same diameter are placed, and both side walls 1a and 1b of the ball storage tank are alternately continuous in a dogleg shape, and the interior is divided into three upper and lower parts. Bottom plates 2, 3, and 4 partitioning into tiers or more, drop paths provided between the lower edges 2a and 3a of each bottom plate except the bottom plate 4 and the side plates, and solder balls in the front row on the bottom plate of the bottom tier. The device is equipped with a gate member 7 for discharging solder balls in a horizontal row while separating them from the next row of solder balls, and a drive member 5 for driving the gate member, wherein the bottom plate at the lowest stage is perpendicular to the direction of inclination. It consists of a plurality of rods 4, 21 whose sloped surfaces are partitioned in the direction by pitches that are the same as or slightly larger than the diameter of the solder ball, and the slopes of the bottom plates at least at the lowest stage and the second stage from the bottom are made gentle, A solder ball supply device characterized in that the solder balls roll on the solder balls without overlapping vertically. 2. The solder ball supply device according to claim 1, wherein the bottom plate 4 at the lowest stage is composed of a plurality of round bars 4 arranged in the width direction of the ball storage tank 1. 3. The bottom plate 4 at the lowest stage is formed of bars 21 arranged on a flat plate 21 and a ceiling plate 20 provided above the bars, and the gap between the flat plate and the ceiling plate is set to be slightly smaller than the diameter of the solder ball. The solder ball supply device according to claim 1, characterized in that the solder ball supply device is set to a large size. 4 Rotating shaft 1 bearing gate member 7 on ball storage tank 1
8, a swing plate 19 fixed to the rotating shaft, front and rear partition pieces 15, 16 that are pivotally supported at both ends of the swing plate and extend upward, and guide rolls 11, 12, 13 that support the partition pieces. , 14, and the partition pieces are formed in a comb shape that can be protruded from between the round bars of the bottom plate, and when the rotating shaft is swung by a driving member, the front and rear partition pieces protrude alternately. The solder ball supply device according to claim 2, characterized in that the solder balls are received all at once and then rolled and dropped all at once. 5 The gate member 7 is formed of a separation plate 23 provided in contact with the front end of the bottom plate 4 and freely movable up and down, and a delivery hole 27 provided in the separation plate, the separation plate is moved up and down by the drive member 5, and the delivery hole is Claims characterized in that the separator is formed so as to receive the solder balls in the first row of the bottom plate when the separator plate is raised, and to roll and drop the accepted solder balls from the ball outlet of the ball storage tank when the separator plate is lowered. The solder ball supply device according to item 1.