JPH0227564Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a bonding device for attaching and wiring an LED chip to a package connected to a lead terminal in the process of manufacturing an LED digital display.

[Conventional technology]

Conventionally, the die bonding equipment that attaches the chip to the package and the wire bonding equipment that connects the chip and the lead terminals have been separate devices, and a large number of packages are carried into the die bonding equipment via a magazine and the die bonding equipment is attached to the die bonding equipment. The bonded package is put back into the magazine and transported to the next wire bonding device, and the processed package is collected back into the magazine and taken out.

[Problem that the invention attempts to solve]

However, since it is necessary to manually load and unload the magazine twice before and after each bonding device, it is a heavy burden on the workers, and the number of devices that each worker can handle is limited, which reduces productivity. It was difficult to improve the production capacity. Furthermore, since there are many handling points by workers, there are many opportunities for the workpiece to be touched by hands, increasing the possibility of contamination, which is not desirable in terms of maintaining quality.

This idea can improve productivity and production volume by reducing the number of handling points required by workers, is also effective in stabilizing quality, and enables efficient continuous processing. This was an attempt to provide a bonding device.

[Means to solve the problem]

The LED bonding device of the present invention includes a magazine stocker on the supply side that stores a magazine in which elongated package units each having a plurality of unit packages attached to a group of lead terminals connected in a frame are housed in parallel, and a magazine stocker on the supply side. A transfer line that takes out package units one by one from a magazine and transfers them in a line, and
A die bonding mechanism that joins LED chips; a paste cure that solidifies the die bonding paste while transporting the package units after die bonding in a line; and a paste cure that solidifies the die bonding paste while transporting the package units after the die bonding process in a line, and a package unit that is taken out from the end of the paste cure in a direction perpendicular to its longitudinal direction. A buffer unit equipped with a rotary belt for transporting and storing and holding a plurality of package units in parallel, a transfer line for transferring package units taken out from the end of the buffer unit in a line, and a wire connected to the package units on this transfer line. The present invention is characterized in that it includes a wire bonding mechanism that performs bonding processing, and a magazine stocker that sequentially collects bonded package units that have been wire bonded and transported in parallel in a magazine.

[Effect]

According to the above configuration, there are only two handling locations for the operator: the magazine stocker on the supply side and the magazine stocker on the unloading side. In addition, the die bonding-treated package unit solidifies the die bonding paste with the paste cure installed in front of the buffer unit, making it possible to prevent the LED chip bonding position from being misaligned due to external factors. .

Furthermore, even if the unloading from the die bonding mechanism is irregularly interrupted, since the package unit is held in the buffer unit, the supply of the package unit to the wire bonding mechanism will not be interrupted. In addition, the buffer unit is configured to store and hold the package units transferred from the paste cure in parallel and send them out to the wire bonding mechanism in the order in which they were transferred (so-called first-in-first-out method). The package unit is less susceptible to external influences such as dust. Even if unloading from the die bonding apparatus is irregularly interrupted, the package unit is held in the buffer unit, so the supply of workpieces to the wire bonding mechanism will not be interrupted.

〔Example〕

Next, as an embodiment of the present invention, a bonding apparatus used in a manufacturing line for LED digital displays as shown in FIG. 3 will be explained based on an illustrative drawing.

FIG. 1 is a schematic diagram showing the overall structure of the bonding device, and FIG. 2 is a plan view of the device. or,
FIG. 4 shows a package unit 1 as a workpiece to be supplied to this apparatus.

This package unit 1 has a plurality of unit packages 4 attached to three groups of lead terminals connected from a pair of frames 2, 2, and is configured as an elongated frame with an inverted U-shape when viewed from the front. ing.
In addition, between each unit package 4, both frames 2,
A reinforcing tie bar 5 is installed to connect the two.

As shown in FIG. 5, the package unit 1 is carried while being housed in a magazine 6 that is open to the left and right in a parallel arrangement. Incidentally, a large number of grooves 7 into which the frame 2 is inserted are formed on the bottom surface of the magazine 6, so that the parallel package units 1 can slide left and right without coming into contact with each other.

The LED bonding device of this example has the first
As shown in FIG. 2 and FIG. Side magazine stocker 1
9.

Specifically, a magazine stocker 8 for stacking and loading magazines 6 in which unprocessed package units 1 are stored in parallel as described above is provided at one end of the device (left end in the figure), and the magazines 6 are placed on the side of the magazine stocker 8. from 1
A transfer line 9 is provided for guiding and transferring the package units 1 taken out one by one in a line. At the starting end of this transfer line 9, an LED is connected to a wafer 11 on a movable table 10 that can be moved back and forth and left and right.
A die bonding mechanism 12 is provided for taking out chips one by one and bonding them to predetermined positions on each unit package 4 via paste.

Further, a paste cure 14 is installed following the transfer line 9 to solidify the die bonding paste while locking the package unit 1 after the die bonding process with a feed mechanism 13 that reciprocates in forward and reverse directions and feeding it sequentially. .

A buffer unit 16 is provided on the terminal side of the paste cure 14 to temporarily store and wait a predetermined amount of the package unit 1 sent therefrom. The buffer unit 16 includes a pair of rotating rollers and an endless rotating belt 15 wound between the rotating rollers. It is designed to be rotated. That is, the package unit 1 sent out from the paste cure 14 is moved by the rotating belt 15.
As the rotary belt 15 rotates, it is sequentially fed from the starting end to the terminal end of the rotary belt 15, and a predetermined amount of package units 1 are mounted and held in parallel on the rotary belt 15 in a direction perpendicular to its longitudinal direction. . Moreover, in the buffer unit 16 of this embodiment, the package units 1 transferred from the paste cure 14 are arranged in parallel and sent to the wire bonding mechanism 18 side in the order in which they were transferred.

A transfer line 17 is provided on one side of the terminal end of the buffer unit 16 for taking out the package units 1 one by one and transferring them in a line, and a wire bonding mechanism 18 is provided on this line 17.

Further, at the end of the transfer line 17, there is a magazine stocker 19 for sequentially collecting the packages 1' that have undergone the bonding process in a collection magazine 6' having the same configuration as the supply magazine 6 in a front and back parallel manner. is provided.

[Effect of idea]

As explained above, the bonding device according to the present invention enables die bonding and wire bonding to be performed in a series of package unit transfer lines, so that manual handling is only required to load the magazine into the magazine stocker on the supply side and to load the magazine on the unloading side. The magazine can now only be taken out from the stocker, and by reducing the number of handling points, it is possible to increase the number of machines handled by one worker, thereby increasing productivity and production volume.

In addition, since there are fewer opportunities for manual contact, contamination and the like are reduced, which is effective in stabilizing quality.

In addition, since the die bonding paste of the package unit after the die bonding process is actively solidified with a paste cure before the next process, it prevents the LED chip from shifting due to pressure in the wire bonding mechanism, for example. Can be done.

Furthermore, since a buffer unit is interposed between the die bonding mechanism and the wire bonding mechanism, the wire bonding process can be performed continuously without being affected by changes in the processing speed of the die bonding mechanism, and there is no need to wait for the workpiece. Without this, work efficiency can be improved.

Moreover, in the buffer unit described above, the package units transferred from the paste cure are stored and held in parallel in the order in which they are transferred, and are sent out to the wire bonding mechanism in the order in which they are transferred. It is less susceptible to external influences and is effective in stabilizing quality in this respect.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the overall configuration of the device of the present invention;
2 is a plan view of the device, FIG. 3 is a perspective view of the completed LED digital display, FIG. 4 is a perspective view of the package unit, and FIG. 5 is a perspective view of stacked magazines. 1...Package unit, 2...Frame,
3...Lead terminal group, 4...Unit package,
6, 6'... Magazine, 9, 17... Transfer line,
12...Die bonding mechanism, 18...Wire bonding mechanism.

Claims (1)

[Claims for Utility Model Registration] Supply-side magazine stocker 8 that stores a magazine 6 in which elongated package units 1 each having a plurality of unit packages 4 attached to three groups of lead terminals connected to each other in a frame 2 are stored in parallel. A transfer line 9 that takes out the package units 1 one by one from the magazine 6 of the magazine stocker 8 and transfers them in a line;
Die bonding mechanism 1 for bonding LED chips
2, a paste cure 14 for solidifying the die bonding paste while transporting the package units 1 after the die bonding process in a line; and a paste cure 14 for solidifying the die bonding paste while transporting the package units 1 after the die bonding process in a line; A buffer unit 16 equipped with a rotating belt 15 for storing and holding a plurality of package units 1 in parallel, a transfer line 17 for transferring package units 1 taken out from the end of the buffer unit 16 in a line, and a transfer line 17 on the transfer line 17. Package unit 1
A wire bonding mechanism 18 that performs wire bonding processing on the wire bonding process, and a magazine stocker 19 that sequentially collects and collects bonded package units 1' that have been wire bonded and transferred in parallel in a magazine 6'. Bonding equipment for LED.