JPH0227575Y2 - - Google Patents
Info
- Publication number
- JPH0227575Y2 JPH0227575Y2 JP8674083U JP8674083U JPH0227575Y2 JP H0227575 Y2 JPH0227575 Y2 JP H0227575Y2 JP 8674083 U JP8674083 U JP 8674083U JP 8674083 U JP8674083 U JP 8674083U JP H0227575 Y2 JPH0227575 Y2 JP H0227575Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- circuit boards
- notch
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 description 11
- 230000000694 effects Effects 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【考案の詳細な説明】
〔技術分野〕
本考案はタイマ等の小型電子機器に用いるプリ
ント基板の実装構造に関するものである。[Detailed Description of the Invention] [Technical Field] The present invention relates to a mounting structure of a printed circuit board used in small electronic devices such as timers.
第1図は従来のプリント基板の実装構造を示し
ており、図において水平に配置した第1のプリン
ト基板1の端部に切欠2を設け、このプリント基
板1に対して略直交する方向に配置された第2の
プリント基板3の上端部に設けた突出部4を切欠
2下方から嵌込んで両プリント基板1,3は立体
的に配置されている。上記突出部4は片面にはプ
リント基板1の接続パターン5に対応した接続パ
ターン6を設けており、この接続パターン6は切
欠2の縁部に臨んだ接続パターン5に接合した状
態で接続パターン5に半田付けされ、プリント基
板1の回路とプリント基板3の回路とを電気的に
接続するためのものである。
FIG. 1 shows a conventional printed circuit board mounting structure, in which a notch 2 is provided at the end of a first printed circuit board 1 placed horizontally in the figure, and the notch 2 is placed in a direction substantially perpendicular to this printed circuit board 1. A protrusion 4 provided at the upper end of the second printed circuit board 3 is fitted into the notch 2 from below, so that both the printed circuit boards 1 and 3 are arranged three-dimensionally. The protrusion 4 is provided with a connection pattern 6 corresponding to the connection pattern 5 of the printed circuit board 1 on one side, and this connection pattern 6 is connected to the connection pattern 5 facing the edge of the notch 2. This is to electrically connect the circuits on the printed circuit board 1 and the circuits on the printed circuit board 3.
ところでこのような状態でプリント基板1,3
同士を半田付けしたプリント基板の実装構造で
は、補修等でプリント基板1,3上の一部の電子
部品を交換する場合、或いは一部のプリント基板
ごと交換する場合、その構造上必ずプリント基板
間の半田付けを外してプリント基板同士を分離す
る必要があるが、上述のように接続パターン6と
5とを接合した状態で半田付けを行なう従来例で
は、接続パターン5と6とが基板端面まできてい
て密着した状態となつているため一度半田付けを
行なうと半田付けを外す場合に毛細管現象により
半田が完全に除去されず、この半田が除去されな
い状態でプリント基板を分離すると、接続パター
ン5,6に力が加わつて接続パターン5,6の銅
箔が基板より剥離してしまい、その結果信頼性を
失なつて再使用できないという欠点があつた。ま
た従来例では上述のように半田の除去が容易でな
いため、半田除去の際、パターンに熱や加わり過
ぎて、接続パターン5,6の剥離が生じ易くなる
という欠点も併せ持つている。 By the way, in this state, printed circuit boards 1 and 3
In the mounting structure of printed circuit boards that are soldered together, when replacing some of the electronic components on printed circuit boards 1 and 3 for repair etc., or when replacing part of the entire printed circuit board, it is necessary to connect the printed circuit boards due to the structure. It is necessary to separate the printed circuit boards by removing the soldering, but in the conventional example in which soldering is performed with the connection patterns 6 and 5 joined together as described above, the connection patterns 5 and 6 are connected to the edge of the board. Once soldered, the solder is not completely removed due to capillary action, and if the printed circuit board is separated without this solder being removed, the connection pattern 5 will be removed. , 6 causes the copper foil of the connection patterns 5, 6 to peel off from the substrate, resulting in a loss of reliability and the disadvantage that it cannot be reused. In addition, in the conventional example, as described above, it is not easy to remove the solder, so when removing the solder, too much heat is applied to the pattern, and the connection patterns 5 and 6 tend to peel off.
このような従来例の場合パターン剥離による損
傷のため、再使用回数はパターン面積にもよるが
紙フエノール基材のプリント基板の場合概ね1〜
2回が限度であつた。 In the case of conventional examples like this, due to damage caused by pattern peeling, the number of reuses depends on the pattern area, but in the case of paper phenol-based printed circuit boards, it is generally 1 to 1.
The limit was two times.
本考案は上述の欠点に鑑みて為されたもので、
その目的とするところは複数のプリント基板を立
体的に組立てるプリント基板の実装構造におい
て、プリント基板同士の半田付けのための接続パ
ターン相互間に機械的半田付強度を損なわない程
度の間隙を設けることにより、組立完成後の補修
等の際にプリント基板同士間の半田付けを容易に
外すことができるようにしたプリント基板の実装
構造を提供するにある。
This invention was created in view of the above-mentioned drawbacks.
The purpose of this is to create a gap between connection patterns for soldering between printed circuit boards that does not impair mechanical soldering strength in a printed circuit board mounting structure in which multiple printed circuit boards are assembled three-dimensionally. Accordingly, it is an object of the present invention to provide a printed circuit board mounting structure in which soldering between printed circuit boards can be easily removed during repairs after assembly is completed.
以下本考案を実施例によつて説明する。 The present invention will be explained below using examples.
第2図、第3図は一実施例を示しており、図中
1a,1bは上、下に平行配設されたプリント基
板で、これらプリント基板1a,1bの両端部に
は夫々切欠2が形成されている。3a,3bは
上、下端に形成した突出部4a,4bを前記の
上、下に相対する切欠2,2に嵌込んでプリント
基板1a,1bに対して直交方向に配設されたプ
リント基板である。しかしてこられプリント基板
1a,1b,3a,3bは枠状に立体結合さた実
装構造を呈することになる。7は端子台でこの端
子台7は係合突出部7aが切欠2に結合すると共
にプリント基板1aの下面に当接し、またプリン
ト基板1bの上面に載置し、更にプリント基板3
aの側端を結合して、プリント基板3aの表面側
に配置されている。プリント基板1a,1bと、
3a,3bとの電気的接続は接続パターン5,6
によつて行なうわけであるが、接続パターン5,
6の位置関係は第3図に示す構成となつている。 Figures 2 and 3 show one embodiment, and in the figures, 1a and 1b are printed circuit boards arranged in parallel at the top and bottom, and cutouts 2 are provided at both ends of these printed circuit boards 1a and 1b, respectively. It is formed. 3a and 3b are printed circuit boards arranged in a direction perpendicular to the printed circuit boards 1a and 1b by fitting protrusions 4a and 4b formed at the upper and lower ends into the upper and lower opposing notches 2 and 2, respectively. be. However, the printed circuit boards 1a, 1b, 3a, and 3b have a mounting structure in which they are three-dimensionally connected in a frame shape. Reference numeral 7 denotes a terminal block, and the engaging protrusion 7a of this terminal block 7 is coupled to the notch 2 and abuts on the lower surface of the printed circuit board 1a, and is placed on the upper surface of the printed circuit board 1b, and furthermore,
The side ends of a are connected to each other and placed on the front surface side of the printed circuit board 3a. Printed circuit boards 1a and 1b,
Electrical connections with 3a and 3b are made using connection patterns 5 and 6.
This is done using connection pattern 5,
6 has a positional relationship as shown in FIG.
つまり例えばプリント基板1aの切欠2に嵌込
んだプリント基板3aの突出部4の接続パターン
6とプリント基板1aの切欠2の奥端に臨んだ接
続パターン5との間に機械的半田付強度を損なわ
ない程度の間隙tを設けるようにプリント基板3
aの突出部4の嵌込み具合を設定している。実施
例では端子台7とプリント基板3aとの結合位置
関係と、切欠2に嵌合する端子台7の係合突出部
7aの両側に位置する面と切欠2の両側のプリン
ト基板3aの端面との当接とによつて定めてあ
る。 That is, for example, the mechanical soldering strength is lost between the connection pattern 6 of the protrusion 4 of the printed circuit board 3a fitted into the notch 2 of the printed circuit board 1a and the connection pattern 5 facing the inner end of the notch 2 of the printed circuit board 1a. The printed circuit board 3 should be
The fitting degree of the protruding portion 4 of a is set. In the embodiment, the connection positional relationship between the terminal block 7 and the printed circuit board 3a, the surfaces located on both sides of the engaging protrusion 7a of the terminal block 7 that fits into the notch 2, and the end surfaces of the printed circuit board 3a on both sides of the notch 2 are shown. It is determined by the contact between the
勿論第4図に示すように切欠2の奥端両側に段
部2aを設け、中央に突起2bを設け、これら段
部2aと突起2bとによつてプリント基板3aの
突出部4aの嵌合位置決めを行ない間隙tを確保
するようにしてもよい。この実施例の場合端子台
7を設けない側のプリント基板3bの突出部4a
の接続パターン6とプリント基板1a,1bの接
続パターン5との位置関係を定める手段として適
している。また中央の突起2bを無くし両側の段
部2a,2aだけで位置決めを行なうようにして
も勿論よい。 Of course, as shown in FIG. 4, step portions 2a are provided on both sides of the rear end of the notch 2, and a protrusion 2b is provided in the center, and the fitting position of the protrusion 4a of the printed circuit board 3a is determined by the step portions 2a and the protrusion 2b. Alternatively, the gap t may be secured by performing the following steps. In this embodiment, the protrusion 4a of the printed circuit board 3b on the side where the terminal block 7 is not provided
It is suitable as a means for determining the positional relationship between the connection pattern 6 of the circuit board 1a and the connection pattern 5 of the printed circuit boards 1a and 1b. Of course, the central protrusion 2b may be eliminated and positioning may be performed using only the stepped portions 2a, 2a on both sides.
更に第5図に示すようにプリント基板3aを貫
通する突起8を端子台7の係合突出部7aに設
け、この突起8を切欠2の奥端面に衝合させるこ
とにより係合突出部7aの先端面に接面させてい
るプリント基板3aの突出部4が係合突出部7a
と共に切欠2の奥端方向へ進まないように位置規
制するようにしてもよい。 Furthermore, as shown in FIG. 5, a protrusion 8 penetrating the printed circuit board 3a is provided on the engagement protrusion 7a of the terminal block 7, and by abutting the protrusion 8 against the rear end surface of the notch 2, the engagement protrusion 7a is closed. The protruding portion 4 of the printed circuit board 3a that is in contact with the tip end surface is the engaging protruding portion 7a.
At the same time, the position may be restricted so that it does not advance toward the rear end of the notch 2.
更に切欠2の奥端に臨んでいる接続パターン5
において第6図に示すように破線aで囲まれた枠
外の接続パターン5に半田レジストを施し、半田
の付かない間隙tを得るようにしてもよい。 Furthermore, connection pattern 5 facing the far end of notch 2
As shown in FIG. 6, a solder resist may be applied to the connection pattern 5 outside the frame surrounded by the broken line a to obtain a gap t where no solder is applied.
本考案は上述のように構成したプリント基板の
実装構造において、略直交するように定位置に配
置されたプリント基板同士の半田付け用の上記接
続パターン間に機械的半田付強度を損なわない程
度の間隙を設けてあるので、接続パターン間に施
された半田を溶融させると間隙により毛細管現象
が生じることなく、接続パターン間の半田を容易
に完全に分離させることができ、従つて接続パタ
ーンを形成する銅箔の基板からの剥離の損傷を与
えることなく、補修が可能となり、しかも半田の
分離が容易であることから作業効率も増すという
優れた利点を有し、本考案によればプリント基板
の再使用は上記の従来例構成と同条件にて概ね従
来例の3〜4倍である4〜6回は可能となるとい
う効果があり、また分離作業効率においては分離
したかどうかの確認が間隙の有無を見るだけで容
易に判断でき、しかも1度の半田溶融作業で完全
に分離できるので、従来例と比較して2倍以上の
向上が得られ、接続パターン数が、多くなればな
る程その効果は著しいものである。
In the printed circuit board mounting structure constructed as described above, the present invention provides a structure in which the mechanical soldering strength is not impaired between the connection patterns for soldering between the printed circuit boards arranged at fixed positions so as to be substantially perpendicular to each other. Since a gap is provided, when the solder applied between the connection patterns is melted, the solder between the connection patterns can be easily and completely separated without capillarity occurring due to the gap, thus forming the connection pattern. This invention has the excellent advantage that it is possible to repair the copper foil without causing any damage caused by peeling it off from the board, and it also increases work efficiency because the solder can be easily separated. It has the effect that it can be reused 4 to 6 times, which is approximately 3 to 4 times as many times as the conventional example, under the same conditions as the conventional configuration described above, and in terms of separation work efficiency, it is difficult to check whether separation has occurred at any time. It can be easily determined just by looking at the presence or absence of the solder, and it can be completely separated with a single solder melting operation, resulting in an improvement of more than twice that of the conventional example, and the larger the number of connection patterns, the more The effect is remarkable.
第1図は従来例の一部省略せる拡大斜視図、第
2図は本考案の一実施例の全体斜視図、第3図は
同上の要部説明用の一部省略せる拡大断面図、第
4図乃至第6図は夫々本考案の別の実施例の要部
説明用の一部省略せる拡大断面図であり、1a,
1b,3a,3bはプリント基板、5,6は接続
パターン、tは間隙である。
FIG. 1 is an enlarged perspective view of a conventional example with some parts omitted; FIG. 2 is an overall perspective view of an embodiment of the present invention; FIG. 4 to 6 are enlarged sectional views, partially omitted, for explaining the main parts of other embodiments of the present invention;
1b, 3a, 3b are printed circuit boards, 5, 6 are connection patterns, and t is a gap.
Claims (1)
配置して略直交するプリント基板に夫々設けられ
た接続パターン同士を半田付けしてプリント基板
同士を電気的に接続したプリント基板の実装構造
において、略直交するように定位置に配置された
プリント基板同士の半田付け用の上記接続パター
ン間に機械的半田付強度を損なわない程度の間隙
を設けて成るプリント基板の実装構造。 In a printed circuit board mounting structure in which a plurality of printed circuit boards are arranged in directions substantially orthogonal to each other and the connection patterns provided on each of the substantially orthogonal printed circuit boards are soldered to each other to electrically connect the printed circuit boards, substantially orthogonal A printed circuit board mounting structure comprising a gap that does not impair mechanical soldering strength between the connection patterns for soldering between printed circuit boards arranged at fixed positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8674083U JPS59191763U (en) | 1983-06-07 | 1983-06-07 | Mounting structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8674083U JPS59191763U (en) | 1983-06-07 | 1983-06-07 | Mounting structure of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59191763U JPS59191763U (en) | 1984-12-19 |
| JPH0227575Y2 true JPH0227575Y2 (en) | 1990-07-25 |
Family
ID=30216664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8674083U Granted JPS59191763U (en) | 1983-06-07 | 1983-06-07 | Mounting structure of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59191763U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109196961B (en) * | 2016-06-08 | 2021-03-16 | 三菱电机株式会社 | The connection structure of the printed circuit board |
-
1983
- 1983-06-07 JP JP8674083U patent/JPS59191763U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59191763U (en) | 1984-12-19 |
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