JPH02275492A - Transparent light emission body - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a transparent light-emitting body, and particularly to a film-like transparent light-emitting body using a light-emitting diode suitable for decorative purposes such as illumination.

[Prior art] Light-emitting diodes are manufactured in the form of sheets or films (hereinafter referred to as "
collectively referred to as "film-like". ) Transparent light emitters arranged on a substrate have been conventionally used. In this case, if the wiring (lead wire) for feeding power to the light emitting diode is visible, the appearance will be poor, so the wiring is routed around the back side of the base material, so that the wiring is visible from the surface of the base material. It was necessary to find a way to prevent this from occurring.

[Problems to be Solved by the Invention] When the film-like base material is opaque, the wiring can be hidden by running it around the back side of the base material, but when the base material is transparent, the wiring can be hidden. Even if you route the wires around the back of the device, the routed wires will be completely visible. For this reason, in the past, a light emitting body in which light emitting diodes were arranged on a transparent film-like base material had a poor appearance and lacked practicality.

An object of the present invention is to solve the above-mentioned conventional problems and to provide a transparent light-emitting body which is formed by disposing light-emitting diodes on a transparent film-like base material and has an extremely excellent appearance.

[Means for Solving the Problems] The transparent light emitting body of the present invention includes a conductive layer having an appropriate pattern formed on the surface of a transparent film, and a conductive adhesive that emits light so that electricity is supplied through the conductive layer. The terminal portion of the diode is bonded to a conductive layer.

[Function] In the transparent light emitting body of the present invention, power is supplied to the light emitting diode through the conductive layer. Therefore, lead wires are not required.

The transparent light emitter of the present invention has extremely excellent transparency because everything except the light emitting diode and the conductive adhesive is made of a transparent material.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a transparent light emitter 1 according to an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view taken along line II--II in FIG. 1.

In Figure 1.2, a transparent light emitter 1 is a transparent film 2.
, a transparent conductive layer 3 formed in a predetermined pattern on the surface of the transparent film 2, and a light emitting diode 4 whose terminal portions 4a and 4b are bonded to the transparent conductive layer 3 with a conductive adhesive 5. We are prepared.

In this embodiment, a first conductive layer 3A as a transparent conductive layer 3 to which one terminal 4a of a light emitting diode is connected;
A second conductive layer 3B is formed to which the other terminal 4b of the light emitting diode is connected. Naturally, the conductive layer 3A
, 3B are spaced apart from each other and configured to prevent current short-circuiting.

The transparent light emitting body 1 configured in this manner has no lead wires and has an extremely good appearance. Also,
Since the components other than the light emitting diode 4 and adhesive 5 are made of transparent materials, the overall transparency is extremely high. It is preferable to use a highly transparent adhesive as the adhesive, but since the amount used is small, a less transparent or opaque adhesive may also be used.

In the above embodiment, the conductive layers 3A and 3B are formed such that one end thereof reaches the edge of the transparent film 2. With this configuration, when a lead wire is connected to the conductive layer 3, the lead wire is also present only at or near the edge of the film 2, so that it is not visible at all or is hardly visible, and the appearance is not good. becomes even better.

In addition, in the present invention, even if one end of the conductive layer extends to the vicinity of the edge of the transparent film, the lead wire is hardly visible.

In the above embodiment, there are two conductive layers 3 (3A).

3B) However, in the present invention, three or more systems of conductive layers may be formed. In this case, when the third conductive layer (the illustrated path) is represented by 30, for example, Any two systems of the first to third conductive layers 3A to 3C are electrically connected to the positive electrode of the power source, and the remaining one system is electrically connected to the negative electrode of the power source. Then, one of the terminals 4a and 4b of the light emitting diode 4 is connected to the conductive layer on the positive electrode side, and the other is connected to the conductive layer on the negative electrode side, and any two of the conductive layers are electrically connected to the negative electrode side of the power source. , it is clear that the remaining one system may be electrically connected to the positive electrode side of the power supply. Even if four or more systems of conductive layers are formed, one or more systems may be electrically connected to the positive electrode of the power source, and the remaining one or more systems may be electrically connected to the negative electrode of the power source.

In the present invention, for example, a transparent insulating layer may be formed on the conductive layer connected to the negative electrode side of the power source, and a conductive layer connected to the positive electrode side of the power source may be formed thereon. Of course, the connection to this power source may be reversed.

In the present invention, examples of the transparent film 2 include polymer films such as polyethylene terephthalate, polyether sulfone, polyimide, and polyamide, but other materials may be used.

The transparent conductive layer 3 formed on such a transparent film 2 includes a transparent conductive layer made of metal and/or metal oxide,
Specifically, examples include transparent conductive layers made of metals such as gold and silver, and metal oxides such as indium oxide, tin oxide, and zinc oxide.

These metals and/or metal oxides are 1f! The metals may be used alone, or Z ffl or more may be used, and the metal may be an alloy. The transparent conductive layer 3 usually has a transmittance of 50% or more, preferably 70% or more.

To form the transparent conductive layer 2 on the surface of the transparent film 2,
A vapor phase method such as a vapor deposition method, a sputtering method, or an ion blating method can be employed, but other film forming methods such as liquid phase plating may also be used.

In order to make the transparent conductive layer have a predetermined pattern, the above-mentioned film formation method may be performed using a mask, but first, after forming the conductive layer on the entire surface of the transparent film, any pattern other than the desired pattern may be applied. It is preferable to remove the conductive layer in the region of . For this purpose, after printing a pattern intended for etching resist on the surface of a conductive layer formed on the entire surface of a transparent film using a screen printing method or the like, the metal and/or metal oxide layer of the exposed portion is printed. A method can be adopted in which the etching resist is dissolved in an acid aqueous solution or the like and then the etching resist is peeled off. In addition, photo methods using dry film or liquid photoresist can also be used to achieve the required precision and
It is selected as appropriate depending on conditions such as cost.

As the light emitting diode 4, a normal chip light emitting diode can be used. Although there is no particular restriction on its shape, it is preferable in terms of appearance that the terminal portions 4a and 4b are hidden under the light emitting diode main body 40 as shown in the figure, since the adhesive portion is not visible.

The conductive adhesive 5 only needs to have bonding strength and conductivity of a required level or higher. Normally, an adhesive containing a binder and a conductive filler is used, and the conductive filler is, for example, silver. , copper, nickel, tin, carbon, etc. Examples of the binder include epoxy resin, acrylic resin, phenol resin, and polyester resin.

In the present invention, in order to improve the adhesion between the transparent conductive layer 3 and the transparent film 2, a suitable anchor coat layer may be provided on the transparent film 2 in advance, and then the transparent conductive layer may be formed. Furthermore, an appropriate hard coat layer may be provided on the opposite surface of the transparent film 2 (the surface opposite to the surface on which the conductive layer 3 is formed) for the purpose of preventing scratches or the like.

In the present invention, a protective layer may be provided to protect the light emitting diode and the transparent conductive layer. This protective layer can be formed by laminating a protective film made of polymeric film, or by coating with a curtain coater or the like a liquid resin or a resin dissolved in a solvent that does not disturb the exterior material of the light emitting diode, and then removing the solvent. An example of this method is to harden the resin.

In the present invention, the pattern may be a pictorial or geometric pattern, as well as letters, figures, symbols, etc.

[Example] Examples showing specific manufacturing methods will be described below.

Example 1 The transparent light emitter 1 shown in FIGS. 1 and 2 was manufactured as follows.

That is, indium/tin oxide (hereinafter referred to as rlTOJ) was formed on the entire surface of one side of a biaxially stretched polyethylene terephthalate film 2 having a thickness of 100 μm by a sputtering method. The surface resistivity of this ITO layer is 5.9Ω
/It is the mouth. Further, the total light transmittance of the ITO layer and film 2 was 84%. Etching resist (NAZ-DAR) was applied onto this ITO layer by screen printing.
228B1ack) was formed into the shape of the transparent conductive layer 3 shown in FIG. After the resist was cured, ITO in areas other than the resist areas was etched and removed using an etchant containing a mixture of ferric chloride and hydrochloric acid.

After this, the resist was removed with potassium hydroxide and IT
Completed the buttering of O.

This patterned transparent conductive layer 3A.

3B has a chip light emitting diode (ROHM S LM-12
5) Terminals 4a and 4b of 4 were adhered with room temperature curing conductive adhesive (Three Bond 3380) 5.

When lead wires were connected to the conductive layers 3A and 3B of the obtained transparent light emitter 1 and a DC 9V power source was connected, the light emitting diode 4 showed good light emission.

[Effects of the Invention] As described in detail above, the transparent light emitter of the present invention is a transparent light emitter with extremely good appearance, which is made of a transparent material except for the light emitting diode portion.

The transparent light emitting body of the present invention is extremely useful as an illumination material such as window illumination and illumination cover material, and provides a highly decorative light emitting material in which only the light emitting diode portion stands out due to light emission.

[Brief explanation of drawings]

FIG. 1 is a plan view of a transparent light emitter according to an embodiment of the present invention;
FIG. 2 is an enlarged cross-sectional view taken along line II--II in FIG. 1. DESCRIPTION OF SYMBOLS 1... Transparent luminous body, 2... Transparent film, 3... Transparent conductive layer, 4... Light emitting diode, 5... Conductive adhesive.

Claims (1)

[Claims] (1) A transparent film, a conductive layer formed on the surface of the transparent film in an appropriate pattern, and a light emitting diode whose terminal portion is bonded to the conductive layer with a conductive adhesive, A transparent light emitting body characterized by being able to supply power to a light emitting diode through a layer.